TC962. High Current Charge Pump DC-to-DC Converter. General Description: Features: Applications: Device Selection Table. Package Type TC962COE

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1 TC9 High Current Charge Pump DC-to-DC Converter Features: Pin Compatible With TC/ICL/SI High Output Current 0 ma No External Diodes Required Wide Operating Range 3V to V Low Output Impedance Ω Typ. No Low Voltage Terminal Required Application Zener On-Chip OSC Frequency Doubling Pin Option for Smaller Output Capacitors Applications: Laptop Computers Disk Drives Process Instrumentation μp-based Controllers Device Selection Table Part Number Package Operating Temp. Range TC9COE -Pin SOIC Wide 0 C to 0 C TC9CPA -Pin Plastic DIP 0 C to 0 C TC9EPA -Pin Plastic DIP -0 C to C TC9IJA -Pin CERDIP - C to C TC9MJA -Pin CERDIP - C to C General Description: The TC9 is an advanced version of the industry standard TC high voltage DC-to-DC converter. Using improved design techniques and CMOS construction, the TC9 can source as much as 0 ma versus the s 0 ma capability. As an inverter, the TC9 can put out voltages as high as V and as low as 3V without the need for external diodes. The output impedance of the device is a low Ω (with the proper capacitors), voltage conversion efficiency is 99.9%, and power conversion efficiency is 9%. The low voltage terminal (pin ) required in some TC applications has been eliminated. Grounding this terminal will double the oscillator frequency from khz to khz. This will allow the use of smaller capacitors for the same output current and ripple, in most applications. Only two external capacitors are required for inverter applications. In the event an external clock is needed to drive the TC9 (such as paralleling), driving this pin directly will cause the internal oscillator to sync to the external clock. Pin, which is used as a test pin on the, is a voltage reference Zener on the TC9. This Zener (.V at ma) has a dynamic impedance of Ω and is intended for use where the TC9 is supplying current to external regulator circuitry and a reference is needed for the regulator circuit. (See Section 3.0 Applications Information Applications Information). The TC9 is compatible with the LTC0, SI and ICL. It should be used in designs that require greater power and/or less input to output voltage drop. It offers superior performance over the ICL0S. Package Type -Pin SOIC Wide Zener Cathode C GND C 3 -Pin DIP -Pin CERDIP TC9CPA TC9EPA TC9IJA TC9MJA V DD C OSC FREQ x V OUT Zener Cathode C GND C 3 TC9COE 3 0 V DD C OSC FREQ x V OUT 9 00 Microchip Technology Inc. DSC-page

2 TC9 Functional Block Diagram FREQ x OSC/C Timing I Comparator with Hysteresis I Q F/F C Q Level Shift Level Shift V DD P SW N SW CAP C P External TC9 3 GND Zener Cathode.V V REF Level Shift N SW OUT C R EXT CAP R L Level Shift N SW3 V OUT DSC-page 00 Microchip Technology Inc.

3 TC9.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Supply Voltage (V DD to GND)...V Input Voltage Any Pin... (V DD 0.3) to (V SS -0.3) (Note ) Current Into Any Pin... 0 ma ESD Protection...±000V Output Short Circuit... Continuous (at.v Input) Package Power Dissipation (T A 0 C) SOIC... 0 mw PDIP mw CERDIP mw Package Thermal Resistance CERDIP, Rθ J-A...90 C/W PDIP, Rθ J-A... 0 C/W Operating Temperature Range CPA, COE... 0 C to 0 C IJA... - C to C EPA C to C MJA... - C to C Storage Temperature Range... - C to 0 C *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC9 ELECTRICAL SPECIFICATIONS Electrical Characteristics: V DD = V, T A = C (See Figure ) unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions V DD Supply Voltage 3 V I S Supply Current V DD = V μa R O V DD = V Output Source Resistance F OSC Oscillator Frequency P EFF Power Efficiency 93 V DEF Voltage Efficiency Ω khz R L = T A = C 0 T A 0 C - C T A C T A = C 0 T A 0 C - C T A C I L = 0 ma, V DD = V I L = 0 ma, V DD = V I L = 3 ma, V DD = V Pin Open Pin GND % R L = kω % R L = Over temperature range V Z Zener Voltage.0.. V I Z = ma Z ZT Zener Impedance Ω I L =. ma to. ma Note : Connecting any input terminal to voltages greater than V or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to power-up of the TC9. 00 Microchip Technology Inc. DSC-page 3

4 TC9.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table -. TABLE -: Pin No. (-Pin DIP) (-Pin CERDIP) PIN FUTION TABLE Symbol Description Zener Cathode Cathode of internal Zener diode. C Positive side of external CP capacitor (pump cap). 3 GND Ground terminal. C - Negative side of external CP capacitor (pump cap). V OUT Output voltage. FREQ x If grounded, frequency doubles. C OSC Capacitor to GND will decrease frequency. V DD Input voltage. Pin No. (-Pin SOIC) Symbol Description Zener Cathode Cathode of internal Zener diode. No connect. 3 C Positive side of external CP capacitor (pump cap). No connect. GND Ground terminal. No connect. C - Negative side of external CP capacitor (pump cap). No connect. 9 No connect. 0 V OUT Output voltage. No connect. FREQ x If grounded, frequency doubles. 3 No connect. C OSC Capacitor to GND will decrease frequency. No connect. V DD Input voltage. DSC-page 00 Microchip Technology Inc.

5 TC9 3.0 APPLICATIONS INFORMATION 3. Theory of Operation The TC9 is a capacitive pump (sometimes called a switched capacitor circuit), where four MOSFET switches control the charge and discharge of a capacitor. The functional block diagram shows how the switching action works. SW and SW are turned on simultaneously, charging C P to the supply voltage, V IN. This assumes that the on resistance of the MOSFETs in series with the capacitor results in a charging time (3 time constants) that is less than the on time provided by the oscillator frequency as shown: 3 (R DS(ON) C P ) < C P /(0. f OSC ) In the next cycle, SW and SW are turned off and after a very short interval of all switches being off (this prevents large currents from occurring due to cross conduction), SW3 and SW are turned on. The charge in C P is then transferred to C R, but with the polarity inverted. In this way, a negative voltage is now derived. An oscillator supplies pulses to a flip-flop that is then fed to a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency. The oscillator has two pins that control the frequency of oscillation. Pin can have a capacitor added that is returned to ground. This will lower the frequency of the oscillator by adding capacitance to the timing capacitor internal to the TC9. Grounding pin will turn on a current source and double the frequency. This will double the charge current going into the internal capacitor, as well as any capacitor added to pin. A Zener diode has been added to the TC9 for use as a reference in building external regulators. This Zener runs from pin to ground. 3. Latch-Up All CMOS structures contain a parasitic SCR. Care must be taken to prevent any input from going above or below the supply rail, or latch-up will occur. The result of latch-up is an effective short between V DD and V SS. Unless the power supply input has a current limit, this latch-up phenomena will result in damage to the device. (See AN3, Latch-up Protection for MOSFET Drivers.) I S I L 0 μf 3 TC9 C C OSC RL P FIGURE 3-: 90 Test Circuit C R 0 μf V (V) V OUT ( V) Combined Negative Converter and Positive Multiplier Split V In Half V V C P 0 μf 3 TC9 C P V OUT = V 0 μf V D V D VOUT = V V D C R 0 μf C P 0 μf 3 TC9 C R V OUT = V 0 μf Lowering Output Resistance by Paralleling Devices V Positive Voltage Multiplier V C P 0 μf 3 TC9 0 μf C P 3 TC9 V OUT 3 TC9 V D V D V OUT = V V D 0 μf C P CP 0 μf C R 0 μf FIGURE 3-: Typical Applications 00 Microchip Technology Inc. DSC-page

6 TC9.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Circuit of Figure, C P = C R = 0 μf, C PESR C RESR Ω. Supply Current vs. Temperature Oscillator Frequency vs. COSC Frequency vs. Temperature k T A = C 0 C OSC = FREQ x = OPEN SUPPLY CURRENT (μa) V = V V = V FREQUEY (Hz) k 00 FREQUEY (khz) TEMPERATURE ( C) ,000 CAPACITAE (pf) TEMPERATURE ( C) OUTPUT RESISTAE ( Ω ) Output Resistance vs. Temperature V = V I L = 3 ma V = V I L = 0 ma TEMPERATURE ( C) CURRENT (ma) Current vs. Zener Voltage T A = C ZENER VOLTAGE (V) POWER CONVERSION EFFICIEY (%) Power Conversion Efficiency vs. I LOAD EFFICIEY T A = C SUPPLY CURRENT LOAD CURRENT (ma) SUPPLY CURRENT (ma) OUTPUT RESISTAE (Ω) Output Resistance vs. Input Voltage 0 00 T A = C μa 0 μa INPUT VOLTAGE (V) DSC-page 00 Microchip Technology Inc.

7 TC9.0 PACKAGING INFORMATION. Package Marking Information Package marking data not available at this time.. Taping Form Component Taping Orientation for -Pin SOIC (Wide) Devices Pin User Direction of Feed W Standard Reel Component Orientation for 3 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size -Pin SOIC (W) mm mm in P.3 Package Dimensions -Pin CDIP (Narrow).0 (.9).090 (.9) Pin.300 (.).30 (.).0 (.0) Max..00 (0.) Min..00 (0.).30 (9.0).30 (.3).90 (.3).00 (.0).0 (.0).00 (.0).00 (0.).00 (.0). (3.).0 (3.) Min..0 (0.3).00 (0.0) 3 Min..0 (.).0 (.).00 (0.).0 (0.).00 (0.).30 (.3) Dimensions: inches (mm) 00 Microchip Technology Inc. DSC-page

8 TC9 Package Dimensions (Continued) -Pin Plastic DIP Pin.0 (.0).0 (.0).0 (.).030 (0.).00 (0.).3 (.).00 (.).00 (.0).30 (.).90 (.3).00 (.0).0 (3.).0 (3.). (.9).00 (.0).00 (0.).0 (0.3).00 (0.0) 3 Min..0 (.9).090 (.9).0 (0.).0 (0.3).00 (0.).30 (.) Dimensions: inches (mm) -Pin SOIC (Wide) Pin.99 (.9).9 (.0).9 (0.).39 (0.0).3 (0.9).39 (0.0).00 (.) Typ..09 (0.).0 (0.3).0 (.).09 (.).03 (0.33) Max..009 (0.3).0 (0.30).00 (0.0).00 (.).0 (0.0) Dimensions: inches (mm) DSC-page 00 Microchip Technology Inc.

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