Dynamic & Proto Circuits Inc. Corporate Presentation

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1 Dynamic & Proto Circuits Inc. Corporate Presentation 1

2 DAPC Facility 54,000 Sq.ft./6,000 Sq.M 2

3 Multilayer Process 3

4 Solder Mask Options BLUE BLACK RED GREEN DRY FILM CLEAR 4

5 Investing in Technology New equipment to optimize our production and delivery capabilities 5

6 SES Line The spray system on the Strip-Etch-Strip line offers a high etching quality with high etching factor and the nozzle control system ensures uniform etching patterns without "puddle effects". The transport system is flexible to allow for all PCB thicknesses from 2 to 250 mils. Chemistry is automatically maintained at optimum performance levels. 6

7 AOI Automated Optical Inspection CAMTEK Inspectify mode of operation enables the inspection and verification of both sides of circuit panels at a single workstation; hence, the Orion becomes an independent inspection and verification cell that saves both footprint and handling time providing immediate feedback to the production line. 7

8 High Speed / Small Hole N/C Drilling Equipment The Schmoll Drilling machines have 6 (six) stations per drilling machine and allow DAPC to be more efficient in drilling panels with a large volume of vias at a rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil. This greatly enhances the efficiency of high mix low volume production and mass production quantities of printed circuit boards. 8

9 Mass VCP-5001 Via Plugging Machine This machine is designed to fill holes in printed circuit boards with conductive or non-conductive paste. The hole filling can be performed with through-hole vias and blind vias. The machine is equipped with a full vacuum chamber and heated heads to ensure reliable via filling for the most demanding aspect ratios and a glass cover for visual quality control on both panel sides. 9

10 Soldermask Coater The DP-1500 applies all types of liquid photoimageable coatings, including soldermask, primary image, dielectric, and legend. This versatile machine incorporates more than eight years of experience of dual-sided coating with many new features designed to reduce cycle time, increase yields and improve process reliability. 10

11 HASL Machine The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced. 11

12 IST Tester PWB Interconnect Solutions Inc. is an advanced technology company which offers a revolutionary method for assessing the quality of printed circuit boards (PCB). Their patented interconnect stress test (IST) technology has the unique ability to identify the presence and severity of post separation of both the plated through hole (PTH) and vias within multilayer PCBs. IST technology offers significant advantages over traditional test methods while providing microsection analysis with precise fault locations. 12

13 Schmid Deburr/Hole Cleaning The Schmid Deburr Line provides industry leading surface deburring and hole cleaning with up to 3000 psi water pressure for cleaning even the smallest holes. Boards are cleaned with high pressure air, scrubbing brushes, ultrasonics and rotating high pressure water to ensure surface and hole cleanliness prior to immersion copper. 13

14 Schmoll LIN Series Router High-quality linear motors are used in both the X & Y directions in combination with a granite table. This results in a production machine with high accuracy, low energy, and maintenance costs. Accurate mapping of the PCB surface allows for precision control depth milling to be accomplished. 14

15 OLEC AT-30 Automatic Exposure Unit DAPC has purchased and installed two Olec AT-30 automatic alignment exposure units. These units use four cameras to align artwork top to bottom, and then use panel motion systems to automatically adjust the panel position to a best fit to the artwork for both copper and soldermask layers. Furthermore, these units have hybrid-collimated light units that ensure exposure light attacks the panel at 90 degree angles to the artwork, which is critical for fine line resolution. 15

16 Technology Roadmaps Materials and Manufacturing Capabilities 16

17 Technology Roadmap Attribute Standard Advanced 2015 Minimum Line Spacing, Internal Layer / / /0.003 Minimum Line/Spacing, External Layer / / /0.003 Minimum drilled hole size Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1 Land Size Internal (Diameter over Drill) Land size External (Diameter over Drill) No Connect (Diameter over Drill) Plated Hole Tolerance ±.003 ± ± Minimum Laser Via Hole N/A N/A.004 Laser Via Aspect Ratio N/A N/A 1.5:1 Laser Via Land Size (Diameter Over Drill) N/A N/A Minimum Dielectric Thickness Minimum core Thickness Maximum PCB Thickness Thickness Tolerance (%) Maximum Board Dimensions 16.5 x x x22.5 Bow And Twist (Through Hole) % Bow And Twist (SMT) % Minimum Conductor to Edge Layer-To-Layer Registration Tolerance Component Pitch Soldermask Clearance Soldermask Dams Impedance Tolerance (>50 Ohms) % ± 10 ± 5 ± 3 Maximum layers Maximum Copper Weight Internal (oz.) Maximum Copper Weight External (oz.)

18 Technology Roadmap continued Attribute Standard Advanced 2015 Materials FR4 High Tg FR4 (170C..) BT Epoxy Polyimide Teflon/Duroid Panasonic Megtron-4, Megtron-6 RoHS Compliant Materials Isola FR408HR Nelco N Heatsink Manufacturing and Lamination Via Construction Through Hole Blind (Mechanical) Sequential Lamination Buried (Mechanical) Blind Laser No No Surface Finish ENIG OSP White Tin HASL Electrolytic Nickel/Gold Silver Quality System MIL-P MIL-PRF ISO-9001:2000 AS9100C Electrical Test Method Flying Probe 18

19 Substrate Materials Standard Material Hi-Temp FR-4 Hi-Temp FR-4 Modified FR-4 Modified FR-4 Modified FR-4 Supplier/Material Type Isola IS410 Panasonic R-1755V Isola FR408HR Nelco N Panasonic Megtron-4 Tg (.C) Dielectric 1 GHZ Dissipation Factor CTE-Z Axis 65 PPM 37 PPM <55 PPM 35 PPM 45 PPM Modified FR-4 Panasonic Megtron PPM CTE-X & Y Axis PPM PPM PPM PPM PPM PPM High Temperature Materials Material Supplier/Material Type Tg (.C) Dielectric 1 GHZ Dissipation Factor CTE-Z Axis CTE-X & Y Axis BT-Epoxy Isola G PPM PPM Cyanate Ester Nelco N PPM 12 PPM Polyimide Nelco N7000-2V PPM 13 PPM Hi-Temp FR-4 19

20 Substrate Materials High Frequency Materials (core material only) Material Supplier/Material Type Dielectric Constant Dissipation Factor CTE-Z Axis CTE-X & Y Axis HASL Finish? Immersion Gold/Tin Finish? TLC Taconic /- 10 GHz 10 GHz TLX Taconic /- 10 GHz 10 GHz RF-35 Taconic 1.9 GHz 1.9 GHz 64 19/24 RT/duroid 6002 Rogers /- 10 GHz 10 GHz 24 16/16 No RT/duroid 5880 Rogers / /48 No RO4003 Rogers /- 10 GHz 10 GHz 46 14/16 RO4350 Rogers /- GHz 10 GHz 50 14/16 RO3006 Rogers /- 10 GHz 10 GHz 24 17/17 Ultralam 2000 Rogers / GHz /9.5 AD Series Arlon 10 GHz 10 GHz 95 12/15 20

21 North American Top Tier Customers 21

22 Let the DAPC team get started on your project today! 22

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