INDEX. D dip-coating, 233 display electronics, 26 donor, 374 dual-source vapor deposition, 353 dye-sensitized solar cell(s) (DSSC), 319, 376

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1 INDEX A absorption coefficient, 369 acceptor, 374 all-solid state, 237 amorphous silicon, 370 anodization, 397 anti-reflective coating, 393 areal capacitance, 414 artificial electronic skin, 66 artificial electronic whisker, 68 asymmetric, 427 B back-gated device, 11 band energy positions, 352 bandgaps, 370 bendability, 436 bendable devices, 441 blown bubble technology, 138 bulk-heterojunction OPV, 340, 374 C III V compound semiconductors, 125 capacitance retention, 450 carrier collection, 393 CdTe solar cells, 372 charge transfer, 446 CIGS solar cells, 241, 373 circuit demonstrations, 177 clear PI foil, 384 clinical applications, 71 CNTs networks, 125 cold isostatic press, 333 Colloidal suspension (Sol) method, 193 conduction band, 376 conductive polymers, 122 conformal/stretchable electronics, 24 contact printing technology, 143 counter electrode, 227 crystalline silicon, 367 crystalline size, 444 chemical vapor deposition (CVD), 195 cycling stability, 418 D dip-coating, 233 display electronics, 26 donor, 374 dual-source vapor deposition, 353 dye-sensitized solar cell(s) (DSSC), 319,

2 464 Index E effective refractive index, 394 electrical properties, 12, 91 electric field assisted alignment, 141 electronic band structure, 92 electronic skin, 30 electronic structure, 169, 352 electrophoretic deposition, 331 electrospinning, 200, 437 energy conversion and storage, 191 energy storage, 412 epitaxial layer transfer, 368 e-skin, 66 external quantum efficiency, 397 F fibers, 235 fiber electrode, 421 fiber supercapacitors, 411 field-effect mobility, 446 field-effect transistors, 87 flexible, 190, 192, 413 flexible batteries, 272 flexible devices, 45 Flexible Dye-Sensitized Solar Cells, 205 flexible electronic devices, 118, 436 flexible glass, 385 flexible memories, 87 flexible photon-to-electron conversion, 204 flexible pressure sensor, 442 flexible sensors, 46, 87, 441 flexible solar cells, 319, 366 flexible substrate, 119, 441 flexible supercapacitors, 292, 444 flexible transparent electrodes, 447 flexographic printing, 344 fluid assisted alignment, 140 fluorine tin oxide (FTO), 221 frequency response, 20 functional circuits, 151 G gas sensors, 61 geometrical structure, 424 graphene, 87, 168 graphene electronics, 175 gravure printing, 343 H halides perovskites, 352 health monitoring devices, 74 heterojunction, 371 hierarchical architectures, 192 high-frequency electronics, 151, 177 human-interactive, 75 hybrid BHJ solar cells, 381 hydrogenated amorphous, 369 hydrothermal, 131 hydrothermal/solvothermal method, 193, 199 I improved one-step solution method, 353 improved vapor assisted solution procession, 353 infrared, 168 inkjet printing, 345 integrated circuits, 22 integration, 66 interconnection layers, 49 interfacial charge selective materials, 341

3 Index 465 K knife coating, 345 L Langmuir and Blodgett, 137 length capacitance, 414 light scattering effect, 394 light-trapping strategies, 393 low temperature, 326 low temperature preparation methods of perovskite films, 353 luminescent, 174 M macroelectronics, 118 mechanical flexibility, 418 mechanical press, 333 mechanical properties, 89 mechano-electrospinning, 452 meso-superstructured PSSC, 350 metal fibers, 328 metal foil, 216, 326 metal halide (M X) bonds, 352 metal halide perovskites, 379 metallic, 8 Metal Oxides, 286 microcrystalline, 369 Micromorph tandem solar cell, 370 micro-/nanofibers, 437 mixers, 180 mobility, 15 multi-junction, 369 multipliers, 178 N nanoimprint lithography, 149 nano ink, 392 nanomaterial patterning, 46 nanostructure, 191 nanotube, 7 near-field electrospinning, 452 non-woven mat, 439 O oblique incident angle, 393 OLED devices, 177 omnidirectional, 400 one-dimensional (1D) nanomaterials, 119, 378, 437 one-step solution deposition, 353 opaque substrates, 386 optical sensors, 51 optical transitions, 170 optical transmittance, 448 optical transparency, 88 organic dielectrics, 121 organic field-effect transistors, 445 organic photovoltaic technology (OPV), 245, 374 organic solar cell, 319 P patterned Al foils, 387 patterned back reflector, 395 perovskite solar cell, 319 ph chemical sensors, 63 photoconductivity, 170 photovoltaic, 365 piezoelectric effect, 154 planar structured PSSC, 350 plasma-enhanced chemical vapor deposition, 369 plasmonic resonance, 395 pre-deformed electrodes, 122 pressure light responsive, 75

4 466 Index printing, 35 processing temperature, 384 Q Quantum Dots, 238 quasi-ohmic contact, 388 R radio-frequency, 1 reactive ion etching, 126 reciprocating-type electrospinning, 452 rollable e-paper, 176 roll-to-roll (R2R), 342, 366 S screen printing, 345 selective laser sintering method, 333 self-organized TiO 2 nanotube, 378 semiconducting, 8 separation, 7 sheet resistance, 448 single junction, 369 single-wall carbon nanotubes, 1 slot-die coating, 345 smart bandages, 76 solar cells, 365 solar energy, 366 sol-gel method, 193 solid-state, 413 solid-state electrolytes, 378 solution-processed method, 22, 379 solvothermal, 131 stainless steel, 370 stoichiometry, 374 strain sensors, 54, 103 stretchability, 437 stretchable devices, 441 stretchable piezoelectric devices, 452 stretchable strain sensors, 452 substrate configuration, 382 superstrate configuration, 382 surface/interface problem, 153 symmetric, 427 T tactile pressure sensors, 56 temperature sensors, 59 template, 440 templated synthesis, 133 terahertz, 168 thermal expansivity, 387 thin film, 366 thin-film transistors, 1 tight-binding Hamiltonian, 169 TiO 2, 207 TiO 2 nanoparticles, 326 transfer, 94 transfer printing, 146 transistor, 3, 177 transparency, 444 transparent substrates, 386 triple-junction cells, 370 two-dimensional, 438 two-step sequential deposition, 353 U UV-ozone treatment, 332 V vapor assisted solution procession, 353 vapor liquid solid, 129 vapor solid solid, 129 vapor solid (VS) mechanism, 131

5 Index 467 Visible Light and X-ray Imager, 33 volumetric capacitance, 414 volumetric energy density, 415 volumetric power density, 415 W wet chemical etching, 126 wet sensor, 48 Y Young s modulus, 90, 120 Z ZnO, 224

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