LTC V Micropower Synchronous Boost Converter FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION

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1 LTC359 1V Micropower Synchronous Boost Converter FEATURES n Small Solution Size n >85% Effi ciency over Wide Load Range n Internal Synchronous Rectifi er n Range: V to 5.5V n 5V at 3mA from 3.3V Input n 3.3V at 2mA from 2 AA Cell Input n Programmable Output Voltages Up to 1V n Burst Mode Operation n Inrush Current Limiting n Output Disconnect in Shutdown n Ultralow Quiescent (1μA) and Shutdown (<1μA) Currents n Low Profi le 2mm 2mm DFN, 2mm 3mm DFN or SOT-23 Package APPLICATIONS n General Purpose Micropower Boost n Digital Cameras n PDAs n LCD Bias n Small OLED Displays n Supercap Charging DESCRIPTION The LTC 359 is a low current, high efficiency synchronous boost converter intended for low power, size constrained portable applications. The LTC359 can be powered from a single lithium ion battery, a 2- to 3-cell stack of alkaline or nickel batteries, or any low impedance voltage source between V and 5.5V. The output is programmable via an external divider between 2.5V and 1V. Although the part is primarily intended for boost applications, will maintain regulation below (at reduced efficiency). The LTC359 offers Burst Mode operation with a fixed peak current, providing high conversion efficiency over a wide range of load currents. During start-up, inductor current is controlled preventing the inrush surge current found in many boost converters. In shutdown the output is disconnected from the input and quiescent current is reduced to <1μA. The LTC359 is offered in low profile -pin 2mm 2mm DFN, 2mm 3mm DFN or SOT-23 (ThinSOT TM ) packages, allowing a tiny footprint for the total solution., LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION 5V to 8V Converter Effi ciency μh 1 9 = 5V = 8V 5V 1μF OFF ON LTC359 2M 7pF SHDN FB 35k.7μF 8V 3mA EFFICIENCY (%) TA1a I LOAD (ma) 359 TA1b 1

2 LTC359 ABSOLUTE MAXIMUM RATINGS Referred to (Note 1), FB Voltage....3V to 7V, SHDN Voltage....3V to 1V Voltage....3V to 12V Operating Temperature Range (Notes 2, 3)... C to 85 C Storage Temperature Range... 5 C to 15 C Reflow Temperature... 2 C Lead Temperature, S Package (Soldering, 1 sec)... 3 C PIN CONFIGURATION SHDN TOP VIEW 7 5 FB SHDN FB TOP VIEW FB 3 TOP VIEW 5 SHDN DC PACKAGE -LEAD (2mm 2mm) PLASTIC DFN T JMAX = 125 C, θ JA = 12 C/W EXPOSED PAD (PIN 7) IS, MUST BE SOLDERED TO PCB DCB PACKAGE -LEAD (2mm 3mm) PLASTIC DFN T JMAX = 125 C, θ JA = C/W EXPOSED PAD (PIN 7) IS, MUST BE SOLDERED TO PCB S PACKAGE -LEAD PLASTIC TSOT-23 T JMAX = 125 C, θ JA = 192 C/W ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC359EDC#PBF LTC359EDC#TRPBF LDTG Low Profi le (2mm 2mm) Plastic DFN C to 85 C LTC359EDCB#PBF LTC359EDCB#TRPBF LDMM Low Profi le (2mm 3mm) Plastic DFN C to 85 C LTC359ES#PBF LTC359ES#TRPBF LTAHA Low Profi le SOT-23 C to 85 C Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based fi nish parts. For more information on lead free part marking, go to: For more information on tape and reel specifi cations, go to: 2

3 ELECTRICAL CHARACTERISTICS LTC359 The l denotes the specifi cations which apply over the full operating temperature range, otherwise specifi cations are at T A = 25 C. = 3.3V, = 5V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS Input Voltage Range l 5.5 V Quiescent Current SHDN = V CC 1 2 μa Shutdown Current SHDN =.1 1 μa Programmable Voltage Range l V Quiescent Supply Current SHDN = V CC 2 μa Shutdown Current SHDN =.1 1 μa Reference Feedback Voltage = 3.3V, = 7.5V l V FB Input Leakage Current Measured on FB 1 5 na Converter Performance Peak Switch Current ( = 3.3V) l 75 9 ma t OFF Timer ( = 3.3V, = 5V) Varies by 1/( ) 5 55 ns Zero Current Comparator Threshold ma Main NMOS Switch On-Resistance = 5V 2.8 Ω Leakage Current V ITCH = 1V, = 1V.1 1 μa Main PMOS Switch On-Resistance = 5V.2 Ω Leakage Current = 5V, V ITCH = 5V, = V.2 2 μa Logic Inputs SHDN Threshold (Rising Edge).3 1 V SHDN Hysteresis 8 mv SHDN Input Leakage Current SHDN = 3.3V 5 na Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC359E is guaranteed to meet performance specifi cations from C to 85 C. Specifi cations over the C to 85 C operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 3: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125 C when overtemperature protection is active. Continuous operation above the specifi ed maximum operating junction temperature may impair device reliability. 3

4 LTC359 TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25 C, unless otherwise noted). R OUT (Ω) Minimum R OUT vs Maximum P OUT vs vs Temperature and Quiescent Current = 1V = 7.5V = 5V = 3.3V P OUT (mw) = 1V = 7.5V = 5V = 3.3V (μa) 1 VIN = 3.3V 1 = 5V I IN I OUT (V) (V) TEMPERATURE ( C) 359 G1 359 G2 359 G3 FREQUENCY (MHz) Switching Frequency N-Channel and P-Channel vs at Various s Regulation vs and C OUT MOSFET R DS(ON) vs Temperature = 1V = 7.5V = 5V = 3.3V % CHANGE IN μF 1μF μf 7μF = 5V R DS(ON) (Ω) = 5V PCH NCH (V) (V) TEMPERATURE ( C) G 359 G5 359 G 1.2 Shutdown Threshold Voltage vs Temperature Burst Cycle Switch Pin Waveform SHUTDOWN THRESHOLD VOLTAGE (V) SHDN RISING SHDN FALLING TEMPERATURE ( C) = 3.3V = 5V 1μs/DIV 359 G8 = 3.3V = 5V 1ns/DIV 359 G9 359 G7

5 LTC359 TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25 C, unless otherwise noted). AC Ripple Burst Cycle Burst Cycle 5mV/DIV = 3.3V = 5V C OUT =.7μF C FF = 7pF 5μs/DIV 359 G1 = 5V = 1V 1μs/DIV 359 G11 = 2V = 1V 1μs/DIV 359 G12 Regulated Below Burst Cycle Shorted Output Start-Up VOLTAGE INPUT = 5V = 3.5V 1μs/DIV 359 G13 = 5V = V 5ns/DIV 359 G1 = 3.V = V TO 8V C IN = 2.2μF 25μs/DIV 359 G15 Load Steps Load Steps AC RIPPLE 5mV/DIV WITH 5kΩ (TRACE 2 GROUNDED) TO 5Ω (TRACE 2 = 5V) AC RIPPLE 5mV/DIV WITH 5kΩ (TRACE 2 GROUNDED) TO 5Ω (TRACE 2 = 5V) = 3.V = 8V C OUT =.7μF C FF = 7pF 1μs/DIV 359 G1 = 3.V = 8V C OUT =.7μF C FF = 7pF 1μs/DIV 359 G17 5

6 LTC359 PIN FUNCTIONS (DC/DCB/S Packages) (Pin 1/Pin /Pin ): Input Supply Pin. Bypass with a low ESR, ESL ceramic capacitor of at least 1μF. (Pin 2/Pin 2/Pin 5): Regulated Output Voltage of the Boost Regulator. Bypass with a low ESR, ESL ceramic capacitor between 2.2μF and 1μF. ripple increases with smaller capacitors. SHDN (Pin 3/Pin 1/Pin ): Master Shutdown Input. Driving SHDN low disables all IC functions and reduces quiescent current from the battery to less than 1μA. This pin must be pulled above 1V to enable the IC. FB (Pin /Pin 3/Pin 3): Input to the Burst Mode Comparator. An external resistor divider connected between, and this pin sets the output voltage to: = 1.(1 + R1/R2) (Pin 5/Pin 5/Pin 2): Signal and Power Ground. Provide a short, direct PCB path between and the ( ) side of the filter capacitors on and. (Pin /Pin /Pin 1): Switch Pin. Connect a 15μH to 33μH inductor between and. Keep PCB trace lengths as short and wide as possible to reduce EMI and voltage overshoot. If the inductor current falls to zero, the internal P-channel MOSFET synchronous rectifier is turned off to prevent reverse charging of the inductor. Exposed Pad (Pin 7/Pin 7, DC and DCB Packages Only): Ground. The Exposed Pad must be soldered to PCB. BLOCK DIAGRAM V CC t OFF TIMER Q SD t OFF I PEAK V SELECT + P/~N I ZO Q S QB RD S Q V SELECT QB R THERMAL SD SLEEP DELAY I ZO I ZERO DETECT V BEST P-DRIVE 1 RD QB V CC I PEAK DETECT V BEST HYSTCOMP + V CC FB R1 R2 SDB N-DRIVE N-DRIVE REFOK REFERENCE P-DRIVE SD SD SDB SHDN OFF ON 359 BD

7 OPERATION Operation The LTC359 synchronous boost converter utilizes a Burst Mode control technique to achieve high effi ciency over a wide dynamic range. A 2.5% accurate comparator is used to monitor the output voltage ( ), if is above the comparator threshold, no switching occurs and only quiescent current (1μA) is drawn from the power source. When drops below the comparator threshold, switching commences and the output capacitor is charged. During the on time of the switching period, inductor current is ramped through an internal N-channel MOSFET to until a peak current (75mA) is detected. A P-channel MOSFET connects the inductor to during the off time delivering energy to the load. The off time is controlled by an internal timer which is proportional to 1/( ). Anticross conduction circuitry ensures the N- and P-channel switches are never on simultaneously. Only three power components and two feedback resistors are required to complete the design of the boost converter, an external Schottky diode is not required. The high operating frequency allows the use of low value, low profile inductors and tiny external ceramic capacitors. The boost LTC359 converter disconnects from during shutdown to avoid loading the input power source. Peak Current Overshoot The LTC359 s peak current comparator has a delay of approximately 1ns from the time inductor current reaches current limit until the internal N-channel MOSFET turns off. This delay causes the peak current to overshoot based on the inductor value and, as follows (Figure 2 is based on a 5mA initial I LIMIT ). I I ns V PEAK LIMIT 1 L = +( ) t OFF Timer The LTC359 s t OFF timer is designed to keep the inductor current continuous during a Burst Mode switching packet, thereby increasing current capability at the output. A larger inductor value will have lower peak-to-peak current ripple, increasing the available current to the load. This improvement is offset somewhat by the reduced I PEAK overshoot. The t OFF timer is designed to maintain a relatively constant peak-to-peak current in the inductor despite changes. IN ~5mV P-P AC RIPPLE I PEAK t OFF t OFF t OFF ~1mA t OFF N P N P N P N P N P N BURST ON I ZERO WAIT SLEEP BURST ON Figure 1. Inductor Current and Ripple Waveforms 359 F IPEAK (ma) μH μh 33μH toff (μs) (V) 359 F (V) 359 F3 Figure 2. Typical I PEAK Values Figure 3. t OFF Times 7

8 LTC359 OPERATION This is accomplished by varying the t OFF period by approximately 1/( ). Due to propagation delays and a.μa bias current in the timer, the t OFF time can be more accurately predicted as follows: t OFF 8. pf 125. V 1ns+ A. μ + V 5k If is less than, the t OFF delay is fixed at approximately 75ns. IN APPLICATIONS INFORMATION Inductor Selection An inductor with a minimum value of 15μH is recommended for use with the LTC359. Values larger than 15μH will result in lower ripple current and switching frequency. High frequency ferrite core materials are strongly recommended. Some inductors meeting these requirements are listed in Table 1. Table 1. Example Inductors VENDOR/PART Chip Inductors Murata LQH31C LQH32C-Low Profile L (μh) Taiyo Yuden LB Toko LLB Coilcraft DO331 DO1T Sumida CMDD CDRJ2D1BLD DCR (Ω)/ I MAX (ma) 3/1.7/25.7/13 1/15 1.7/85 1.7/18 2.5/1 3.8/13.8/5 1.2/5./7.5/5.7/5.5/.8/3 1.3/2.175/35.255/3.37/2 DIMENSIONS (mm) CONTACT INFORMATION (8) (87) (87) 39- (87) 95- Capacitor Selection The boost converter requires two capacitors. The input capacitor should be an X5R type of at least 1.μF. The capacitor should also be an X5R type between 2.2μF and 1μF. A larger capacitor should be used if lower peak-topeak output ripple and better line regulation is desired. Table 2. Capacitor Vendor Information SUPPLIER PHONE WEBSITE AVX (83) Murata (71) Taiyo Yuden (8) TDK (87) PCB Layout Guidelines The high speed operation of the LTC359 demands careful attention to board layout. You will not get advertised performance with a careless layout. Figure shows the recommended component placement for the TSOT version of the part. A large ground pin copper area will help to lower the chip temperature FB 5 SHDN RECOMMENDED COMPONENT PLACEMENT. TRACES CARRYING ARE DIRECT. TRACE AREA AT FB PIN IS SMALL. LEAD LENGTH TO BATTERY IS SHORT SHDN F Figure. Recommended Component Placement for a Single-Layer Board

9 TYPICAL APPLICATIONS Very low operating quiescent current and synchronous operation allow for greater than 85% conversion efficiency in many applications. Lower output voltages will result in lower efficiencies since the N- and P-channel R DS(ON) s will increase. The switching frequency and output power capability of the LTC359 are also dependant on input and output voltages. Charging a SuperCap SuperCaps have become a popular alternative to NiCd batteries as back-up power sources in portable equipment. Capacitance values of one farad and higher are achievable in small package sizes with leakage currents in the low microamps. SuperCaps are typically charged at low currents for several minutes until they reach the required back-up voltage. LTC359 The LTC359 is designed to control peak inductor current when is greater than or less than. This allows current to be controlled during start-up in a boost application, for example, or to be regulated below when powered from a fresh battery. Peak current control makes the LTC359 an ideal candidate for charging a back-up source such as a SuperCap. Figure 5 shows an application where the LTC359 is used to charge a two-farad, 5V SuperCap from a 3.3V input. A NiCd battery could be charged by the LTC359 as well, but that application may require additional circuitry for proper charge termination. When is less than ~3.5V, the body of the internal synchronous P-channel MOSFET rectifier is connected to, and the pin rises a diode above when current is delivered to the load. While efficiency is compromised in this mode of operation, current to the SuperCap is 5V from Li-Ion Input 15μH* 1 = 5V 2.5V TO.2V Li-Ion BATTERY + 1μF OFF ON LTC359 SHDN FB 1M 332k 7pF 5V.7μF EFFICIENCY (%) =.2V = 2.5V *COILCRAFT DO TAa I LOAD (ma) 359 TAb 1V from 3.3V or 5V Input 33μH* 1 = 1V 3.3V TO 5V 1μF OFF ON LTC359 SHDN FB 2M 28k 7pF 1V.7μF EFFICIENCY (%) = 5V = 3.3V *COILCRAFT DO TA5a I LOAD (ma) 359 TA5b 9

10 LTC359 TYPICAL APPLICATIONS controlled, preventing any damaging effects of inrush current. Proper heat sinking of the package is required in this application as the die may dissipate 1mW to 2mW during initial charging. When is greater than ~3.5V, normal boost mode operation and efficiency begin, with the P-channel MOSFET acting as a synchronous switch. Average input current is a constant 5mA during charging, where the current delivered to the SuperCap varies somewhat with duty cycle. Once the SuperCap is charged to 5V, the LTC359 begins to regulate and the input current is reduced to the amount required to support the load and/or self discharge of the SuperCap. 3.3V + 1μF OFF ON L1 LTC359 SHDN Figure 5. Charging a SuperCap from a 3.3V Source FB 1M 332k 1μF 359 F5 C OUT : MAXWELL TECHNOLOGIES ULTRACAP PC5-5, 2F, 5V L1: 33μH, 1.7Ω TAIYO YUDEN LB21 5V C OUT 2F PACKAGE DESCRIPTION DC Package -Lead Plastic DFN (2mm 2mm) (Reference LTC DWG # ).75.5 R =.115 TYP PACKAGE PIN 1 BAR OUTLINE TOP MARK (SEE NOTE ) BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS.2 REF NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M-9 VARIATION OF (WCCD-2) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2..1 ( SIDES) PIN 1 CHAMFER OF EXPOSED PAD (DC) DFN BSC BOTTOM VIEW EXPOSED PAD 1

11 PACKAGE DESCRIPTION DCB Package -Lead Plastic DFN (2mm 3mm) (Reference LTC DWG # ) LTC359.7 ±.5 2. ±.1 R =.115 TYP R =.5 TYP. ±.1 ± ± ±.5 PACKAGE OUTLINE.25 ±.5.5 BSC 1.35 ±.5 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS PIN 1 BAR TOP MARK (SEE NOTE ).2 REF 3. ±.1.75 ±.5..5 ±.1 PIN 1 NOTCH R.2 OR.25 5 CHAMFER (DCB) DFN ±.5.5 BSC 1.35 ±.1 BOTTOM VIEW EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M-9 VARIATION OF (TBD) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE S Package -Lead Plastic TSOT-23 (Reference LTC DWG # ).2 MAX.95 REF 2.9 BSC (NOTE ) 1. REF 3.85 MAX 2.2 REF 1. MIN 2.8 BSC 1.75 (NOTE ) PIN ONE ID RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR.95 BSC.3.5 PLCS (NOTE 3) BSC DATUM A 1. MAX REF NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING.9.2 (NOTE 3) 1.9 BSC. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED.25mm. JEDEC PACKAGE REFERENCE IS MO-193 S TSOT REV B Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 11

12 LTC359 TYPICAL APPLICATION L1 15μH 3.3V from a 2 AA Alkaline Input 1 = 3.3V 1.8V TO 3V 2 AA CELLS + + C1 2.2μF OFF ON LTC359 SHDN FB R1 k R2 35k C2 7pF 3.3V C3.7μF EFFICIENCY (%) = 3V = 1.8V C1: TDK C18X5R1A5MT C2: TDK C3COG1E7J C3: TDK C212X5ROJ75K 359 TAa L1: COILCRAFT DO MXB R1: PANASONIC ERJ3EKF3V R2: PANASONIC ERJ3EKF353V I LOAD (ma) 359 TAb RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT131 A I,.5MHz, High Effi ciency Step-Up DC/DC Converter : 2.75V to 18V, (MAX) = 35V, I Q = 12mA, I SD < 1μA, MS1E LT113 55mA I, 1.MHz, High Effi ciency Step-Up DC/DC Converter :.9V to 1V, (MAX) = 3V, I Q = 3mA, I SD < 1μA, ThinSOT LT115/ LT mA/8mA I, Constant Off-Time, High Effi ciency Step-Up DC/DC Converter : 1.2V to 15V, (MAX) = 3V, I Q = 2μA, I SD < 1μA, ThinSOT LT118 A I, 1.MHz, High Effi ciency Step-Up DC/DC Converter : 1.V to 18V, (MAX) = 35V, I Q = 1.8mA, I SD < 1μA, MS1 LT19 (Dual) Dual Output 35mA I, Constant Off-Time, High Effi ciency : 1.2V to 15V, (MAX) = 3V, I Q = 2μA, I SD < 1μA, MS1 Step-Up DC/DC Converter LT195 (Dual) Dual Output Pos/Neg 35mA I, Constant Off-Time, High Effi ciency Step-Up DC/DC Converter : 1.2V to 15V, (MAX) = ±3V, I Q = 2μA, I SD < 1μA, MS1 LT19/ LT19A LT199/ LT199-1 A I, 1.2MHz/2.7MHz, High Effi ciency Step-Up DC/DC Converter 55mA I, khz/1.1mhz, High Effi ciency Step-Up DC/DC Converter : 2.5V to 1V, (MAX) = 3V, I Q = 3.2mA, I SD < 1μA, MS8 : V to 12V, (MAX) = 28V, I Q =.5mA, I SD < 25μA, SO-8, MS8 LT191 A I, 1.25MHz, High Effi ciency Step-Up DC/DC Converter : 3V to 25V, (MAX) = 35V, I Q =.9mA, I SD < μa, MS8E LTC3/ ma I, 1.2MHz, Synchronous Step-Up DC/DC Converter :.5V to 5V, (MAX) = 5V, I Q = 19μA/3μA, I SD < 1μA, ThinSOT LTC3B LTC31 1A I, 3MHz, Synchronous Step-Up DC/DC Converter :.5V to 5V, (MAX) = V, I Q = 38μA, I SD < 1μA, MS1 LTC32 2A I, 3MHz, Synchronous Step-Up DC/DC Converter :.5V to 5V, (MAX) = V, I Q = 38μA, I SD < 1μA, MS1 LTC325 5A I, 8MHz, -Phase Synchronous Step-Up DC/DC :.5V to.5v, (MAX) = 5.25V, I Q = 12μA, I SD < 1μA, Converter, QFN32 LTC329 ma, 5kHz, Synchronous Step-Up DC/DC Converter with :.5V to 5V, (MAX) = 5V, I Q = 2μA/3μA, I SD < 1μA, ThinSOT Output Disconnect and Soft-Start LT3 32mA I, 1.3MHz, High Effi ciency Step-Up DC/DC Converter :.5V to 5V, (MAX) = 5V, I Q = 2μA/3μA, I SD < 1μA, ThinSOT LT3 85mA I, Constant Off-Time, High Effi ciency Step-Up DC/DC Converter with Integrated Schottky/Output Disconnect : 2.3V to 1V, (MAX) = 3V, I Q = 25μA, I SD < 1μA, ThinSOT 12 LT 128 REV C PRINTED IN USA Linear Technology Corporation 13 McCarthy Blvd., Milpitas, CA (8) FAX: (8) LINEAR TECHNOLOGY CORPORATION 27

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