Mini USB Header USCAR 30

Transcription

1 Product Specification SEP 13 Rev A Mini USB Header USCAR SCOPE This specification covers the performance, tests and quality requirements on a Mini-USB 180 Vertical PCB header, part number [ ] to transfer data-rates up to 480 Mbit/s. 2. DESCRIPTION Figure 1 Vertical PCB Header This connector system provides a vertical board mount option for connectivity of mini B USB cables assemblies for use in infotainment applications. It is comprised of a vertical plug connector with straight solder tails, solder nails to ensure a reliable mechanical connection to the PCB, and is available in a variety of keying/color options per 999-U-USB-Z APPLICABLE DOCUMENTS Applicable portion of the following documents form a part of the specification, to the extent indicated herein. In the event of conflict between the requirements of the specification and the product drawing, the product drawing shall take precedence : Application-Specification (Mini USB B USCAR30) TEC Component Heat Resistance to Lead-Free Reflow Soldering- CONDITION B SAE/USCAR-30 Mechanical, Environmental, and RF, HF tests USB 2.0 (ECN#1) 10/20/2000 Electrical, RF and HF tests IPC/JEDEC J-STD-020d.1 Reflow Solderability 4. REQUIREMENTS The introduced data transmission system supports the transfer of USB or LVDS data as described in USB DESIGN AND CONSTRUCTION All components of this product line shall be of design, construction and physical dimensions specified in the applicable product drawings. The connector will adhere to the design constraints of USB 2.0 and SAE/USCAR-30. The header shroud will adhere to the design requirements of SAE/USCAR30 and 999-U-USB-Z Tyco Electronics Corporation, a TE Connectivity Ltd. company All Rights Reserved Indicates Change 1 of 6 *Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or company names may be trademarks of their respective owners.

2 6. MATERIALS Descriptions for materials: Contacts: Copper Alloy Plating, contact interface: gold over nickel Plating, solder tails: tin over nickel Insulator: LCP GF30 Shield: Copper Alloy Plating: nickel Housing/Shroud: PCT GF30 Solder Nail: Brass Plating: tin over nickel 7. RATINGS Current: 1.0 Ampere Voltage: 30 VAC RMS max Operating temperature: -40 C to +85 C or +105 C Insulation resistance: 100MΩ Contact capacitance: 2pF max unmated/contact High speed signalling data rate: 480 Mbit/s 8. GEOMETRY AND PIN OUT Contact Number Signal Name Typical Wiring Assignment 1 VBUS Red 2 D- White 3 D+ Green 4 ID Not connected 5 GND Black Shell SHIELD Drain Wire Pin 5 Pin 1 Figure 2 Rev A 2 of 6

3 9. SYSTEM COMPONENTS 9.1. Header Chapter Direction Contact Type TE-PN Type of Fixation Thumbnail Notes TH Solder Nail, Gen 2 -reflow solderable Table TH - Header The 180 TH - Header serves to connect the PCB and the Mini-USB-Plug cable assembly. Ganging features on either side of the header allow multiple headers to be joined and locked together. A catch on the header ensures positive latching to a mini B plug. Solder nails ensure the header is secured firmly to the PCB and provide mechanical strength to the header system. Rev A 3 of 6

4 10. SYSTEM REQUIREMENTS Tests TEST ITEM REQUIREMENTS PROCEDURE Dimensional Inspection Meets requirements of product drawing EIA and TE specifications Visual Inspection No physical damage MECHANICAL Durability Audible Click No physical damage shall occur after 10 cycles SAE/USCAR-30 / EIA Mate and unmate connector assemblies for 10 cycles at speed of 200 cycles/hour 7dB above the recorded ambient for unconditioned parts and 5dB 1. Measure/record db (A) level of the for conditioned parts ambient sound (must be between 30 and 50 db (A)) 2. Sound measuring device or microphone located 600+/-50mm from the connector. 3. Mate connectors in group 1 by hand and measure the db (A) level of the sound as the lock engages. Do not bias the connectors toward or away from the latch as they are engaged. 4. Repeat Steps 1 through 3 using the group 2 connectors, post moisture conditioning. Parts are brought to their practical limit of moisture content by exposing dry as molded parts to 95-98% Relative Humidity at 40ºC for 6 hours (minimum), then completing the test within 30 minutes. Mating Force Mating 45N EIA Shall be measured with Tension gauge or Tension tester. Measure force necessary to mate assemblies at rate of 12.5mm per minute. Unmating Force Unmating w/ lock engaged 110N Unmating w/ lock disengaged 45N EIA Shall be measured with Tension gauge or Tension tester. Measure force necessary to un-mate assemblies at rate of 12.5mm per minute. Polarization Drop Test Vibration Minimum of 90N. Test ensures that the polarization feature(s) is adequate to meet its intended purpose of preventing incorrect mating of a connector housing with its intended mate, and preventing mating of a connector housing with any unintended mate. Samples shall meet the acceptance criteria of SAE/USCAR-30, 5.1.8, visual. No loss of electrical continuity 1 7 Ω when mated USB connectors are subjected to test. Engage the connector halves at a rate not to exceed 50mm/min until a force of 3X the value of a properly mated connector (with force being >60N and <150N) is applied. Hold force for 3 seconds. For each group, drop one sample at a time once and only once onto a horizontal concrete surface from a height of at least 1 meter, dropping in X, Y and Z orientation for each group. EIA Test Condition V1, test letter A (components not coupled to engine). Subject mated connectors to 5.35 G's rms fifteen minutes in each of three mutual perpendicular planes. Mechanical Shock No loss of electrical continuity 1 7 Ω when mated USB connectors are subjected to test. EIA Test Condition V1, test letter A (components not coupled to engine). Subject mated samples to 10 shocks per axis, 1/2 sine wave shape, positive direction, 11 ms duration 30 Gs halfsine shock pulses. Three shocks in each direction applied along three mutually perpendicular planes for a total of 18 shocks. Table 2 (cont d) Rev A 4 of 6

5 TEST ITEM REQUIREMENTS PROCEDURE ENVIRONMENTAL Thermal Shock No loss of electrical continuity 7 Ω Shall meet the requirements of low EIA Subject samples to C and +85 C. (30 minutes level contact resistance of 50m Ω max duration per cycle once when 20mv max open each temperature range) circuit and 100mA Temp. / Humidity Cycling Shall meet the requirements of low EIA level contact resistance of 50m Ω max Subject samples to 40 cycles of 8 when 20mv max open hours each between -40 C to +85 C circuit and 100mA and 0%-95% RH High Temp. Exposure Resistance to reflow soldering heat Shall meet the requirements of low level contact resistance of 50m Ω max when 20mv max open circuit and 100mA Samples shall show no sign of blisters, deformation/warpage, melting or physical damage detrimental to product performance when 30X magnification Subject samples to 85 C for 1008 hours. TEC , Test Method A (with moisture 168 hours, 85 C, 85% RH) Condition B - Peak Reflow C Average ramp rate: 3 C per second Preheat temperature (minimum): 150 C Preheat temperature (): 200 C Preheat time: 60 to 180 seconds Ramp to peak: 3 C per second Time over liquidus (217 C): 60 to 150 seconds Peak temperature: /-5 C Time within 5 C of peak: 20 to 40 seconds Ramp - cool down: 6 C per second Time 25 C to peak: 8 minutes Header Impedance RF ELECTRICAL 90 Ω ±15% - measured w/ cable assembly Per USB 2.0, Table 6-7 Header Attenuation Low Level Contact Resistance Up to 5.8 db 400 MHz, per table 7-6 of USB measured w/ cable assembly ELECTRICAL 50 m Ω max when 20mv max open circuit and 100mA Per USB 2.0, Table 6-7 EIA SAE/USCAR Contact Current Rating VAC min EIA Method B USB 2.0, Table 6-7 When measured at an ambient temperature of 25 C. With power applied to the contacts, the Δ T must not exceed +30 C at any point in the USB connector under test. Insulation Resistance 100M Ω min EIA Test between adjacent contacts of mated and unmated connector assemblies. Dielectric Withstanding Voltage 500 VAC min for one minute EIA Test between adjacent contacts of mated and unmated connector assemblies. Contact Capacitance 2 pf max unmated per contact. EIA Table 2 (end) Rev A 5 of 6

6 11. QUALIFICATION AND REQUALIFICATION TEST SEQUENCE The test sequences for mechanical tests, environmental tests and cable assembly electrical tests are shown in the respective TE Connectivity specifications (See Section 3) Requalification Testing Modifications of form, fit or function made to the product or to the manufacturing process will require a partial requalification of the product Sample Selection The samples shall be prepared in accordance with product drawings. They shall be selected at random from current production. The number of test samples has to be chosen according to SAE/USCAR Acceptance Acceptance is based on verification that the product meets the requirements of this product specification. Failures attributed to equipment, test setup or operator deficiencies shall not disqualify the qualification. If product failures occur, corrective action shall be taken. The qualification has to be verified again. Rev A 6 of 6