Zener Diodes Permitting 500 mw Power Dissipation

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1 Zener Diodes Permitting 5 mw Power Dissipation PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT V Z range nom. 2. to 39 V Test current I ZT 5 to 2 ma V Z specification Pulse current Int. construction Single FEATURES Sillicon planar Zener diodes, ultra small Low profile DO-219AC (MicroSMF) package Low leakage current Excellent stability High temperature soldering: 26 C / s at terminals Wave and reflow solderable (reflow as per JPC / JEDEC J-STD 2) (double wave as per IEC ) AEC-Q1 qualified available Base P/N-G3 - RoHS-compliant, green, industrial grade Base P/N-HG3 - RoHS-compliant, green, AEC-Q1 qualified ESD immunity acc. IEC acc. to part table Surge performance acc. to part table Material categorization: for definitions of compliance please see ORDERING INFORMATION DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY PLZ-Series Part number-g3/h PLZ-Series Part number-hg3/h 45 per 7" reel (8 mm tape) 22 5 / box PACKAGE PACKAGE NAME WEIGHT MOLDING COMPOUND FLAMMABILITY RATING MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS DO-219AC (MicroSMF) 4.8 mg UL 94 V- MSL level 1 (according J-STD-2) 26 C / s at terminals ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Power dissipation Power dissipation Mounted on FR4 board 5 mm x 5 mm x 1.6 mm, solder land mm x mm, T amb = 85 C Mounted on FR4 board 5 mm x 5 mm x 1.6 mm, solder land mm x mm, T amb = 25 C P tot 5 P tot 96 Mounted on FR4 board with recommended soldering Power dissipation P footpads (reflow) tot 34 Non-repetitive peak surge power dissipation t p = 8/2 μs acc. IEC (PLZ5V1A to PLZ39D) P ZSM W t p = 8/2 μs acc. IEC (PLZ2VA to PLZ4V7C) P ZSM 7 W Z-current I Z P tot /V Z ma Junction temperature T j 15 C Storage temperature range T stg -55 to +15 mw THERMAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Typ. thermal resistance junction to ambient air Mounted on FR4 board 5 mm x 5 mm x 1.6 mm, solder land mm x mm R thja 13 K/W Typ. thermal resistance junction to lead R thjl 4 K/W ELECTRICAL SPECIFICATIONS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Forward Voltage I F = ma V F.8.9 V Rev Nov-16 1 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PART NUMBER MARKING CODE ZENER VOLTAGE RANGE (1) Notes (1) Pulse test: t p 4 ms (2) Pulse test: t p = 8/2 μs acc. IEC (3) Contact and air discharge acc. IEC TEST DYNAMIC RESISTANCE PEAK PULSE (2) CLAMPING VOLTAGE AT I PPM ESD IMMUNITY (3) V Z at I ZT I ZT1 I R at V R Z Z at I ZT I PPM V C V ESD V ma μa V A V kv MIN. MAX. MAX. MAX. MAX. MAX. PLZ2VA 2A PLZ2VB 2B PLZ2V2A 2A PLZ2V2B 2B PLZ2V4A 2A PLZ2V4B 2B PLZ2V7A 2A PLZ2V7B 2B PLZ3VA 3A PLZ3VB 3B PLZ3V3A 3A PLZ3V3B 3B PLZ3V6A 3A PLZ3V6B 3B PLZ3V9A 3A PLZ3V9B 3B PLZ4V3A 4A PLZ4V3B 4B PLZ4V3C 4C PLZ4V7A 4A PLZ4V7B 4B PLZ4V7C 4C PLZ5V1A 5A PLZ5V1B 5B PLZ5V1C 5C PLZ5V6A 5A PLZ5V6B 5B PLZ5V6C 5C PLZ6V2A 6A PLZ6V2B 6B PLZ6V2C 6C PLZ6V8A 6A PLZ6V8B 6B PLZ6V8C 6C PLZ7V5A 7A PLZ7V5B 7B PLZ7V5C 7C PLZ8V2A 8A PLZ8V2B 8B PLZ8V2C 8C PLZ9V1A 9A PLZ9V1B 9B PLZ9V1C 9C Rev Nov-16 2 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PART NUMBER MARKING CODE ZENER VOLTAGE RANGE (1) TEST DYNAMIC RESISTANCE PEAK PULSE (2) CLAMPING VOLTAGE AT I PPM ESD IMMUNITY (3) V Z at I ZT I ZT1 I R at V R Z Z at I ZT I PPM V C V ESD V ma μa V A V kv MIN. MAX. MAX. MAX. MAX. MAX. PLZA A PLZB B PLZC C PLZD D PLZ11A 11A PLZ11B 11B PLZ11C 11C PLZ12A 12A PLZ12B 12B PLZ12C 12C PLZ13A 13A PLZ13B 13B PLZ13C 13C PLZ15A 15A PLZ15B 15B PLZ15C 15C PLZ16A 16A PLZ16B 16B PLZ16C 16C PLZ18A 18A PLZ18B 18B PLZ18C 18C PLZ2A 2A PLZ2B 2B PLZ2C 2C PLZ2D 2D PLZ22A 22A PLZ22B 22B PLZ22C 22C PLZ22D 22D PLZ24A 24A PLZ24B 24B PLZ24C 24C PLZ24D 24D PLZ27A 27A PLZ27B 27B PLZ27C 27C PLZ27D 27D Notes (1) Pulse test: t p 4 ms (2) Pulse test: t p = 8/2 μs acc. IEC (3) Contact and air discharge acc. IEC Rev Nov-16 3 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PART NUMBER MARKING CODE ZENER VOLTAGE RANGE (1) TEST DYNAMIC RESISTANCE PEAK PULSE (2) CLAMPING VOLTAGE AT I PPM ESD IMMUNITY (3) V Z at I ZT I ZT1 I R at V R Z Z at I ZT I PPM V C V ESD V ma μa V A V kv MIN. MAX. MAX. MAX. MAX. MAX. PLZ3A 3A PLZ3B 3B PLZ3C 3C PLZ3D 3D PLZ33A 33A PLZ33B 33B PLZ33C 33C PLZ33D 33D PLZ36A 36A PLZ36B 36B PLZ36C 36C PLZ36D 36D PLZ39A 39A PLZ39B 39B PLZ39C 39C PLZ39D 39D Notes (1) Pulse test: t p 4 ms (2) Pulse test: t p = 8/2 μs acc. IEC (3) Contact and air discharge acc. IEC TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) 12 Rise time =.7 ns to 1 ns 8 µs to % 8 8 I ESD (%) I PPM (%) µs to 5 % t (ns) Fig. 1 - ESD Discharge Current Wave Form acc. IEC (33 / 15 pf) t (µs) Fig. 2-8/2 μs Peak Pulse Current Wave Form acc. IEC Rev Nov-16 4 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

5 P (W) R thja = 37 K/W R thja = 13 K/W 5 15 T A ( C) Fig. 3 - Maximum Power Dissipation vs. Ambient Temperature PLZA PLZB PLZC PLZD PLZ11A PLZ11B PLZ11C PLZ12A PLZ12B PLZ12C Fig. 6 - Breakdown Characteristics I F (ma) V F (V) Fig. 4 - Typical Forward Current vs. Forward Voltage 9 8 PLZ13A 7 PLZ13B PLZ13C PLZ15A 6 PLZ15B PLZ15C 5 PLZ16A PLZ16B 4 PLZ16C Fig. 7 - Breakdown Characteristics Footprint in mm 6 Z th - Thermal Impedance (K/W) infinite heatsink PLZ18A PLZ18B PLZ18C PLZ2A PLZ2B PLZ2C PLZ2D PLZ22A PLZ22B PLZ22C t p - Pulse Width (s) Fig. 5 - Thermal Impedance vs. Time Fig. 8 - Breakdown Characteristics Rev Nov-16 5 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

6 PLZ24A PLZ24B PLZ24C PLZ24D PLZ27A PLZ27B PLZ27C PLZ27D Fig. 9 - Breakdown Characteristics PLZ3A PLZ3B PLZ3C PLZ3D PLZ33A PLZ33B PLZ33C PLZ33D Fig. - Breakdown Characteristics PLZ36A PLZ36B PLZ36C PLZ36D PLZ39A PLZ39B PLZ39C PLZ39D Fig Breakdown Characteristics Rev Nov-16 6 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

7 PACKAGE DIMENSIONS in millimeters: DO-219AC (MicroSMF) ± ± ±.1 cathode bar 2.5 ±.1 foot print recommendation for wave soldering: foot print recommendation for reflow soldering: Document no.: S8-V (4) Created - Date: 2.Dec.2 Rev. 5 - Date: 6.May. 214 Rev Nov-16 7 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

8 BLISTER TAPE DIMENSIONS in millimeters: DO-219AC (MicroSMF) 4. ±. 3.5 ± ±. Ø ± Ø ±..229 ±.2 12 MAX. 12 MAX. Ko.91 ±. Bo 2.79 ±. Ao 1.68 ±. Unreeling direction Cathode Top view Rev Nov-16 8 Document Number: 8483 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

9 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 9

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