SM712 Series 600W Asymmetrical TVS Diode Array

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1 SM712 Series 6W Asymmetrical TVS Diode Array RoHS Pb GREEN Description The SM712 TVS Diode Array is designed to protect RS-485 applications with asymmetrical working voltages (-7V to from damage due to electrostatic discharge (ESD, electrical fast transients (EFT, and lightning induced surges. The SM712 can absorb repetitive ESD strikes above the maximum level specified in the IEC international standard without performance degradation and safely dissipate up to 19A of 8/2us induced surge current (IEC nd edition with very low clamping voltages. Pinout and Functional Block Diagram Features 2 7V 7V 1 RoHS compliant and lead-free ESD, IEC , ±3kV contact, ±3kV air EFT, IEC , 5A (5/5ns Lightning, IEC nd edition, 19A (t P =8/2μs Working Voltages: -7V to Low clamping voltage Low leakage current AEC-Q11 Qualified Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. 3 Applications RS-485 Fieldbus Modbus Profibus DMX512 RS-485 Application Example Security Systems AutomatedTeller Machines (ATMs Lighting Control - DALI Communication Equipments Additional Information RS-485 Port Receiver A B Datasheet Resources Samples IC SM712 GND 216 Littelfuse, Inc.

2 Absolute Maximum Ratings Symbol Parameter Value Units P Pk Peak Pulse Power (t p =8/2μs 6 W Peak Pulse Current (t p =8/2μs 19 A T OP Operating Temperature -4 to 125 C T STOR Storage Temperature -55 to 15 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Storage Temperature Range -55 to 15 C Maximum Junction Temperature 15 C Maximum Lead Temperature (Soldering 2-4s 26 C SM712 Electrical Characteristics (T OP =25ºC Parameter Symbol Test Conditions Min Typ Max Units 1μA, Pin3 to Pin1 or Pin2 7. V Reverse Standoff Voltage WM 1μA, Pin1 or Pin2 to Pin3 12. V Reverse Breakdown Voltage =1mA, Pin3 to Pin1 or Pin2 7.5 V =1mA, Pin1 or Pin2 to Pin V =7V 2 μa Leakage Current I LEAK = 1 μa =1A, t p =8/2µs, Pin 1 or Pin 2 to Pin 3 19 V I Clamp Voltage 1 PP =1A, t p =8/2µs, Pin 3 to Pin 1 or Pin 2 11 V V C =19A, t p =8/2µs, Pin 1 or Pin 2 to Pin 3 31 V =19A, t p =8/2µs, Pin 3 to Pin 1 or Pin 2 19 V Dynamic Resistance 1 R DYN (V C2 - V C1 / (2-1.5 Ω ESD Withstand Voltage 1 V ESD IEC (Contact Discharge ±3 kv IEC (Air Discharge ±3 kv Diode Capacitance 1 C I/O-GND Reverse Bias=V, f=1mhz; Pin 1 or Pin2 to Pin 3 75 pf Notes : 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Clamping Voltage vs Capacitance (pf Clamp Voltage (VC Pin 1 or Pin 2 to Pin 3 Pin 3 to Pin1 or Pin Bias Voltage (V Peak Pulse Current-IPP (A 216 Littelfuse, Inc.

3 Temperature TVS Diode Arrays (SPA Diodes Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P pk (kw Pulse Duration - tp (µs % of Rated Power Ambient Temperature - TA ( o C Pulse Waveform Product Characteristics 11% 1% 9% Lead Plating Lead Material PPF Copper Alloy Percent of 8% 7% 6% 5% 4% 3% 2% 1% % Time (μs Lead Coplanarity Substrate material Body Material.4 inches (.12mm Silicon Molded Epoxy Flammability UL 94 V- Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI Soldering Parameters Reflow Condition - Temperature Min (T s(min 15 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max 2 C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max T S(min t S Preheat t L Ramp-down Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L 6 15 seconds 25 time to peak temperature Time Peak Temperature (T P 26 +/-5 C Time within 5 C of actual peak Temperature (t p 2 4 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 26 C 216 Littelfuse, Inc.

4 Part Marking System Part Numbering System SM H T G 712 TVS Diode Arrays (SPA Diodes Series Working Voltage Number of Channels G= Green T= Tape & Reel Package H: SOT23-3 Ordering Information Part Number Package Marking Min. Order Qty. SM712-2HTG SOT Package Dimensions SOT23-3 C b 3 52B 1 2 e e1 D E1 A1 L1 E A Recommended Pad Layout P M P N Package SOT23-3 Pins 3 JEDEC TO-236 Millimeters Inches Min Max Min Max A A1 M b c D E N E e.95 BSC.38 BSC e1 1.9 BSC.75 BSC L1.54 REF.21 REF M N O.78.3TYP P.78.3TYP 216 Littelfuse, Inc.

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