The. and its. Martin Goosey. Loughborough University

Size: px
Start display at page:

Download "The. and its. Martin Goosey. Loughborough University"

Transcription

1 The Innovative Electronics Manufacturing Research Centre and its Green Electronics Projects Martin Goosey Loughborough University

2 The Innovative Electronics Manufacturing Research Centre (IeMRC) Established in 2005 Allocated 5 million to support research in UK academia Strong industrial input in setting research agenda Currently supporting more than 30 projects Most projects have a significant industrial input

3 The IeMRC Mission To establish a Centre of Expertise through which UK industry can access and influence research in electronics manufacturing

4 Design IeMRC Research Themes Packaging, materials and technology Assembly, manufacture and test Integration of disparate technologies, including design and manufacture Reliability Business Issues Environmentally Friendly and Sustainable Electronics

5 Sustainability Meeting the needs of the present generations without compromising the ability of future generations to meet their own needs The World Commission on Environment & Development

6 Sustainability - Business Context For businesses, sustainable development means; adopting strategies and activities that meet the needs of the enterprise and its stakeholders today while protecting, sustaining and enhancing the human and natural resources that will be needed in the future

7 Electronics and Sustainability Electronics are essential to the modern way of life Traditionally, the electronics industry has not been regarded as operating sustainably; hazardous materials and processes short product lifecycles waste during manufacture and energy in use end of life issues around waste materials, pollution etc

8 Electronic Waste - the Scale of the Problem

9 Examples of Specific Legislation Various Directives and Regulations aimed at implementing Producer Responsibility in the electronics area; WEEE Directive RoHS Directive Energy using Products Directive REACH Regulations Batteries and Accumulators Directive Packaging Waste Regulations End of Life Vehicles Directive

10 Green Electronics Objectives Encourage producers to design products that: use fewer resources reduce or eliminate the use of hazardous materials use greater amounts of recyclate can be more easily treated at end of life minimise waste can be reused

11 Eco-Design A relatively new discipline addressing the whole lifecycle of the product Identifies environmental and financial opportunities Develops new products which are better eg use less materials use less energy easier to disassemble & recycle achieve legislative compliance avoid harmful materials Opens up new markets

12 Design Opportunities Design for disassembly requirement of WEEE Directive Design for energy efficiency energy rating, climate change, reduce operating costs Design for dematerialisation reduced weight, lower costs, less packaging Design for longevity buy right-buy once, higher retail prices, lower impact?

13 Design Opportunities Design for modularity future-proofing, easy repair, reuse Design for chemical safety - REACH Design for recycling extracting end value, WEEE Design for maintenance and repair extending product life Design for short-life avoids redundancy due to technological advancement

14 Electronics, Materials and Sustainability Lead Mercury Phthalates Antimony Chromium

15 PCB Materials for Lead-free Lead-free assembly means higher soldering temperatures Higher soldering temperatures can have a number of impacts; - increased stresses/thermal expansion issues - thermal degradation of materials - reliability and performance issues - new and enhanced failure mechanisms

16 Materials Opportunities Replacement of traditional materials with new ones can make products more sustainable and more profitable whilst offering enhanced performance Removal of hazardous materials makes recycling easier Use of fewer types of materials helps simplify recycling Emerging alternatives to non-renewable materials - biopolymers and degradable materials - NEC s shape memory modified PLA

17 Electronics Repurposing Convert existing electronics to a new multi-use modules

18 IeMRC Greener Electronics Activities Lithographically printed circuits, batteries and displays Sonochemical modification of surfaces Rapid identification of polymers at end of life Lead-free solders, assembly and reliability Reduced emission PCB manufacturing processes Various networking and training activities - SUMEEPnet

19 Green Electronics Projects Example 1 Brunel University

20 Printed Electronics at Brunel University Cleaner Electronics Group at Brunel working on printed electronics for many years Work currently supported by the IeMRC Wide range of printed structures demonstrated Currently working on printed batteries

21 Printed Electronics and Offset Lithography The "Conductive Lithographic Film (CLF) circuit fabrication process is a method of forming electronic circuit interconnect and components on flexible substrates via use of the offset lithographic printing process

22 CLF Demonstration Circuit Landline telephone mainboard Artwork taken from original resin laminate circuit board SMT passive components attached using conductive adhesive Microprocessor controlled thermometer Circuit interconnect, resistors, capacitors and switch actuator, all printed by offset lithography Device uses a glazed paper as the circuit substrate

23 Printed Battery Demonstrator Circuits Demonstrator printed on PolyArt substrate material Includes four cells producing a potential of 6.0 to 6.5V Incorporates printed switch pads Surface mount LEDs and resistors attached with conductive adhesive

24 Printed Electroluminescent Displays Interdigitated electrode structures formed using CLF conductive ink Electroluminescent ink deposited onto electrode structure Courtesy Darren Southee

25 Green Electronics Projects Example 2 Coventry University

26 Sonochemistry Research at Coventry Good adhesion is required at many interfaces used in electronics manufacturing, eg metals on polymers This is typically achieved by the use of aggressive and environmentally undesirable chemical processes An alternative method being developed at Coventry is to use sonochemical routes to offer more benign processes Use of ultrasonics can reduce process temperatures and generate less waste etc

27 Acoustic Cavitation - the Driving Force for Sonochemical Surface Modification Microjetting mechanical/physical attack of surface scrubbing/cleaning action destruction of boundary layers movement of reactants to, and products away from, the surface Extreme temperatures and pressures chemical/oxidative attack of the surface due to oxidative species breaking of bonds on surface of material chemical reactions on surface

28 Texturing the Surface of Noryl (PPO) Silent 20 khz Ultrasonic Probe Noryl samples textured in DI Water (40 (40 C for 60 minutes) Magnification x 500 Courtesy Andy Cobley

29 Green Electronics Projects Example 3 Surrey University

30 Plastics Recycling at Surrey University One of the barriers to polymer recycling is the identification of polymer types in mixed waste streams Needs to be made possible quickly and economically Work at Surrey has focussed on the use of multiwavelength spectroscopy coupled with MVSA for identifying plastics in real time

31 Spectroscopy combined with MVSA Visible spectral range used to obtain information relating to colour variation Near-infrared (NIR) spectral range: information relating to presence of specific functional groups MVSA unscrambles all spectral information; regression of spectral data against known materials parameters Fibre-optic probes designed for sampling in the field Non-destructive and fast technique

32 Identification of Polymers and Types Courtesy Gary Stephens

33 Plastics Characterisation Results Plastic types and grades can be identified Flame retardant content determined to better than 0.2% Polymer property variations monitored with good accuracy Influence of UV exposure can be seen Mechanical processing effects can be identified

34 Other Green Electronics Activities IeMRC is a member of SUMEEPnet sustainable use of materials in electrical and electronic products network Work with the Resource Efficiency KTN Green Electronics Design and Materials Seminars Participated in electronics recycling missions to Japan, Poland and Europe Close links with Government Agencies eg TSB Zero Emissions Programme, Envirowise, NISP, etc

35 Summary and Conclusions There is a need to move to more sustainable design and manufacturing processes in the electronics industry The IeMRC supports research in areas from design through new materials and manufacturing processes to end of life recycling Key projects on Green Electronics at several universities IeMRC Annual Conference in Loughborough on 4 th July

36 IeMRC Green Electronics Projects Martin Goosey Loughborough University

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

PCB RoHS Update OCT08 ELECTRONICS MANUFACTURING SERVICES

PCB RoHS Update OCT08 ELECTRONICS MANUFACTURING SERVICES PCB RoHS Update CT08 ELECTRNICS MANUFACTURING SERVICES 2006 Sanmina-SCI Corporation. Sanmina-SCI is a trademark of Sanmina-SCI Corporation. All trademarks and registered trademarks are the property of

More information

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Gerd Linka, (Neil Patton) Atotech Deutschland GmbH Berlin, Germany Abstract With the latest legislations from RoHS

More information

Environmentally Sound Management of E- waste: Emerging Issues, Challenges and Opportunities for Material Recovery and Recycling

Environmentally Sound Management of E- waste: Emerging Issues, Challenges and Opportunities for Material Recovery and Recycling Environmentally Sound Management of E- waste: Emerging Issues, Challenges and Opportunities for Material Recovery and Recycling Dr Sunil Herat Senior Lecturer in Waste Management & Project Leader Griffith

More information

White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients

White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients Quality from beginning to end is the principle that guides Fujitsu from the design and planning

More information

San Francisco Circuits, Inc.

San Francisco Circuits, Inc. Your Doorway to Innovation San Francisco Circuits, Inc. Bridging Concepts with Reality Flex PCB Introduction to Flex Circuits What is Flex Circuits? From Wikipedia - a technology for assembling electronic

More information

Chip-on-board Technology

Chip-on-board Technology Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing

More information

Embedding components within PCB substrates

Embedding components within PCB substrates Embedding components within PCB substrates Max Clemons, Altium - March 19, 2014 Continued pressure for electronic devices that provide greater functionality in ever-smaller formfactors is not only providing

More information

Supercapacitors. Advantages Power density Recycle ability Environmentally friendly Safe Light weight

Supercapacitors. Advantages Power density Recycle ability Environmentally friendly Safe Light weight Supercapacitors Supercapacitors also called ultracapacitors and electric double layer capacitors (EDLC) are capacitors with capacitance values greater than any other capacitor type available today. Capacitance

More information

Investigation of Components Attachment onto Low Temperature Flex Circuit

Investigation of Components Attachment onto Low Temperature Flex Circuit Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase

More information

Carbon Dioxide Membrane Separation for Carbon Capture using Direct FuelCell Systems

Carbon Dioxide Membrane Separation for Carbon Capture using Direct FuelCell Systems Carbon Dioxide Membrane Separation for Carbon Capture using Direct FuelCell Systems DFC Technology Used as Electrochemical Membrane for CO 2 Purification and Capture during Power Generation FCE s Direct

More information

European waste policy:

European waste policy: Waste: the problem European waste policy: prevention a dream? EU Waste policy: general principles and summary of legislation Waste Framework Directive - 2008 Waste Electr(on)ical Equipment 2002 and review

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

Computer Peripherals

Computer Peripherals Computer Peripherals School of Computer Engineering Nanyang Technological University Singapore These notes are part of a 3rd year undergraduate course called "Computer Peripherals", taught at Nanyang Technological

More information

Fujitsu Group s Environmental Management: Outline of Environmental Protection Program (Stage IV)

Fujitsu Group s Environmental Management: Outline of Environmental Protection Program (Stage IV) Fujitsu Group s Environmental Management: Outline of Environmental Protection Program (Stage IV) V Hideru Yamaguchi (Manuscript received March 9, 2005) Environmental activities are an important element

More information

For the modifications listed below, the Qualification Approval tests in IEC 61215 and IEC 61646, shall be used as a guideline by the assessor:

For the modifications listed below, the Qualification Approval tests in IEC 61215 and IEC 61646, shall be used as a guideline by the assessor: Product or Process Modifications Requiring Limited CBTL Retesting to Maintain Certification This document sets forth a uniform approach to maintain the certification of products that have, or will, undergo

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors

WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors Size 1206, 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxX_V12 Nov.- 2011

More information

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is

More information

TCO Certified Edge Displays 2.0

TCO Certified Edge Displays 2.0 TCO Certified Edge Displays 2.0 2 April 2014 1 (12) Contents - TCO Certified Edge Displays 2.0 INTRODUCTION... 3 A CRITERIA... 4 A.1. MINIMUM 85% RECYCLED PLASTIC CONTENT... 5 A.2. HALOGEN FREE DISPLAY...

More information

ECP Embedded Component Packaging Technology

ECP Embedded Component Packaging Technology ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous

More information

The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction

The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction SEALANTS IN BUILDING AND CONSTRUCTION Glazing Sealants (G) Construction Sealants (F) Class 25 Class 25LM Class 25 Class

More information

Product End-of-Life Disassembly Instructions

Product End-of-Life Disassembly Instructions Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP EliteBook 2540p Notebook PC Name / Model #2 Name

More information

Background on Biodegradable Additives

Background on Biodegradable Additives Background on Biodegradable Additives This document summarizes the Biodegradable Products Institute s comments on the use of additives to promote biodegradation in traditional polymers, such as PE, PP,

More information

CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS

CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using

More information

Comp-AC. ENVIRONMENTAL INFORMATION Recycling instructions for drive of type ACS 200. ABB Oy Product Support 12.11.1998 TLC/Ari Niskanen

Comp-AC. ENVIRONMENTAL INFORMATION Recycling instructions for drive of type ACS 200. ABB Oy Product Support 12.11.1998 TLC/Ari Niskanen 1 ABB Oy Product Support 12.11.1998 TLC/Ari Niskanen Comp-AC ENVIRONMENTAL INFORMATION Recycling instructions for drive of type ACS 200 Table of contents 1. Introduction 2. Product package 3. Product materials

More information

TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 1206, 0805, 0603

TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 1206, 0805, 0603 WF2Q, WF08Q, WF06Q ±%, ±0.5%, ±0.25%, ±0.%, ±0.05% TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 206, 0805, 0603 *Contents in this sheet are subject to change without

More information

It s not just about the environment

It s not just about the environment Supply Chain Consultancy It s not just about the environment Sustainable Supply Chains Paul Goose discusses the need to take a wider, more integrated view of operations to ensure long term growth. A great

More information

SAMI Microstar (SAMI MM, MD, MS)

SAMI Microstar (SAMI MM, MD, MS) 1 ABB Oy 18.2.2000 Product Support TLC/Ari Niskanen SAMI Microstar (SAMI MM, MD, MS) Recycling information for drive of type SAMI Microstar Table of contents TABLE OF CONTENTS...1 1. INTRODUCTION...2 2.

More information

INEMI 2007 Roadmap Organic Substrates. Jack Fisher, Interconnect Technology Analysis, Inc. Celestica-iNEMI Technology Forum May 15, 2007

INEMI 2007 Roadmap Organic Substrates. Jack Fisher, Interconnect Technology Analysis, Inc. Celestica-iNEMI Technology Forum May 15, 2007 INEMI 2007 Roadmap Organic Substrates Jack Fisher, Interconnect Technology Analysis, Inc. Celestica-iNEMI Technology Forum May 15, 2007 Introduction The interconnecting substrates functional role provides

More information

Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis

Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis David Bernard & Steve Ainsworth Dage Precision Industries Abstract Non-destructive testing during the manufacture of

More information

INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999

INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR 1 TABLE OF CONTENTS PAGE 1. INTRODUCTION 3 2. ADVANTAGES 4 3. LIMITATIONS 4 4. DIALECT 5 5. SIZES AND DIMENSIONS

More information

RoHS RIA November 2003

RoHS RIA November 2003 PARTIAL REGULATORY IMPACT ASSESSMENT ON DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL ON THE RESTRICTION OF THE USE OF CERTAIN HAZARDOUS SUBSTANCES IN ELECTRICAL AND ELECTRONIC EQUIPMENT

More information

Greening the rusty supply chain. Critical factors for effective GSCM. Critical factors for GSCM include:

Greening the rusty supply chain. Critical factors for effective GSCM. Critical factors for GSCM include: Article Greening the rusty supply chain Green supply chain management (GSCM) is important in enterprises achieving profit and market share objectives by reducing environmental risk and impact. It is a

More information

LO5: Understand commercial circuit manufacture

LO5: Understand commercial circuit manufacture Unit 6: Circuit simulation and manufacture LO5: Understand commercial circuit manufacture Commercial component and PCB types Instructions and answers for teachers These instructions should accompany the

More information

INNOVATIVE PLASTICS ULTRASONIC WELDING

INNOVATIVE PLASTICS ULTRASONIC WELDING INNOVATIVE PLASTICS ULTRASONIC WELDING A SABIC COMPANY Innovative Plastics is a strategic business unit of SABIC. Founded in 1976, SABIC is today the first public, global multinational enterprise headquartered

More information

Green Economy: 10 years Success Story of End-of-Life Vehicles. ECOMONDO Rimini, 9 November 2011 Speaker: Artemis Hatzi-Hull

Green Economy: 10 years Success Story of End-of-Life Vehicles. ECOMONDO Rimini, 9 November 2011 Speaker: Artemis Hatzi-Hull Green Economy: 10 years Success Story of End-of-Life Vehicles ECOMONDO Rimini, 9 November 2011 Speaker: Artemis Hatzi-Hull Outline 1. The E.L.V Directive 2. Extended Producer Responsibility in ELV 3. The

More information

Chapter 2: Forms of Energy

Chapter 2: Forms of Energy Chapter 2: Forms of Energy Goals of Period 2 Section 2.1: To describe the forms of energy Section 2.2: To illustrate conversions from one form of energy to another Section 2.3 To describe energy storage

More information

Product End-of-Life Disassembly Instructions Product Category: Personal Computers

Product End-of-Life Disassembly Instructions Product Category: Personal Computers Product End-of-Life Disassembly Instructions Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Pro 3120 Small Form Factor Business PC Purpose: The document

More information

Directive 2002/95/EC

Directive 2002/95/EC European Community legislation is reproduced from the EUR-Lex website. Only European Community's legislation printed in the Official Journal of the European Communities is deemed to be authentic. 302L0095

More information

Climate Change: A Local Focus on a Global Issue Newfoundland and Labrador Curriculum Links 2010-2011

Climate Change: A Local Focus on a Global Issue Newfoundland and Labrador Curriculum Links 2010-2011 Climate Change: A Local Focus on a Global Issue Newfoundland and Labrador Curriculum Links 2010-2011 HEALTH Kindergarten: Grade 1: Grade 2: Know that litter can spoil the environment. Grade 3: Grade 4:

More information

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road

More information

Service Overview. Chapter

Service Overview. Chapter Chapter 1 Service Overview Carefully read through this chapter for a look at various components of the Eee PC 4G (701) and necessary cautions and tools before performing any service and repairs. T o provide

More information

SiP & Embedded Passives ADEPT-SiP Project

SiP & Embedded Passives ADEPT-SiP Project System-in-Package () and the ADEPT- Project David Pedder TWI Ltd, Granta Park, Great Abington, Cambridge Copyright 2006 ADEPT- & Embedded Passives ADEPT- Project Objectives Programme Partners ADEPT- Architecture

More information

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region Solutions without Boundaries PCB Surface Finishes Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region 1 Notice Notification of Proprietary Information: This document contains proprietary

More information

Current Limiting Power Resistors for High-Power LED Module Lighting Applications

Current Limiting Power Resistors for High-Power LED Module Lighting Applications Current Limiting Power Resistors for High-Power LED Module Lighting Applications PWR263 An ongoing trend toward miniaturization of virtually all electronics is accompanied by the demand for a reduction

More information

Product End-of-Life Disassembly Instructions

Product End-of-Life Disassembly Instructions Product End-of-Life s Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP V26hz 2 inch LED Backlit Monitor Purpose: The document is intended for use

More information

Environmental problems and responses

Environmental problems and responses Environmental problems and responses Second lecture in Engineering responsibilities Spring 2003 Jette Egelund Holgaard, Department of Development and Planning, Aalborg Univers Themes Environmental problems

More information

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3 Polymer Termination An alternative termination material specifically designed to absorb greater levels of mechanical stress thereby reducing capacitor failures associated with mechanical cracking Mechanical

More information

Guidelines for designing for disassembly and recycling

Guidelines for designing for disassembly and recycling 1 de 10 Guidelines for designing for disassembly and recycling Tracy Dowie & Matthew Simon Design for Environment Research Group Department of Mechanical Engineering, Design and Manufacture Manchester

More information

Contact: Environment and Green Technologies Department Phone: 01-7272480 Email: greentech@enterprise-ireland.com www.envirocentre.

Contact: Environment and Green Technologies Department Phone: 01-7272480 Email: greentech@enterprise-ireland.com www.envirocentre. Contact: Environment and Green Technologies Department Phone: 01-7272480 Email: greentech@enterprise-ireland.com www.envirocentre.ie Enterprise Ireland August 08 (152) Eco-labels GreenTech Support Eco-labels

More information

Cleanliness of Electronic PCB Assemblies Leads to Medical Device Reliability

Cleanliness of Electronic PCB Assemblies Leads to Medical Device Reliability Cleanliness of Electronic PCB Assemblies Leads to Medical Device Reliability by Mo Ohady and David Estes, Digicom Electronics, Oakland, CA Overcoming the Potential for Failures Component manufacturers

More information

Everline Module Application Note: Round LED Module Thermal Management

Everline Module Application Note: Round LED Module Thermal Management Everline Module Application Note: Round LED Module Thermal Management PURPOSE: Use of proper thermal management is a critical element of Light Emitting Diode (LED) system design. The LED temperature directly

More information

Extended Producer Responsibility

Extended Producer Responsibility April 2007 How Producer Responsibility for Product Take-Back Can Promote Eco-Design Individual producer responsibility encourages competition between companies on how to manage the end-of-life phase of

More information

Selective Soldering Defects and How to Prevent Them

Selective Soldering Defects and How to Prevent Them Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering

More information

Environmental Benefits of Thin Computing A comparison of the environmental impacts of conventional desktop and thin computing

Environmental Benefits of Thin Computing A comparison of the environmental impacts of conventional desktop and thin computing Environmental Benefits of Thin Computing A comparison of the environmental impacts of conventional desktop and thin computing This White Paper has been prepared for Wyse Technology Inc. March 2009 Overview

More information

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP Envy 6 Purpose: The document is intended for use

More information

T5 Watt-Miser Linear Fluorescent lamps

T5 Watt-Miser Linear Fluorescent lamps GE Lighting T5 Watt-Miser Linear Fluorescent lamps DATA SHEET T5 Watt-Miser High Efficiency 13W, 20W, 26W, 33W T5 Watt-Miser High Output 21W, 36W, 46W, 51W, 76W Product information T5 Watt-Miser lamps

More information

TCO Certified Edge Displays 1.2

TCO Certified Edge Displays 1.2 TCO Certified Edge Displays 1.2 15 November 2012 1 (12) Contents - TCO Certified Edge Displays 1.2 INTRODUCTION... 3 A CRITERIA... 4 A.1. MINIMUM 65% RECYCLED PLASTIC CONTENT... 5 A.2. HALOGEN FREE DISPLAY...

More information

Product End-of-Life Disassembly Instructions Product Category: Personal Computers

Product End-of-Life Disassembly Instructions Product Category: Personal Computers Product End-of-Life Disassembly Instructions Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Pavilion p6 PC Purpose: The document is intended for use

More information

Nordic Ecolabelling. Steps

Nordic Ecolabelling. Steps Nordic Ecolabelling Steps 2001 Contents Introduction 3 1. The philosophical foundations of ecolabelling 4 The Vision 4 The road towards sustainability 4 2. Nordic Ecolabelling s strategy 6 The formulation

More information

aseries A13B Mini Bullet Camera User Manual

aseries A13B Mini Bullet Camera User Manual aseries A13B Mini Bullet Camera User Manual Thank you for purchasing our product. If there are any questions, or requests, please do not hesitate to contact the dealer. This manual applies to the MicroView

More information

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power

DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power TM - A Proprietary New Source Mounted Power Package for Board Mounted Power by Andrew Sawle, Martin Standing, Tim Sammon & Arthur Woodworth nternational Rectifier, Oxted, Surrey. England Abstract This

More information

Introduction. Focusing on marketing & sales of standard process equipment as standard systems as well

Introduction. Focusing on marketing & sales of standard process equipment as standard systems as well Introduction C-Tech is a global acting company with an experienced team of experts, having its management headquarters in the Netherlands and financial holding in Hungary Focusing on marketing & sales

More information

POINTS POSITION INDICATOR PPI4

POINTS POSITION INDICATOR PPI4 POINTS POSITION INDICATOR PPI4 Advanced PPI with Adjustable Brightness & Simplified Wiring Monitors the brief positive operating voltage across points motors when they are switched Lights a corresponding

More information

PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES

PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES By Al Wright, PCB Field Applications Engineer Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry

More information

The Anatomy of a Label

The Anatomy of a Label The Anatomy of a Label Three key elements make up a label: face stock, release liner, and adhesive. Face Stock: Face stock is the material of the label that carries the imprint. The print can be applied

More information

to realize innovative electronic products 2 June 13, 2013 Jan Eite Bullema 3D Printing to realize innovative electronic products

to realize innovative electronic products 2 June 13, 2013 Jan Eite Bullema 3D Printing to realize innovative electronic products Overview of 2 What is? Methods / Materials / Current Products Rapid Prototyping evolves to Additive Manufacturing in Electronics Manufacturing Recent developments in 3D printing at TNO Conclusions / jan_eite.bullema@tno.nl

More information

Barrier Coatings: Conversion and Production Status

Barrier Coatings: Conversion and Production Status Transparent SiO 2 Barrier Coatings: Conversion and Production Status E. Finson and J. Felts, Airco Coating Technology, Concord, CA Keywords: Permeation barrier coatings; Reactive evaporation; SiO 2 ABSTRACT

More information

Waste management and disposal:

Waste management and disposal: Waste management and disposal: A best practice business guide An ebook produced by FCC Environment 01 Waste management and disposal: a strategy for success Introduction Your guide to waste management FCC

More information

Information leaflet Printing Inks for Food Packaging

Information leaflet Printing Inks for Food Packaging Page 1 of 8 Information leaflet Printing Inks for Food Packaging 1. Introduction Food packaging is printed to provide information to the final consumer in accordance with Directive 2000/13/EC relating

More information

Hong Kong Green Label Scheme Product Environmental Criteria for Copying Machines, Printers, Fax Machines and Multifunctional Devices (GL-006-003)

Hong Kong Green Label Scheme Product Environmental Criteria for Copying Machines, Printers, Fax Machines and Multifunctional Devices (GL-006-003) BACKGROUND Hong Kong Green Label Scheme The Hong Kong Green Label Scheme (HKGLS) is an independent and voluntary scheme, which aims to identify products that are, based on life cycle analysis consideration,

More information

1. INTRODUCTION ABSTRACT

1. INTRODUCTION ABSTRACT MultiWave Hybrid Laser Processing of Micrometer Scale Features for Flexible Electronics Applications J. Hillman, Y. Sukhman, D. Miller, M. Oropeza and C. Risser Universal Laser Systems, 7845 E. Paradise

More information

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation

More information

Mounting Instructions for SP4 Power Modules

Mounting Instructions for SP4 Power Modules Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the

More information

5-Minute Refresher: WEATHERING AND EROSION

5-Minute Refresher: WEATHERING AND EROSION 5-Minute Refresher: WEATHERING AND EROSION Weathering and Erosion Key Ideas Weathering is the wearing away of the surface of rock, soil, and minerals into smaller pieces. Example of weathering: Wind and

More information

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com PIN IN PASTE APPLICATION NOTE 042106 technical expertise and application leadership, we proudly introduce the INTRODUCTION The Pin in Paste method, also called through-hole reflow technology, has become

More information

Life Cycle of Electronics

Life Cycle of Electronics What is E-waste? Discarded electronics generally referred to as 'e-waste' can include any of our electronic waste items such as CDs, DVDs and DVD players, computers, television sets, video games and cell

More information

Intervention on behalf of Denmark, Norway and Ireland on the occasion of the Open Working Group on Sustainable Development Goals meeting on

Intervention on behalf of Denmark, Norway and Ireland on the occasion of the Open Working Group on Sustainable Development Goals meeting on Intervention on behalf of Denmark, Norway and Ireland on the occasion of the Open Working Group on Sustainable Development Goals meeting on Sustainable Consumption and Production, including Chemicals and

More information

China RoHS Directive Legislation Compliance October 2011

China RoHS Directive Legislation Compliance October 2011 China RoHS Directive compliance information: China RoHS Directive Legislation Compliance October 2011 Declaration & Restriction Scope Packaging Differences to EU RoHS First Catalogue China RoHS2 1 RoHS

More information

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004 How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production

More information

SCREEN PRINTING INSTRUCTIONS

SCREEN PRINTING INSTRUCTIONS SCREEN PRINTING INSTRUCTIONS For Photo-Imageable Solder Masks and Idents Type 5600 Two Part Solder Masks and Idents Mega Electronics Ltd., Mega House, Grip Industrial Estate, Linton, Cambridge, ENGLAND

More information

Safety Certification for Lead Free Flexible and Rigid-Flex PCBs

Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Crystal Vanderpan Underwriters Laboratories Inc. March 27, 2007 Crystal Vanderpan Principal Engineer for Printed Circuit Technologies Joined

More information

Neal O Hara. Business Development Manager

Neal O Hara. Business Development Manager Neal O Hara Business Development Manager PCS OFFERING User Interface Flex Circuit Solutions Sensor Systems Multilayer Copper Flex Circuits LED Lighting 2 VERTICAL INTEGRATION FPC Connector Picoflex on

More information

Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing

Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing Introduction As consumers demand thinner, lighter, more sophisticated and durable mobile devices

More information

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica

Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production

More information

Leaders In Industrial LED Lighting Solutions. CleanLED Highbay/Lowbay. Energy Efficient LED Lighting Solutions For Industry

Leaders In Industrial LED Lighting Solutions. CleanLED Highbay/Lowbay. Energy Efficient LED Lighting Solutions For Industry Leaders In Industrial LED Lighting Solutions CleanLED Highbay/Lowbay Energy Efficient LED Lighting Solutions For Industry Introduction The Safelux Lighting CleanLED Highbay and Lowbay fixtures are high

More information

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection

More information

Product Environmental Data Management System: ECODUCE

Product Environmental Data Management System: ECODUCE Product Environmental Data Management System: ECODUCE V Masaaki Takemae (Manuscript received January 7, 2005) Environmental problems have become important topics in corporate management. The regulations

More information

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY Pavel Řihák Doctoral Degree Programme (2), FEEC BUT E-mail: xrihak02@stud.feec.vutbr.cz Supervised by: Ivan Szendiuch E-mail: szend@feec.vutbr.cz

More information

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com BGA - Ball Grid Array Inspection Workshop Bob Willis leadfreesoldering.com Mixed Technology Assembly Processes Adhesive Dispensing Component Placement Adhesive Curing Turn Boar Over Conventional Insertion

More information

ELECTRONIC TRANSISTOR IGNITION FOR CARS K2543

ELECTRONIC TRANSISTOR IGNITION FOR CARS K2543 H2543IP 1 ELECTRONIC TRANSISTOR IGNITION FOR CARS K2543 Gives your car a better starting and smoother running. Suitbale for 12V and 6V systems. Features & Specifications Even the most sceptical one has

More information

Ethical and environmental policy. Union of Brunel Students

Ethical and environmental policy. Union of Brunel Students Ethical and environmental policy Senior Management and Student Officers Version 2.0 November 2012 1 Contents Ethical and environmental policy 1. Introduction 3 2. Objectives 4 3. Environmental working

More information

T H A N K S F O R A T T E N D I N G OUR. FLEX-RIGID PCBs. Presented by: Nechan Naicker

T H A N K S F O R A T T E N D I N G OUR. FLEX-RIGID PCBs. Presented by: Nechan Naicker T H A N K S F O R A T T E N D I N G OUR TECHNICAL WEBINAR SERIES FLEX-RIGID PCBs Presented by: Nechan Naicker We don t just sell PCBs. We sell sleep. Cirtech EDA is the exclusive SA representative of the

More information

WHY AND HOW THE ENVIRONMENT HAS TO BE TAKEN INTO ACCOUNT AT THE WORLD SUMMIT ON THE INFORMATION SOCIETY, GENEVA 2003 TUNIS 2005

WHY AND HOW THE ENVIRONMENT HAS TO BE TAKEN INTO ACCOUNT AT THE WORLD SUMMIT ON THE INFORMATION SOCIETY, GENEVA 2003 TUNIS 2005 Document WSIS/PC-2/CONTR/43-E 18 December 2002 English only EPFL Working Group on the impact of ICT on the Environment WHY AND HOW THE ENVIRONMENT HAS TO BE TAKEN INTO ACCOUNT AT THE WORLD SUMMIT ON THE

More information

Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.

Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies Printers Computers Battery chargers Automotive Converters CD-ROM. QUICK

More information

Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental

More information

How To Understand The Purpose Of Life Cycle Assessment

How To Understand The Purpose Of Life Cycle Assessment Life-Cycle Assessment Lesson 1 Overview This is the first lesson on life cycle assessment in this module. In this lesson, the framework for conducting life-cycle assessments is described and examples of

More information

Application Note: PCB Design By: Wei-Lung Ho

Application Note: PCB Design By: Wei-Lung Ho Application Note: PCB Design By: Wei-Lung Ho Introduction: A printed circuit board (PCB) electrically connects circuit components by routing conductive traces to conductive pads designed for specific components

More information

TABLET DETERGENTS Towards A More Sustainable Future

TABLET DETERGENTS Towards A More Sustainable Future TABLET DETERGENTS Towards A More Sustainable Future Unilever Supports Sustainable Development of Detergents with Tablets THE CONTRIBUTION OF TABLETS Unilever is committed to meeting the needs of customers

More information