HB LEDs. Processes and tools for high and ultra-high brightness LEDs

Transcription

1 HB LEDs Processes and tools for high and ultra-high brightness LEDs

2 World-leading tools and processes for creating worldleading HB LED devices Oxford Instruments offers a unique family of process solutions for high and ultra-high brightness LED production, assuring the highest possible throughput with the highest possible yield at key points in the production process. Substrate etching Typical process flow Substrate etched to give a patterned, surface texture quality of subsequently grown GaN, etc. and the lig finished device. Substrate materials: Sapphire, SiC, fr Growth of GaN, AlGaN, AlGaInP or similar materials. achieved using MOCVD, and also possible by molecul (MBE) reactors within Oxford Instruments MBE prod Hard mark deposition and etching Define hard mask pattern for subsequent etch steps PECVD deposition and etching. GaN, AlGaN, AlGaInP and related materials etching Etching of GaN, AlGaN, AlGaInP and related materia Contact metallisation. Device isolation etch Hard mark deposition and etching GaN, AlGaN, AlGaInP and related materials Create hard mask for device isolation etch by PECV Device isolation etch GaN, AlGaN, AlGaInP and rel down to the substrate. Passivation deposition Passivation deposition; subsequent contact exposure HB LED device and wafer test picture courtesy of Osram Opto Semiconductors

3 Highest batch throughput Excellent in-wafer uniformity Excellent wafer-to-wafer uniformity Excellent run-to-run uniformity e aimed at improving the ht extraction from the eestanding GaN. Process solution Plasmalab System133 Commonly ar beam epitaxy ct range. to n-type layer by Plasmalab800Plus ls to n-type layer. PlasmalabSystem133 D deposition and etching. Plasmalab800Plus ated materials etched PlasmalabSystem133. Plasmalab800Plus

4 Production Solutions Sapphire & SiC substrate etching The PlasmalabSystem133 offers a production solution for substrate preparation, with industry-leading batch sizes: 20 x 2 8 x 3 4 x 4 Both hard mask (oxide/nitride) and photoresist processes Etched Sapphire; no PR mask remains Options of: Inductively coupled plasma (ICP) etching for low damage and highest throughput with fastest etch rate Reactive ion etching (RIE) for the lowest possible damage

5 Production Solutions GaN, AlGaN, AlGaInP & related material etching Flexible configuration options: Load-lock single wafer platen loading Cassette loading Through-wall mounting Integration with central robotic handler for clustered tools and full cassette-to-cassette production The PlasmalabSystem133 also offers a production solution and industryleading batch sizes for the etching of GaN, AlGaN, AlGaInP and related materials: 20 x 2 8 x 3 4 x 4 Superb uniformity and repeatability within wafer, within batch and cross batch Photoresist GaN Etched GaN showing smooth sidewalls and clean etched surface Etched GaN with vertical profile REQUEST OUR PROCESS PERFORMANCE DATASHEETS FOR FULL PROCESS DETAILS click onto or see back page for your local contact

6 Production Solutions Hard mask deposition & etching Passivation deposition The Plasmalab800Plus offers production-scale SiO 2 and SiN x hard mask deposition and etch and passivation deposition in a large batch size open-loading configuration. Batch sizes up to: 40 x 2 19 x 3 10 x 4 System configurations for: SiO 2 /SiN x hard mask deposition by plasmaenhanced CVD (PECVD) Hard mask etching by RIE SiO 2 /SiN x passivation deposition by PECVD

7 Pre-production and R&D Solutions PlasmalabSystem100 Offers smaller batch sizes for RIE or ICP etch Up to 6 x 2 wafers The Plasmalab range also offers compact, economical solutions for small-batch HB LED processes in pre-production and R&D. The same benefits in uniformity and repeatability as production tools Transferable processes onto production tools Cost of ownership Outstanding throughput and high yield through high uniformity mean increased productivity and reduced cost per wafer. Together with excellent reliability, these create low cost of ownership for Oxford Instruments process tools. Supported by Oxford Instruments ProServe preventative maintenance and service contract packages, the ultimate in system uptime can be assured. Process tool software Oxford Instruments PC2000 TM software is clear, easy to use, quick to learn and configured exactly for the customer s system. Its visual interface controls and monitors the process tool, and offers the ability to control a tool cluster from a single interface and PC. Plasmalab80Plus Offers a compact open-loading system for SiO 2 /SiN x deposition and etch in configurations for PECVD or RIE Up to 7 x 2 wafers Process recipes are written, stored and recalled through the same software, building into a process library. In cassette-to-cassette and cluster systems, the users can associate individual recipes with each wafer to be processed, and run a complete set of process steps, loops and repeats. Password-controlled user login allows different levels of user access and tasks, from one-button run operation to full system functions. Continuous process data logging ensures traceability of each wafer and process. REQUEST OUR PROCESS PERFORMANCE DATASHEETS FOR FULL PROCESS DETAILS click onto or see back page for your local contact

8 Oxford Instruments Plasma Technology UK North End, Yatton, Bristol, BS49 4AP Tel: +44 (0) Fax: +44 (0) Germany Wiesbaden Tel: +49 (0) Fax: +49 (0) Japan Tokyo Tel: Fax: oikkpt@oxinst.co.jp PR China Beijing Tel: /1/2 Fax: ptsales@oichina.cn worldwide service and support Oxford Instruments is completely committed to supporting our customers success. We recognise that this requires world class products complemented by world class support. With a global service force of Oxford Instruments engineers backed by regional offices, we can offer assured, rapid support wherever you are. Our ProServe range of service agreements, training plans, and genuine spare parts and accessories offers professional services, for professionals. click onto for more information Shanghai Tel: Fax: ptsales@oichina.cn Singapore Tel: Fax: oipt.sales@oxfordinstruments.com.sg USA Concord, MA TOLLFREE Tel: Fax: info@ma.oxinst.com Oxford Instruments, at Yatton, UK, operates Quality Management Systems approved to the requirements of BS EN ISO This publication is the copyright of Oxford Instruments Plasma Technology Limited and provides outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Oxford Instruments policy is one of continued improvement. The company reserves the right to alter, without notice, the specification, design or conditions of supply of any product or service. Oxford Instruments acknowledges all trade marks and registrations. Oxford Instruments Plasma Technology Ltd, All rights reserved. Plasmalab is a registered trademark of Oxford Instruments Plasma Technology Ltd.