The new product features are listed below and compared with the features of the existing IPC677C. The differences are highlighted in gray.

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1 The product features of the SIMATIC IPC677D in detail The new product features are listed below and compared with the features of the existing IPC677C. The differences are highlighted in gray. Product Name Platform SIMATIC IPC677D (new) Intel Xeon processor Intel Core i 4th generation SIMATIC IPC677C (current) Intel Core i 1st generation Order Number 6AV AV Available January 2014 now Fronts Processor 22" Touch (1920x1080) Planned for 2014 in variants with single and multi touch: 15" Touch 19" Touch 22" Touch Xeon processor E3-1268L v3 4 Cores, 8 Threads, 2.3 (3.3) GHz, TB, HT, VT-x, VT-d, AMT, 8 MB Cache Core i3-4330te 2 Cores, 4 Threads, 2.4GHz, HT, VT-x, 4-MB Cache Celeron G1820TE, 2 Cores, 2 Threads, 2.2 GHz, 2-MB Cache 12" Touch (800x600) 15" Touch (1024x768) 19" Touch (1024x768) 12" Key (800x600) 15" Key (1024x768) Core i7-620e, 2 Cores, 4 Threads, 2.5 (3.2) GHz, TB, HT, VT-x, VT-d, AMT, 4 MB Cache Core i3-330e, 2 Cores, 4 Threads, 2.13GHz, HT, VT-x, 3-MB Cache Celeron P4505, 2 Cores, 2 Threads, 1.86 GHz, 2-MB Cache Chipset Intel DH82C226 PCH Intel BD82QM57 PCH Main memory 2 GB or more DDR PC expandable to 16 GB 2 DIMM socket 1 GB or more DDR expandable to 8 GB 2 DIMM socket

2 ECC optional ECC optional Slots for expansions 2 PCI (185 / 185 mm) or 1 PCI / 1 PCIe x16 (185 / 185 mm) 2 PCI (290 / 185 mm) or 1 PCI / 1 PCIe x16 (290 / 185 mm) PCI Rev.2.3 PCIe Rev.2.1 and Rev3.0 PCI Rev.2.3 PCIe Rev.2.1 Graphics Graphic controller Intel HD 4x00 Graphics with Dynamic Intel HD Graphics with Dynamic Frequency, integrated in chipset Frequency, integrated in chipset Graphics memory up to 512 MB up to 256 MB (Shared Memory) (Shared Memory) Operating system without Windows XP No Prof. MUI Windows 7 Ultimate 32 Bit MUI Windows 7 Ultimate 64 Bit MUI Windows 8-2nd stage: mid /. Prof. 64 Bit Windows Embedded No Standard Bit on 8 GB Siemens CompactFlash (XPe) Windows Embedded - 2nd stage: mid /. Standard 7 (WES7) - 32 Bit Power supply 120/230 V AC Wide range 24 V DC Mains switch / / / On/Off button./. Drives Hard disk drives Serial-ATA Serial-ATA (HDD) 250 GB, 3.5" or 250 GB, 3.5" or

3 500 GB, 3.5" or [no] RAID1, 2x 250 GB, 2.5" or 500 GB, 3.5" or 2x 250 GB, 2.5" or RAID1, 2x 250 GB, 2.5" 2nd stage: mid RAID1 on 2x replacement HDD Solid-State Drive SSD 240 GB, 2.5" SATA MLC(optional) SSD 50 GB, 2.5" SATA SLC(optional) (SSD) Flash Drive (accessible from./. 1x CompactFlash 1x CompactFlash (optional, internal) outside) RAID1 Controller Intel Rapid Storage Technology integrated in Chipset Intel Rapid Storage Technology integrated in Chipset Optical drives DVD±R/RW/-DL/-RAM DVD±R/RW/-DL/-RAM (ODD) Interfaces PROFINET PROFINET, 3x RJ45, CP1616- compatible (onboard, optional) PROFINET, 3x RJ45, CP1616- compatible (onboard, optional) PROFIBUS/MPI 12 MBit/s, CP5622-compatible (onboard, optional) 12 MBit/s, CP5611-compatible (onboard, optional) Ethernet 2x Gigabit Ethernet (IE/PN), RJ45, teaming ability 2x Gigabit Ethernet (IE/PN), RJ45, teaming ability USB 5x USB 3.0 SuperSpeed, 500 MB/s 5x USB 2.0 HighSpeed, 60 MB/s DisplayPort (DP)./. VGA/DVI 1x DVI-I (analog & digital) VGA via adapter cable (as accessory) 1x DVI-I (analog & digital) VGA via adapter cable (as accessory) Dual-Monitoring DP and DVI 1x VGA, 1x DVI-D via DVI-I to VGA/DVI- D Y adapter (as accessory) Serial 1x RS232 (COM1) 1x RS232 (COM1) Monitoring functions Temperature - Temperatures in the PC - Outside temperature - Temperatures in the PC - Outside temperature Fan speed BIOS battery Watchdog Monitoring software SIMATIC PC DiagBase SIMATIC PC DiagBase

4 SIMATIC PC DiagMonitor (optional) SIMATIC PC DiagMonitor (optional) Ambient conditions Vibration during operation to DIN IEC to 58 Hz: mm, 58 to 500 Hz: 9.8 m/s2 approx. 1 g 10 to 58 Hz: mm, 58 to 500 Hz: 9.8 m/s2 approx. 1 g Restrictions during DVD operation Restrictions during DVD operation Shock immunity during 50 m/s2, 30 ms 50 m/s2, 30 ms operation to IEC , IEC Temperature during operation to IEC , IEC , IEC relative humidity - during operation - storage/transport to IEC , IEC Other Housing Battery-backed SRAM NAU Signal for indication of loss of voltage (WinAC RTX) CMOS battery approx. 5 g Restrictions during DVD operation and approx. 5 g Restrictions during DVD operation swappable HDD + 5 C to + 45 C (with full configuration) + 5 C to + 45 C (with full configuration) Restrictions during DVD operation Restrictions during DVD operation 5 % to 80 % at 25 C 5 % to 80 % at 25 C 5 % to 95 % at 25 C 5 % to 95 % at 25 C chromated, new cover concept for Zink plated simplified access to the PC modules and PC components 2 MB onboard 2 MB onboard (Fieldbus versions) (Fieldbus versions) max. 128kB can be used with WinAC max. 128kB can be used with WinAC RTX RTX, with AC and DC versions, with AC and DC versions Service-friendly simple replacement Service-friendly simple replacement from from outside outside Wake-On-LAN Interface modules 1x COM2/LPT on slot cover (opt.) PCI interface card for COM2, LPT (PC

5 2x USB on slot cover (optional) Requires one PC slot in each case Component label label with PC components (processor, HDD,...) on housing Fan for active cooling 1x housing 1x power supply Tension relief for cables 1x for 24V or 230V cable 1x for all USB and Ethernet interfaces accessories) label with PC components (processor, HDD,...) on housing for active cooling 1x housing 1x power supply 1x for 24V or 230V cable 1x for all USB and Ethernet interfaces New technology and explanations Features Description Xeon Core i3 Celeron Turbo Boost (TB) The Intel Turbo Boost technology (TB) permits a higher X - - clock rate for the cores, depending on the overall load of the processor and the ambient temperatures. This increases the processor performance. - Xeon: 2.53 GHz to max. 3.3 GHz Intel HD Graphics with This graphics technology can significantly increase the X X - Dynamic Frequency graphics performance under suitable conditions, similar to Turbo Boost. Graphics Base Frequency / Graphics Max Dynamic Frequency: Xeon: 350 MHz / 1000 MHz Core i3: 200 MHz / 1100 MHz Core (C) These are the individual hardware processor cores. - Xeon has 4 cores - Core i3, Celeron: each have 2 cores (2C) Thread (T) Threads are program sections that can be processed in parallel. Hyper-Threading (HT) Intel Hyper-Threading Technology enables two programs (Threads) to be processed on one core in parallel. X X -

6 Xeon has 4 cores/8 threads (2C/4T), i.e. when using four cores up to 8 programs can be processed simultaneously. Intel Virtualization Technology for Directed I/O (VT-d) Intel Virtualization Technology (VT-x) Error Correction Code (ECC) Platform Controller Hub (PCH) Active Management Technology (AMT) Trusted-Platform Module (TPM) Celeron: 2C/2T: Two programs can be processed simultaneously on two cores (no Hyper-Threading) Enhanced virtualization technology with access to HW X - - components via direct I/Os (innovation of VT-x). Standard virtualization technology (provides special X X - commands for this purpose). Enables the identification of work memory errors and the correction of 1-Bit errors. A feature of the PCH and the memory HW. Follow-up of the well-known INTEL CHIP Sets (North- /Southbridge). The PCH has no Northbridge anymore and the Memory Controller is already integrated. This architecture increases the performance. Intel technology for remote/service access to another computer. TPM is a special chip on the motherboard that significantly expands the security functions on a computer: Protection against software manipulation or unauthorized third parties. X - -

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