( Ta= 25 C) Symbol Rating Unit Forward current Reverse voltage. P tot 150 mw. T sol 260 C

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1 PC PC Compact, Surface Mount Type OPIC Photocoupler Features. Mini-flat package. Low output during light emission. Isolation voltage between input and output ( Viso : 7V rms ). TTL and LSTTL compatible output. Recognized by UL(No.E68) Applications. Hybrid substrate which requires high density mounting. Personal computers, office computers and peripheral equipment. Electronic musical instruments Outline Dimensions Anode mark 6 PC.6 ±. 6.7 ±.. ±.. ±.. ±..6 ±.. ±. C. (Input Side) Internal connection diagram Voltage regulator Amp. ( Unit : mm). ± ±. Anode NC Cathode Vo GND 6 Vcc Package Specifications Model No. Package specifications Diameter of reel Tape width PC Taping package (Net: pcs. ) φ 7mm mm PCT Taping package (Net: 7pcs. ) φ 78mm mm PCZ Sleeve package (Net: pcs. ) - - * OPIC ( Optical IC ) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip. Absolute Maximum Ratings Input Output ( Ta= C) Parameter Symbol Rating Unit Forward current IF ma Reverse voltage V R 6 V Power dissipation P 7 mw Supply voltage V CC 6 V High level output voltege V OH 6 V Low level output current IOL ma Power dissipation P O mw Total power dissipation P tot mw * Isolation voltege V iso 7 V rms Operating temperature T opr - to + 8 C Storage temperature T stg - to + C *Soldering temperature T sol 6 C * AC for minute, to 6% RH * For seconds Soldering area.mm or more In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.

2 PC Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward voltage V F IF = ma -.. IF =.ma.7. - V Reverse current IR Ta = C, V R =V - - µa Terminal capacitance Ct Ta= C, V= f= khz - pf Operating supply voltage V CC - V Low level output voltage V OL IOL = 6mA, IF= ma -.. V High level output current I OH VCC =VO= V, I F = - - µ A Low level supply current ICCL VCC = V, I F = ma -.. ma High level supply current I CCH V CC = V, I F = -.. ma * Ta= C,V CC = V H L threshold -.. I FHL RL= 8Ω input current V CC = V,R L = 8Ω - -. * Ta= C,V CC = V L H threshold..8 - I FLH RL= 8Ω input current V CC = V,R L = 8Ω. - - ma ma * Hysteresis Isolation resistance H L propagation delay I FLH /I FHL R ISO t PHL V CC = V,R L = 8Ω Ta = C, DCV to 6% RH Ta = C. x Ω L H propagation delay t PLH V CC = V,I F = ma - 6 µ s Fall -.. R L = 8Ω Rise t r -.. *6 Response * I FHL represents forward current when output gose from high to low. * I FLH represents forward current when output goes from low to high. * Hysteresis stands for I FLH /I FHL. *6 Test circuit for response is shown below. ( Ta= to + 7 C unless otherwise specified) tr = =. µ S Z o = Ω Voltage regulator V 8 Ω Vo VIN t PHL tplh % VIN Amp. µ F Vo VOH 9% 7 Ω.V % VOL

3 PC Fig. Forward Current vs. 6 Fig. Power Dissipation vs. F ( ma ) Forward current I Power dissipation P O, P tot ( mw ) P tot P O Fig. Forward Current vs. Forward Voltage Forward current I F ( ma ) T a = 7 C C C C - C Fig. Relative Threshold Input Current vs. Supply Voltage Relative threshold input current I FHL = at I FHL I FLH Forward voltage V F (V). Supply voltage V CC (V) Fig. Relative Threshold Input Current vs. Relative threshold input current.6.. I FHL..8 I FLH.6. I FHL = at. - 7 Fig. 6 Low Level Output Voltage vs. Low Level Output Current Low level output voltage VOL (V) I F = ma Low level output current I OL ( ma )

4 PC Fig. 7 Low Level Output Voltage vs. Low level output voltage V OL (V) mA ma - 7 I F = ma Fig. 9 Propagation Delay Time vs. Forward Current R L = 8Ω t PLH I OL = ma Fig. 8 Supply Current vs. Supply Voltage Supply current Icc (ma) 9 8 I CCL 7 C 6 I CCL T 8 C a = - C I CCH I CCH C - C 8 C Supply voltage V CC (V) Fig. Rise Time, Fall Time vs. Load Resistance. I F = ma. (µs) Propagation delay t PHL Rise,fall ( µ s)... t r t f 6 Forward current I F ( ma )... Load resistance RL (k Ω ) Preautions for Use ( ) It is recommended that a by-pass capacitor of more than. µf be added between VCC and GND near the device in order to stabilize power supply line. () Handle this product the same as with other integrated circuits against static electricity. () As for other general cautions, refer to the chapter Precautions for Use

5 Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication.

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