EVERCLEAR* Connectors and

Transcription

1 EVERCLEAR* Connectors and Applcaton Specfcaton QSFP+ Enhanced EVERCLEAR SMT Connectors 23 Mar 11 Rev B All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of [+.005] and angles have a tolerance of +2_. Fgures and llustratons are fordentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the requrements for applcaton of EVERCLEAR connectors and QSFP+ Enhanced EVERCLEAR Surface Mount Technology (SMT) connectors. These connectors nterconnect wth fber optc or copper transcever modules to host prnted crcut (pc) boards used n the communcatons ndustry and perpheral component nterconnect (PCI) applcatons. The connectors are compatble wth QSFP, QSFP+, and Mn--SAS applcatons. The connector s a housng wth rght--angle surface mount contacts and s avalable n 26, 36, and 38 postons for EVERCLEAR connectors and 38 postons for QSFP+ Enhanced EVERCLEAR connectors wth contact spacng on 0.8 mm centerlnes. The algnment posts provde stablty for placement of the connector on the host pc board. The standoffs allow easy pc board cleanng after solderng, and the card entry slot accepts mm--thck ntegrated crcut card housed n the transcever. The connector s suppled n tape--mounted form for manual or hgh--speed automatc machne placement (typcally vacuum pck and place). When correspondng wth TE Connectvty Personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. EVERCLEAR Connector Card Entry Slot Housng Standoff (4 Plc) Surface Mount Contacts (2 Rows) QSFP+ Enhanced EVERCLEAR Connector Algnment Posts (2 Plc) Fgure 1 Standoff (4 Plc) Surface Mount Contacts (2 Rows) E2011 Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company TOOLING ASSISTANCE CENTER All Rghts Reserved PRODUCT INFORMATION TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. *Trademark. Other logos, product and/or Company names may be trademarks of ther respectve owners. Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at 1 of 9 LOC B

2 2. REFERENCE MATERIAL 2.1. Revson Summary S Updated document to corporate requrements Customer Assstance Reference Product Base Part Number for EVERCLEAR Connectors and for QSFP+ Enhanced EVERCLEAR Connectors, and Product Codes L760 and K845 are representatve of the EVERCLEAR Connector. Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product and toolng nformaton. Such nformaton can be obtaned through a local TE Representatve or, after purchase, by callng Product Informaton at the number at the bottom of ths page Drawngs Customer drawngs for product part numbers are avalable from the servce network. If there s a conflct between the nformaton contaned n the customer drawngs and ths specfcaton or wth any other techncal documentaton suppled, the nformaton n the customer drawngs takes prorty Manuals Manual can be used as a gude to solderng. Ths manual provdes nformaton on varous flux types and characterstcs wth the commercal desgnaton and flux removal procedures. A checklst s ncluded n the manual as a gude for nformaton on solderng problems Specfcatons Product Specfcaton (EVERCLEAR Connector) provdes product performance and test nformaton; and Desgn Objectve (QSFP+ Enhanced EVERCLEAR Connectors) provdes expected product performance and test nformaton Instructonal Materal Instructon Sheets (408--Seres) provde assembly nstructons. Documents avalable whch pertan to ths product are: Document Number Document Ttle QSFP Connector, Thru Bezel Cage Assembles, Heat Snks and Lght Ppes QSFP Connector, Behnd Bezel Cage Assembles, Heat Snks and Lght Ppes Handlng of Reeled Products 3. REQUIREMENTS 3.1. Safety Do not stack product shppng contaners so hgh that the contaners buckle or deform Lmtatons The connectors are desgned to operate n a temperature range of --55 C to 105 C [--67 F to 221 F] Materal The connector housng s made of lqud crystal polymer (LCP) thermoplastc, UL 94--V--0. The contacts are made of copper alloy underplated wth nckel; plated wth tn on the solder tals, and plated wth gold or gold equvalent at the nterface area Storage A. Ultravolet Lght Prolonged exposure to ultravolet lght may deterorate the chemcal composton used n the connector materal. B. Shelf Lfe The connectors should reman n the shppng contaners untl ready for use to prevent deformaton to the contacts. The connectors should be used on a frst n, frst out bass to avod storage contamnaton that could adversely affect performance. 2 of 9 Rev B

3 C. Reeled Products Connectors are suppled n reels on carrer tapes approved n EIA These reels have a dameter of 330 wth 400 connectors per reel. Col wound reels must be stored horzontally and traverse wound reels vertcally. Refer to Secton 5, TOOLING for carrer tape dmensons. D. Chemcal Exposure Do not store connectors near any chemcal lsted below as they may cause stress corroson crackng n the contacts. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates 3.5. Host PC Board A. Materal and Thckness The host pc board materal shall be glass epoxy (FR--4 or G--10). The pc board thckness shall be a mnmum of 1.44 mm for mountng the connector to one sde of the pc board, and the pc board thckness must be 2.2 mm mnmum for QSFP and QSFP+ applcatons and 4.5 mm mnmum for Mn--SAS applcatons when mountng the connector to both sdes of the pc board. Contact PRODUCT INFORMATION at the number lsted at the bottom of page 1 for sutablty of other board materals. B. Tolerance Maxmum allowable bow of the mother board shall be 0.08 mm over the length of the cage assembly. The coplanarty of the pc board crcut pads must be 0.03 mm. C. Crcut Pads The crcut pads must be solderable n accordance wth EIA D. Layout All holes and crcut pads must be precsely located on the pc board to ensure proper placement and optmum performance of the connector. Refer to the specfc customer drawng for the recommended pc board layout Solder Paste Characterstcs 1. Alloy type for tn--lead solder shall be 63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag. 2. Alloy type for lead--free solder shall be compatble wth pure tn or gold, for example, SAC305 (96.6 Sn/3 Ag/0.5 Cu) or SAC405 (95.5 Sn/4 Ag/0.5 Cu) 3. Flux ncorporated n the paste shall be rosn, mldly actve (RMA) type. 4. Paste wll be at least 80% solds by volume. 5. Mesh desgnaton to +325 (74 to 44 square mcron openngs, respectvely). 6. Mnmum vscosty of screen prnt shall be 5X10% cp (centpose). 7. Mnmum vscosty of stencl prnt shall be 7.5X10% cp (centpose) Solder Volume Mnmum solder volume (V) (before curng) for each crcut pad s calculated by multplyng the pad length (L) by the pad wdth (W) by the stencl thckness (T): 1.8(L) x 0.35(W) x 0.15(T) = mm 3 (V). Solder volume for each connector must be 0.15 mm 3 per contact solder lne. Rev B 3 of 9

4 Solder volume may vary dependng on solder paste composton Solder Paste Thckness Solder paste thckness for the connector contact solder tnes must be at least 0.15 mm Stencl The stencl aperture s determned by the crcut pad sze and stencl thckness. It may be any shape as long as t prevents solder brdgng from one pad to another. Generally, the thnner stencl wll need a larger aperture to mantan the gven volume of solder paste. The stencl should be 0.15 mm thck. The stencl layout must be desgned usng the dmenson provded on the customer drawng for the specfc connector Solder Mask When solderng, solder mask s recommended between all crcut pads to mnmze solder brdgng between pads. The mask must not exceed the heght of the pad. If a trace s run between adjacent pads on the pc board, a solder mask MUST be appled over the trace to prevent brdgng and wckng of solder away from the connector contact solder tnes. Mask most sutable s Lqud Photo Imageable. CAUTION All traces must be covered by solder mask n the solder depost area. Exposed traces could cause brdgng and create a short, or wck solder away from the solder tnes, producng a weak solder jont Connector Placement CAUTION Connectors should be handled only by the housng to avod deformaton, contamnaton, or damage to the contact solder tnes. CAUTION The connector must be soldered to the host pc board before seatng the cage assembly. The solderng process wll cause damage to the cage assembly or sheld assembly. A. Regstraton The connector contact solder tnes must be algned wth matchng crcut pads and algnment posts algned wth matchng holes before placng the connector onto the host pc board. B. Poston Optmally, the contact solder tnes should be centered on the host pc board crcut pads. However, slght msalgnment s permssble. C. Seatng Because the connector algnment posts are for clearance and ft only, the force requred to seat the connector s mnmal. The algnment posts must be nserted nto the host pc board holes pror to fully seatng solder tnes nto solder paste. See Fgure 2. Standoff (4 Plc) PC Board Connector Contact Solder Tnes Seated on Crcut Pads Algnment Posts (2 Plc) Inserted Into Holes n PC Board Fgure 2 4 of 9 Rev B

5 D. Placement by Vacuum Pckup In order to facltate use of a vacuum pck and place tool, the locaton of the centrod of the rght--angle connectors s defned n the table n Fgure 3. X Y Card Entry Slot QSFP+ Enhanced POSITION EVERCLEAR CONNECTOR EVERCLEAR Connector X Y Weght Fgure Solderng A. Process The connector must be soldered usng non--focused nfrared (IR) reflow or equvalent solderng technque. When mountng to both sdes of the host pc board, adhesve must be appled to the algnment posts to retan the nverted part whle gong through the second pass reflow process. (Other optons are mechancal retenton wth pallets or thermal shelds to prevent the solder from turnng to a lqud state.) Reflow temperature and tme may vary dependng on the sze of the host pc board and placement of other components. The reflow temperature and approxmate tme to whch the connector can be subjected s specfed n Fgure 4. CAUTION For double -sded SMT applcatons, the connector must be fastened to the pc board by adhesve or other mechancal methods as t passes through the reflow process n the nverted poston. Excessve temperatures may cause connector housng degradaton or platng deteroraton. It s recommended that component temperatures not exceed 230 C [446 F] when usng tn -lead solder and 260 C [500 ] when usng lead -free solder. Rev B 5 of 9

6 Reflow Solderng Process Cycle Tn -Lead Solder (Maxmum 230_C [446_F] for 20 Seconds) 230_C [446_F] Solder Wll Begn to Reflow at 183_C [361_F] Peak Dwell 20 Seconds 160_C [320_F] Ambent Rate 110_C [230_F] Ambent Rate 20_C[68_F] Ramp-Up Reflow Cool-Down 30 Seconds 3_C [37.4_F] Per Second Equalzaton 100 Seconds 0.5_C[33_F] Per Second 45 Seconds 3_C [37.4_F] Per Second More Than 3 Mnutes 3_C [37.4_F] Per Second Pre -Heat Solderng Soldfcaton 250_C [482_F] 200_C [392_F] 150_C [302_F] 100_C [212_F] 50_C [122_F] Lead -Free Solder (Maxmum 260_C [500_F]) Solder Wll Begn to Reflow at 218_C [424_F] Entry Zone #1 #2 #3 #4 #5 #6 #7 # Tme (Seconds) Fgure 4 B. Cleanng After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder and flux for recommended cleanng solvents. Cleaners must be free of dssolved flux and other contamnants. It s recommended cleanng the host pc board on ts edge. If usng aqueous cleaner, standard equpment such as a soak--tank or an automatc n--lne machne should be used. Common cleanng solvents that wll not affect the connector for the tme and temperature specfed are lsted n Fgure 5. 6 of 9 Rev B

7 DANGER Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Refer to the manufacturer s Materal Safety Data Sheet (MSDS) for characterstcs and handlng of cleaners. Trchloroethylene and Methylene Chlorde s not recommended because of harmful occupatonal and envronmental effects. Both are carcnogenc (cancer -causng). If a partcular cleanng solvent that s not lsted, contact PRODUCT INFORMATION at the number at the bottom of page 1. NAME CLEANER TIME TEMPERATURE TYPE (Mnutes) (Maxmum) ALPHA2110 Aqueous 1 132_C [270_F] Isopropyl Alcohol Solvent 5 100_C [212_F] KESTER5778 Aqueous 5 100_C [212_F] KESTER5779 Aqueous 5 100_C [212_F] LONCOTERGE520 Aqueous 5 100_C [212_F] LONCOTERGE530 Aqueous 5 100_C [212_F] C. Dryng Fgure 5 When dryng cleaned assembles and host pc boards, make certan that temperatures do not exceed 85 C [185 F]. Excessve temperatures may cause connector housng degradaton Checkng Installed Connector All solder jonts must conform to those specfed n Workmanshp Specfcaton and all other requrements specfed n ths document. The nstalled connector must have solder fllets evenly formed around each contact solder tne. Solder must have 95% mnmum coverage over the crcut pad. See Fgure 6. Contact Solder Tne Must Not Be Deformed 95% Mnmum Solder Coverage Over Crcut Pad Solder Fllet Must Be Evenly Formed wth No Vsble Cracks Fgure Removal and Repar Standard de--solderng methods must be used to remove the connector from the host pc board. CAUTION The connector must not be re -used after removal. The connector s not reparable. Any defectve or damaged products must not be used. 4. QUALIFICATIONS EVERCLEAR and QSFP+ Enhanced EVERCLEAR connectors are Recognzed by Underwrters Laboratores, Inc. (UL) n Fle E Rev B 7 of 9

8 5. TOOLING (Fgure 7) No toolng s requred for manual placement of the connectors onto the pc board. For automatc machne placement, the robotc equpment must have a true poston accuracy tolerance suffcent to properly locate the connector. Ths ncludes grpper and fxture tolerances as well as equpment repeatablty. It must use the connector datum surfaces to ensure relable placement. 26 -Poston Tape B Robotc Equpment A A B USER DIRECTION OF UNREELING SECTION B -B and 38 -Poston Tape B SECTION A -A A A A.01 B USER DIRECTION OF UNREELING SECTION B -B SECTION A -A Fgure 7 8 of 9 Rev B

9 6. VISUAL AID Fgure 8 shows a typcal applcaton of an EVERCLEAR Connector. Ths llustraton should be used by producton personnel to ensure a correctly appled product. Applcatons whch DO NOT appear correct should be nspected usng the nformaton n the precedng pages of ths specfcaton and n the nstructonal materal shpped wth the product or toolng. HOUSING MUST NOT BE DEFORMED OR DAMAGED IN ANY WAY ALIGNMENT POSTS MUST BE FULLY INSERTED INTO MATCHING PC BOARD HOLES CONTACT SOLDER TINE MUST NOT BE DEFORMED SOLDER TINES MUST BE SEATED ON CIRCUIT PADS SOLDER FILLET MUST BE EVENLY FORMED WITH NO VISIBLE CRACKS Fgure 8 Rev B 9 of 9