Handling Activities on (EUV) Masks

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Tyrone Stanley
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1 A d v a n c e d M a s k T e c h n o l o g y C e n t e r, D r e s d e n Handling Activities on (EUV) Masks Dr. Jan Hendrik Peters Manager New Technologies AMTC

2 Handling Definition Handling during the production process Mask blank production identification and defect control Mask structuring process defect and contamination control Handling during the transportation along the supply chain Identification and data exchange Preservation of mask physical and optical properties Handling during the usage cycle Within the wafer fab identification and contamination control Within the exposure tool effective usage time 1

3 Mask Handling Activities in European Projects Project Blank Supplier Mask House Wafer Fab ABBILD Within Mask House (all sub 70 nm mask types) More Moore From Mask House to Exposure Tool (EUV specific) M MUSCLE (proposed) From Blank Supplier to Wafer Fab (full supply chain logistics) Extumask Development of an EUV mask carrier 2

4 German Project ABBILD Project for mask processes 193, 193i and EUV, sub 90nm wafer lithography and projection mask less lithography Handling aspects covered Integrated handling concepts within mask house, e.g. consistent use of mini environments with SMIF technology Handling across the supply chain Handling aspects of ABBILD will be reported to MUSCLE 3

5 MUSCLE M Proposed MEDEA+ project for mask user supply chain for advanced masks Data flow Material flow Standardization Feedback flow Proposed by European based semiconductor companies European based mask houses European tool and blank suppliers Software companies Public research institutions Proposed start Jan

6 MUSCLE M Design & Data-prep. Mask-House S/C Wafer-Fab Exit- Inspection Exit- Inspection Entrance- Inspection Entrance- Inspection Data-Flow Rework-Loop Rework-Loop Material- Flow Blank- Supplier Specs & parameters Specs & parameters Specs & parameters Feed Back Flow / Excellence FLOW INTERRUPTION / OPPORTUNITIES 5

7 Within European Project more Moore Mask house Dispatch department Wafer fab Inspection Understanding the issues for handling of masks in the fab and in the exposure tool Mask carrier Cleaning Storage box Wafer fab Stocker Exposure tool Load lock Exposure tool Gripper Internal storage Reticle stage 6

8 Understanding Current Situation: Transport Boxes Base principal: learn from wafer fab experience SMIF obsolete for wafers since 300 mm FOUP Mini environment and SMIF technology for reticles present in 300 mm fabs Currently SMIF technology is in introduction in mask houses (encapsulation of processes) already established at AMTC BUT: is SMIF good enough for EUV?? More difficult material flow already in preparation of EUV What effect does this have on transport box? SMIF evolution or FOUP revolution? SMIF transport / handling area and opening interface identical FOUP transport / handling area and opening interface separate 7

9 EXTUMASK Work package EUV carrier Simulation of a nitrogen or vacuum carrier concept Front end loading port design for minimized contamination Inclusion of additional objects like thermophoresis protection or micro-pumps First prototype under functional tests 8

10 Additional Topics to Look at EUV is a vacuum exposure technology But starting when is vacuum necessary? Usable mask lifetime in exposure tool Check mask still efficient for exposure? MTBI mean time between inspections Is in-situ metrology required? Is in-situ cleaning necessary, feasible? or better outside the tool? Dispatch department Stocker Mask carrier Inspection Cleaning Exposure tool Cleaning methods Particles Contaminations Avoid ESD damages Cleaning principles become more important M 9

11 Understanding Future Situation: Data Issues Identification of individual mask Keep for lifetime of mask Link to data system for processing Link to carrier M Mask history tracking system Still so many different stack options Different treatment throughout the chain Data hard to compare Information flow between supply chain partners Required data fields Method of exchange 10

12 Conclusions Up to now more or less only individual approaches for EUV First integrated processes and upcoming full field tools require transport and handling concepts along supply chain International standardization needed for supply chain topics Requirement specifications MUSCLE, more Moore International input more than welcome 11

13 Acknowledgements The AMTC gratefully acknowledges the financial support by the German Federal Ministry of Education and Research (BMBF) under Contract No. 01M3154A ( Abbildungsmethodiken für nanoelektronische Bauelemente ) by the European Comission under Contract No (More Moore) and highly appreciates the possibilities for joint projects within MEDEA+ within EXTUMASK MUSCLE 12

AIMS EUV. Status of Concept and Feasibility Study. Ulrich Stroessner* Heiko Feldmann** Wolfgang Harnisch* Dirk Hellweg** Sascha Perlitz*

AIMS EUV. Status of Concept and Feasibility Study. Ulrich Stroessner* Heiko Feldmann** Wolfgang Harnisch* Dirk Hellweg** Sascha Perlitz* AIMS EUV Status of Concept and Feasibility Study 20.10.2010 Ulrich Stroessner* Heiko Feldmann** Wolfgang Harnisch* Dirk Hellweg** Sascha Perlitz* *Carl Zeiss SMS GmbH, Jena,Germany **Carl Zeiss SMT GmbH,