NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A. Single Low Noise Operational Amplifier

Transcription

1 NE3, SA3, SE3, NE3A, SA3A, SE3A Single Low Noise Operational Amplifier The NE/SA/SE3/3A are single high-performance low noise operational amplifiers. Compared to other operational amplifiers, such as TL3, they show better noise performance, improved output drive capability, and considerably higher small-signal and power bandwidths. This makes the devices especially suitable for application in high quality and professional audio equipment, in instrumentation and control circuits and telephone channel amplifiers. The op amps are internally compensated for gain equal to, or higher than, three. The frequency response can be optimized with an external compensation capacitor for various applications (unity gain amplifier, capacitive load, slew rate, low overshoot, etc.). SOIC D SUFFIX CASE 7 PDIP N SUFFIX CASE Features Small-Signal Bandwidth: MHz Output Drive Capability:, V RMS at V S = V Input Noise Voltage: nv Hz DC Voltage Gain: AC Voltage Gain: at khz Power Bandwidth: khz Slew Rate: 3 V/ s Large Supply Voltage Range: 3. to V PbFree Packages are Available Applications Audio Equipment Instrumentation and Control Circuits Telephone Channel Amplifiers Medical Equipment BALANCE INVERTING INPUT NON-INVERTING PIN CONNECTIONS V 3 D, N Packages Top View ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. 7 BALANCE/ COMPENSATION V+ OUTPUT COMPENSATION DEVICE MARKING INFORMATION See general marking information in the device marking section on page of this data sheet. Semiconductor Components Industries, LLC, July, Rev. 3 Publication Order Number: NE3/D

2 7 3 Figure. Equivalent Schematic MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage V S V Input Voltage V IN V Supply V Differential Input Voltage (Note ) V DIFF. V Operating Temperature Range NE SA SE T amb to +7 to + to + Storage Temperature Range T stg to + C Junction Temperature T j C Power Dissipation at C Thermal Resistance, JunctiontoAmbient N Package D Package N Package D Package P D 7 R JA 3 Output Short-Circuit Duration (Note ) Indefinite Lead Soldering Temperature ( sec max) T sld 3 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds. V. Maximum current should be limited to ma.. Output may be shorted to ground at V S = V, T amb = C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. C mw C/W

3 DC ELECTRICAL CHARACTERISTICS (T amb = C; V S = V, unless otherwise noted.) (Notes 3, and ) Characteristic Symbol Test Conditions NE/SA3/3A SE3/3A Min Typ Max Min Typ Max V OS.... mv Offset Voltage Overtemperature. 3. mv V OS / T.. V/ C I OS 3 na Offset Current Overtemperature na I OS / T pa/ C I B na Input Current Overtemperature na Supply Current Per Op Amp I B / T.. na/ C I CC Overtemperature Common Mode Input Range V CM 3 3 V Common Mode Rejection Ratio CMRR 7 db Power Supply Rejection Ratio PSRR V/V Large-Signal Voltage Gain A VOL R L, V/mV V O = V Overtemperature Output Swing V OUT R L 3 3 V Overtemperature R L ; V S = V R L. k Overtemperature.. Input Resistance R IN 3 k Output Short Circuit Current I SC 3 3 ma 3. For NE3/3A, T MIN = C, T MAX = 7 C.. For SA3/3A, T MIN = C, T MAX = + C.. For SE3/3A, T MIN = C, T MAX = + C. Unit ma 3

4 AC ELECTRICAL CHARACTERISTICS (T amb = C; V S = V, unless otherwise noted.) Characteristic Symbol Test Conditions Output Resistance R OUT A V = 3 db closed-loop f = khz; R L = ; C C = pf Transient Response Voltage-follower, V IN = mv R L = C C = pf, C L = pf NE/SA3/3A SE3/3A Min Typ Max Min Typ Max.3.3 Rise Time t R ns Overshoot % Transient Response V IN = mv, R L = C C = 7 pf, C L = pf Rise Time t R ns Overshoot 3 3 % Gain A V f = khz, C C =.. V/mV f = khz,.. C C = pf Unit Gain Bandwidth Product GBW C C = pf, C L = pf MHz Slew Rate SR C C = 3 3 V/ s C C = pf.. Power Bandwidth V OUT = V, C C = pf V OUT = V, C C = pf V OUT = V, R L = C C = pf, V CC = V khz ELECTRICAL CHARACTERISTICS (T amb = C; V S = V, unless otherwise noted.) Characteristic Symbol Test Conditions Input Noise Voltage V NOISE f O = 3 Hz f O =. khz NE/SA/SE3 NE/SA/SE3A Min Typ Max Min Typ Max Unit nv/ Hz Input Noise Current I NOISE f O = 3 Hz f O =. khz.... pa/ Hz Broadband Noise Figure f = Hz to khz; R S =. k Channel Separation f =. khz; R S =. k.9 db db

5 ICAL PERFORMANCE CHARACTERISTICS GAIN (db) C C = pf ICAL VALUES C C = S (V/ s) V S = +V C C GAIN (db) C C = ; RF = k ; RE = C C = ; RF = 9k ; RE = k ICAL VALUES C C = pf; RF = k ; RE = f (Hz) Figure. Open-Loop Frequency Response C C (pf) Figure 3. Slew Rate as a Function of Compensation Capacitance f (Hz) Figure. ClosedLoop Frequency Response 3 V S = +V ICAL VALUES, V S = +V V S = +V, (V) Vo(p-p) C C = pf pf 7pF I O (ma) I I ( A),, 3 7 f (Hz) Figure. LargeSignal Frequency Response T amb (o C) T amb (o C) Figure. Output ShortCircuit Current Figure 7. Input Bias Current 3 ICAL VALUES I O = V IN (V) NEG POS I P I N (ma) (nv Hz ) Vp; -V N (V) Figure. Input CommonMode Voltage Range Vp; -V N (V) Figure 9. Supply Current Per Op Amp 3 f (Hz) Figure. Input Noise Voltage Density

6 ICAL PERFORMANCE CHARACTERISTICS ICAL VALUES ICAL VALUES (nv Hz ) In(rms) (pa Hz ) 3 f (Hz) Figure. Input Noise Current Density Vn(rms) 3 khz THERMAL NOISE OF SOURCE RESISTANCE 3 R S ( ) Hz Figure. Total Input Noise Density Vn(rms) ( V) Hz TO khz Hz TO khz R S ( ) Figure 3. Broadband Input Noise Voltage

7 TEST LOAD CIRCUITS k V+ C C k - 3 C C 7 R S V I R F R E pf 3 + V- Figure. Frequency Compensation and Offset Voltage Adjustment Circuit Figure. Closed-Loop Frequency Response CAL OSC POWER SUPPLY +V CC -V CC + DUT - k CAL METER +db BANDPASS AT khz (nv Hz ) (nv Hz ) TEST BOARD BANDPASS AT 3Hz GND Figure. Noise Test Block Diagram 7

8 MARKING DIAGRAMS N3 ALYWA S3 ALYWA S3 ALYW NE3xN AWL YYWWG SA3xN AWL YYWWG SE3xN AWL YYWWG SOIC D SUFFIX CASE 7 PDIP N SUFFIX CASE x = Blank or A A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or = PbFree Package ORDERING INFORMATION Device Description Temperature Range Shipping NE3AD Pin Plastic Small Outline (SO) Package to +7 C 9 Units / Rail NE3ADG Pin Plastic Small Outline (SO) Package (PbFree) to +7 C 9 Units / Rail NE3ADR Pin Plastic Small Outline (SO) Package to +7 C / Tape & Reel NE3ADRG Pin Plastic Small Outline (SO) Package (PbFree) to +7 C / Tape & Reel NE3AN Pin Plastic Dual InLine Package (PDIP) to +7 C Units / Rail NE3ANG Pin Plastic Dual InLine Package (PDIP) (PbFree) to +7 C Units / Rail NE3D Pin Plastic Small Outline (SO) Package to +7 C 9 Units / Rail NE3DG Pin Plastic Small Outline (SO) Package (PbFree) to +7 C 9 Units / Rail NE3DR Pin Plastic Small Outline (SO) Package to +7 C / Tape & Reel NE3DRG Pin Plastic Small Outline (SO) Package (PbFree) to +7 C / Tape & Reel NE3N Pin Plastic Dual InLine Package (PDIP) to +7 C Units / Rail NE3NG Pin Plastic Dual InLine Package (PDIP) (PbFree) to +7 C Units / Rail SA3AD Pin Plastic Small Outline (SO) Package to + C 9 Units / Rail SA3ADG Pin Plastic Small Outline (SO) Package (PbFree) to + C 9 Units / Rail SA3ADR Pin Plastic Small Outline (SO) Package to + C / Tape & Reel SA3ADRG Pin Plastic Small Outline (SO) Package (PbFree) to + C / Tape & Reel SA3AN Pin Plastic Dual InLine Package (PDIP) to + C Units / Rail SA3ANG Pin Plastic Dual InLine Package (PDIP) (PbFree) to + C Units / Rail SA3N Pin Plastic Dual InLine Package (PDIP) to + C Units / Rail SA3NG Pin Plastic Dual InLine Package (PDIP) (PbFree) to + C Units / Rail SE3AN Pin Plastic Dual InLine Package (PDIP) to + C Units / Rail SE3ANG Pin Plastic Dual InLine Package (PDIP) (PbFree) to + C Units / Rail SE3N Pin Plastic Dual InLine Package (PDIP) to + C Units / Rail SE3NG Pin Plastic Dual InLine Package (PDIP) (PbFree) to + C Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD/D.

9 PACKAGE DIMENSIONS X B Y A S. (.) M Y M SOIC NB CASE 77 ISSUE AK K NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 9.. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION. (.) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.7 (.) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.. 7 THRU 7 ARE OBSOLETE. NEW STANDARD IS 77. Z H G D C. (.) M Z Y S X S SEATING PLANE. (.) N X M J MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D G.7 BSC. BSC H.... J K..7.. M N.... S.... SOLDERING FOOTPRINT* SCALE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9

10 PACKAGE DIMENSIONS PDIP N SUFFIX CASE ISSUE M D D A E NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y.M, 99.. CONTROLLING DIMENSION: INCHES. 3. DIMENSION E IS MEASURED WITH THE LEADS RE- STRAINED PARALLEL AT WIDTH E.. DIMENSION E DOES NOT INCLUDE MOLD FLASH.. ROUNDED CORNERS OPTIONAL. NOTE F TOP VIEW e/ A E c E END VIEW NOTE 3 INCHES DIM MIN NOM MAX A. A. b... C... D.3.3. D. E MILLIMETERS MIN NOM MAX E E.3 BSC 7. BSC E3.3.9 e. BSC. BSC L L A e SIDE VIEW C SEATING PLANE X b. M C A E3 END VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 3, Denver, Colorado 7 USA Phone: 3377 or 33 Toll Free USA/Canada Fax: 3377 or 337 Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: 9 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: 37 ON Semiconductor Website: Order Literature: For additional information, please contact your loca Sales Representative NE3/D