LPKF-LDS Technology

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1 LPKF-LDS Technology

2 Content Injection molding Laser processing E-less metallization Examples

3 Thermal stability ( C) Injection Molding Material Portfolio of Polymers suitable for LPKF-LDS High-temp. thermoplast Technical thermoplast PSU PES PC ABS LCP PPA HTN, PA6/6T PET, PBT Standard thermoplast PP amorphous semicrystalline

4 Injection Molding Supplier Portfolio of Polymers suitable for LPKF-LDS

5 Laser Processing LPKF MicroLine3D LPKF Fusion3D

6 MicroLine3D

7 Examples IT Electronics Example 1: Antenna for Cellular Phones Antenna as a separate part in the cell phone Material: Pocan DP T7140 LDS LPKF-LDS antenna

8 Examples IT Electronics Example 1: Antenna for Cellular Phones Advantages vs. traditional technology: full 3D capability integration into housing fast and easy design changes time to market no layout specific tooling less initial cost fine pitch resolution miniaturization Stamp Metal FPC

9 Examples IT Electronics Example 1: Antenna for Cellular Phones Advantages vs. traditional technology: Stamp Metal Antenna FPC Antenna LDS Antenna Design capability 2,5D 2,5D 3D Time for design change Initial part specific cost Edge/bending Radius 7 10 days 7 8 days 2 days High Medium Low 0,8 mm 0,5 mm 0,1 mm

10 Examples IT Electronics Example 1: Antenna for Cellular Phones iid G9 Nokia N97 Blackberry Storm Blackberry Bold Nokia N97 mini Motorola Milestone

11 Examples - Automotive Potential Automotive-Application Tracability: Sensors and Actors Data Matrix Code Lightning In-Door Electronics Switches Source: Kromberg & Schubert GmbH & Co. KG Seat Module

12 Examples - Automotive Example 1: Rotation Sensor for Automotive Break System (ESP) Ground Signal Sensor ASIC Flipped Support bumps Conventional Solution Positioned Source: Robert Bosch GmbH MID using LPKF-LDS technology ASIC deposited onto MID with LPKF-LDS

13 Examples - Automotive Example 1: Rotation Sensor for Automotive Break System (ESP) Qualification: Temperature Shock -40 C 150 C Source: Robert Bosch GmbH Realized by Flip Chip on LPKF-LDS MID

14 Examples - Automotive Example 1: Rotation Sensor for Automotive Break System (ESP) Final Product: Up to 20% cost saving!! Former device Diameter approx. 10mm Source: Robert Bosch GmbH Prototyp new Sensor Diameter: 5mm Realized by Flip Chip on LPKF-LDS MID

15 Examples - Automotive Example 3: Automotive Steering Wheel front-side complicated harness Source: back-side

16 Examples - Automotive Example 3: Automotive Steering Wheel 1. SMD connector 2. SMD resistors / transistors 3. Switch contact pads 4. Horn contact pads Source:

17 Examples - Automotive Example 3: Optimized MID design of TRW s Base Line Concept Layout: Size: 200 mm x 110 mm x 25 mm Circuitry: 500 µm line width Component: Only frame construction Max. 70 oblique surfaces Vias with 30 cone Material: Ultramid T 4381 LDS

18 Examples - Automotive Example 3: Automotive Steering Wheel TRW s Base-Line MID after assembly: Source: I&T 3D-Produktionsgesellschaft mbh

19 Examples - Automotive Example 3: Automotive Steering Wheel TRW s Base-Line MID after assembly into steering wheel: Up to 15% cost saving!! Front side Source: I&T 3D-Produktionsgesellschaft mbh

20 Examples - Automotive Example 3: Automotive Steering Wheel TRW s Steering wheel in BMW Z4 roadster: Front side 20 20

21 Examples - Automotive Example 4: BMW Motocycle Grip Fully 3-dimensional circuit carrier: Up to 14 function Reduction of size and weight Substitution of harness and PCB Integration of connectors BMW K46 Superbike 21 21

22 Examples - Automotive Example 4: BMW Motocycle Grip 50% cost saving!! Material: Ultramid T 4381 LDS 22 22

23 Examples Sensor Packaging Example 1: Package for SMD Pressure Sensor Final Product: ASIC Source: Aktiv Sensor GmbH

24 Examples Sensor Packaging Example 2: Micropackage for SMD Pressure Sensor Barometric pressure sensor: Material: Vectra E820i LDS front side back side Source: VTI Oy inside

25 Examples Sensor Packaging Example 2: Micropackage for SMD Pressure Sensor Size comparison to a 2-Euro coin Pad-Layout of the PCB Source: VTI Oy

26 Examples Sensor Packaging Example 2: Micropackage for SMD Acceleration Sensor Acceleration Sensor Package Source: VTI Oy Pad-Layout of the PCB 26 26

27 Examples Sensor Packaging Example 3: Positioning Sensor for Industry Automation SMT devices turn axis MID made with LPKF-LDS technology Source: Festo AG integrated contact pins magnetic field sensor (ASIC)

28 Examples Sensor Packaging Example 3: Positioning Sensor for Industry Automation LPKF-LDS MID substrate Material: Ultramid T 4381 LDS Soldering profile Flip Chip technique Lasering

29 Examples Sensor Packaging Example 3: Positioning Sensor for Industry Automation Pictures of flipped ASIC: Source: Festo AG, HSG-IMAT

30 Examples Sensor Packaging Example 3: Positioning Sensor for Industry Automation Features: 50% reduction of size substition of one cable reduction of parts (5 pcs) Up to 20% cost saving!! Source: Festo AG New LDS solution conventional solution

31 Examples Sensor Packaging Example 4-6: Other Sensor Injection molding Optical Sensor Power Sensor Compass

32 Examples Medical Electronics Example 1: 3-dimensional PCB for Hearing Aids Stereo hearing aid component: Material: Vectra E840i LDS process steps Source: Harting / Siemens

33 Examples Medical Electronics Example 1: 3-dimensional PCB for Hearing Aids Size comparison to match: Up to 15% cost saving compared to PCB solution!! front side back side Source: Harting / Siemens

34 Examples Medical Electronics Example 4: Switch Ring for Caries Diagnostic Pen Features: Reduction of parts (1 vs. 7) Reduction of assembly cost increase of product life time Up to 50% cost saving vs. stamp metal!! conventional LDS Material: Vectra E840i LDS

35 Examples - Others Example 1: RFID-Transponder RFID: Radio Frequency Identification Material: Pocan DP T7140 LDS Advantages of this new transponder: Reliable in wet and metal environment Up to 5 meter reading/writing range Reliable in very robust environment (down to -75 degree celsius) Quelle: Harting Mitronics AG

36 Examples - Others Example 1: RFID-Transponder Applications: Logistic Quality control Process control Spare part managment Quelle: Harting Mitronics AG

37 Examples - Others Example 1: RFID-Transponder Flexibility: Different Antenna patterns for different frequencies and applications Quelle: Harting Mitronics AG

38 Challenges Challenges for the further use of LPKF-LDS technology easy LDS prototyping wire bonding on LDS plated surface SMT equipment for efficient 3-dimensional assembly colors and improved mechanical properties for LDS plastics even wider range of LDS plastics reduce pitch down to 50/50 reduction of manufacturing cost material cost down even higher efficient laser equipment lower plating thickness

39 Thank you for your attention! LPKF Laser & Electronics AG Your patrner in Hungary: 39

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