Laser Marker Selection Guide LARGE SELECTION LASER MARKER panasonic.net/id/pidsx/global
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1 Laser Marker Selection Guide LARGE SELECTION LASER MARKER panasonic.net/id/pidsx/global
2 Laser wavelength Ultraviolet region Visible region Laser comes in various wavelengths. Since the rates of laser absorption and reflection by material vary for different laser wavelengths, the marking target also varies depending on the wavelength of the laser used. Panasonic Industrial Devices SUNX offers an extensive lineup of laser markers to suit specific needs of customers. High-power Output and 3D-control Laser Marker LP-M SERIES 1,064 nm High-power Output Laser Marker FAYb LP-S SERIES 1,064 nm 1,070 nm[lp-s500w] 1,000 FAYb Laser 1,060 nm 1,064 nm 1,070 nm 3D-control Laser Marker LP-Z SERIES 1,060 nm Infrared region High-definition Laser Marker LP-V/WSERIES 1,060 nm Compact CO2 Laser Marker CO2 LP-GSSERIES 10,600 nm 10,000 CO2 Laser 9,300 nm 10,600 nm High-performance Laser Marker [nm] Wavelength LP-400SERIES 10,600 nm 9,300 nm[lp-420s9u]
3 Marking examples Engine block Connecting rod Engine part Cam shaft Crank shaft Tool (carbide) Billet Bearing Battery housing Cast Medical instruments Molded resin part IC Molded resin part Laser diode Nameplate IC Connector Circuit board Molded resin part Outer box Laser label (marking + half-cut) PET bottle Aluminum wrapping materials * The surface condition, composition and other factors affect the marking results. For details, contact our company.
4 Laser power Marking field[mm in] Height adjustment mechanism Features 40 W D control [±22 mm ±0.866 in] Enhanced safety function [LP-M -S type] 16 W Fan-less structure (head section) Marking energy measurement function 42 W Manual adjustment Fan-less protective structure "IP67G" (head section) 17 W * Size 55 mm 55 mm in in is only for LP-S. Detachable fiber unit Marking energy measurement function 25 W 13 W D control [±25 mm ±0.984 in] Wide marking area of 330 mm 330 mm in in Pulse width adjustment function * Size 330 mm 330 mm in in is for 25 W, and size 120 mm 120 mm in in is for 25 W and 13 W. [LP-V] [LP-W] 12 W 5 W Manual adjustment LP-V series Short-pulse laser (marking by resin coloring) LP-W series Designed for resin packages * Size 160 mm 160 mm in in is only for LP-V, and size 55 mm 55 mm in in is only for LP-W. Extremely fine marking 5 W 1.3 W Z-axis control ±3 mm / ±1.5 mm ±0.118 in / ±0.059 in Compact head Image processing / reader-linked function Ultra-small character marking 30 W Manual adjustment Laser output stability of ±3 % (typ.) 20 W 10 W Rotary head mechanism (Standard type) Short-wavelength laser marker suitable for PET and PC
5 Material compatibility chart = Good = Usable = Incompatible = Non-usable Material FAYb laser marker LP-M series LP-S series LP-Z series LP-V series CO2 laser marker LP-GS series LP-400 series FAYb laser marker Iron Carbon steel Alloy steel Stainless steel (SUS) Steel Copper, brass Metal Aluminum alloys Magnesium alloys Titanium alloys Nickel alloys Copper Aluminum Gold, silver ABS (Acrylonitrile butadiene styrene) EP (Epoxy) PA (Polyamide / nylon) PC (White) PC (Black) PBT (Polybutylene terephthalate) PC (Polycarbonate) PE (Polyethylene) Resin PET (Polyethylene telephthalate) PF (Phenol) PMMA (Acrylic) POM (Polyacetal) PP (Polypropylene) PS (Polystyrene) PU (Polyurethane) PVC (Polyvinyl chloride) UF (Urea) PMMA (Transparent) PS (Black) CO2 laser marker PP (Black) PS (White) Silicone resin Others Ceramics Wood Paper PVC (White) Glass epoxy Glass Rubber * The above shows typical judgment results. Judgment results may differ when used on customers' workpieces. * We can check marking results using actual workpieces provided by your company. For details, please contact our sales office nearest you. Epoxy Glass Laser processing Since modern laser markers have improved significantly in performance, they are now used in a wide range of processing applications in addition to marking of characters and codes. By switching the processing method to the laser processing method, it is possible to improve quality, reduce cost and enhance productivity. Peeling No cutter or solvent is necessary. Pinpoint processing is possible. Can be used to clean metal surfaces. Surface processing No need for die or mask. No need for consumables such as media. Easy adjustment of processing amount and pattern. 1mm Removal of coating film from gasket Peeling of enamel covering Processing of bearing surface Depression processing on metal Cutting / engraving No need to use various types of tools. No need for various dies. Enables in-house production. Bonding No need to use adhesive. No damage to parts due to vibrations. Can be used for various items ranging from precision parts and large parts. Removal of sheath from cable Engraving on die Bonding of infrared communication window to resin case Bonding of clear cover to resin case
6 Precautions for Proper Use Laser safety This product is classified as a Class 4 Laser Product in IEC/JIS/FDA regulations 21 CFR and Never look at or touch the direct laser beam and its reflection. Handle the product according to the instruction given on the warning labels.(warning labels are not shown in the product photographs in this catalog.) The laser used by this product generates infrared light that is invisible to the human eye. Use particular caution when the laser is operating. Maintenance Air filter: Regularly clean the air filter attached to the FAYb Laser Marker to maintain cooling effects. Laser pointer emission port: Dust or chips adhering to the laser pointer emission port may affect the printing quality or seriously damage the laser marker. Clean the laser pointer emission port regularly. Recommended use of a dust collector Depending on the object being marked, harmful gasses or smoke that have a detrimental effect on the human body or the laser marker may be generating during marking. If your application falls under this description, use a dust collector. *For more information, contact your sales representative. Disclaimer The applications described in the catalog are all intended for examples only. The purchase of our products described in the catalog shall not be regarded as granting of a license to use our products in the described applications. We do NOT warrant that we have obtained some intellectual properties, such as patent rights, with respect to such applications, or that the described applications may not infringe any intellectual property rights, such as patent rights, of a third party. No. CE-LMDJ-1-3 November, 2016
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