Don t Let the Headphone Jack Ground-Return-Path Impedance Threaten Compliance with Vista Windows Logo Program (WLP) Crosstalk Requirements

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1 Don t et the Headphone Jack round-eturn-path Impedance Threaten Compliance with ista Windows ogo Program (WP) Crosstalk equirements By Kymberly Christman (chmidt), Product Definer, Maxim Integrated Products Inc., unnyvale, Calif. The Windows ogo Program (WP) imposes detailed requirements on the audio performance of PCs and notebook computers using the Windows ista operating system. One of these audio performance requirements is crosstalk. This discussion highlights the new design challenges engineers are faced with when designing a system to meet ista crosstalk requirements. A simple design solution is also proposed. Furthermore, although this crosstalk discussion is targeted at WP compliance standards, the cause and effect of crosstalk is universal to all audio applications. The crosstalk specification for Microsoft s Windows ista O poses new challenges when compared to historic audio performance requirements and test conditions. ather than enforcing crosstalk performance at 1 khz and 10 khz, WP enforces crosstalk performance across the full audio band (20 Hz to 15 khz). Additionally, WP specifies crosstalk performance into a 32 Ω headphone load. This is a large contrast to the historic 10 kω test load condition. In the 32 Ω load case, the influence of the output jack s ground-return current can no longer be neglected. The larger current flow aggravates the effect of the ground-returnpath impedance and poses a great threat to ista compliance with respect to crosstalk. One solution to minimizing the headphone ground-return path impedance is to place the headphone socket directly at the output of the headphone amplifier. However, many audio designers have very little influence in the placement of the audio sockets since the placement is often dictated by the industrial design. An amplifier like the MAX9791 from Maxim, though, can be configured to cancel the effect of the ground return path impedance allowing a system to pass ista crosstalk requirements with minimal design effort. Crosstalk Basics Crosstalk quantifies the amount of signal coupled from one channel to another channel in a multichannel audio or video system. An ideal multi-channel signal path would have no crosstalk between channels, but parasitics in the chip layout create some minimum level of crosstalk. And once the IC is placed on a printed circuit board, additional parasitics due to the board layout and material negatively impact the system crosstalk performance. In a typical two-channel (i.e. stereo) system, stereo crosstalk performance is reported as two separate conditions: (1) crosstalk from the left channel to the right channel and (2) crosstalk from the right channel to the left channel. An audio crosstalk measurement from left to right (Figure 1) is the ratio of the signal measured on the right channel over the

2 signal measured on the left channel, represented in db. During this measurement, the signal on the right channel is set to 0 while the signal on the left channel (the reference channel) is set to a fraction of the input signal and swept across the audio band. ista specifies a 20 dbf (full scale) signal on the reference channel and requires crosstalk to measure less than or equal to 50 db between 20 Hz and 15 khz, for both a 10 kω and 32 Ω load impedance. Figure 1. tereo crosstalk is reported as two separate conditions: crosstalk from the left channel to the right channel, and crosstalk from the right channel to the left channel. What Causes a ista Crosstalk Failure? The top contributor for a crosstalk failure is the layout, whether of the IC or the PCB. iven the crosstalk limits defined in WP 3.0, a crosstalk failure is rarely due to the physical layout of the IC. The MAX9791A, for example, has a crosstalk specification of < 64 db into a 32 load, across the defined audio band. The main cause of crosstalk failure is almost always the PCB layout: either capacitive coupling between the inputs, or a shared resistive ground return at the output jack. If a crosstalk measurement has a positive slope as frequency is swept from 20 Hz to 20 khz, the system has capacitive coupling at the audio-amplifier inputs. Capacitive coupling becomes apparent when a high-impedance drive is applied at the audioamplifier inputs, or if the inputs of a multi-channel device are routed too close to each other. However, this capacitive coupling is not the focus of the discussions in this article.

3 If the crosstalk measurement is relatively flat across the audio band, but the system fails the crosstalk specification (Figure 2), the typical cause is a shared resistive ground return. The shared return can be avoided by ensuring minimal resistance in the return path for the output jack s ground connection. That resistance can be minimized by shorting out any series resistance in the return path, by locating the audio amplifier close to the output jack (to minimize the length of the ground return), and by minimizing contact resistance to the sleeve of the output jack itself. Figure 2. If the crosstalk measurement is relatively flat across the audio band, root cause is a shared resistive ground return. These three best practices seem relatively simple to implement; however, in reality, a system engineer may be forced to route the headphone output a far distance from the audio amplifier. This routing dominates the crosstalk measurement, resulting in decreased audio fidelity. upporting Equations A simplified circuit of the headphone signal path can illustrate the effect the ground return resistance has on the crosstalk measurement. iven this simplified circuit, equations can be derived to quantify this effect. The headphone amplifier is connected to the headphone jack through a thin, mil trace. The headphone amplifier has some finite output impedance, the trace has a finite resistance, and the jack has a finite contact resistance. Additionally, a 32 Ω load is connected (with some finite resistance) between the headphone jack and the ground sleeve. This ground sleeve is then connected to ground and routed back to the headphone amplifier ground. The headphone port model can be simplified by grouping many of the resistances together (Figure 3). The headphone amplifier output impedance, trace resistance, and contact resistance of the jack are grouped together to represent the source resistance,. The resistance between the load and the sleeve, the sleeve contact resistance, and the system ground return resistance are grouped together to represent the ground resistance,.

4 Figure 3. The headphone port can be simplified by grouping resistances. The diagram is simplified further into a ladder of resistors in Figure 4. Notice the voltages across the headphone load resistors ( ) would be equal if the ground return path resistance ( ) was not included in the circuit. OUT IN IN OUT ND Figure 4. The headphone port can be further simplified to a ladder of resistances. We can derive a set of equations to illustrate the crosstalk introduced to the system by the ground return path resistance ( ). Note the source resistance of the left and right channels is assumed to be equivalent. The load resistors of the left and right channels are also assumed to be equivalent.

5 OUT IN ' where ' OUT where IN ' ' OUT OUT where << OUT OUT Or Crosstalk in db = 20 log Assuming a typical source resistance of 5 Ω, the ground return impedance would need to be limited to 115 mω to meet ista s 50 db crosstalk specification (Figure 5). This is further complicated by the fact that the impedance of the sleeve connection in the 3.5 mm stereo jack can make up mω alone. iven a 3.5 mm stereo jack with 60 mω of sleeve contact resistance, the design is already limited to 55 mω of return-path impedance.

6 Figure 5. ista-compliant platforms are restricted to only 115m of ground return impedance. Using 1 oz. copper, 55 mω of allowable ground-return-path impedance limits istacompliant platforms to only 110 square units. If board congestion and numerous vias in the ground plane limit the ground return path to only 30 mils wide, the trace length will be limited to 3.3 inches. (Note: Every square of a sheet of 1oz. copper has a resistance of 0.5 mω at 25 C.) If the headphone jack ground is connected close to the audio device ground using a solid ground plane, the return path resistance can be quite low. However, it is often necessary to locate the headphone jack far from the audio device. In this case, acceptable crosstalk performance becomes a challenge. ilicon can Improve Performance Although careful board layout can compensate for some crosstalk, the proper choice of the amplifier can also make a big difference. For example, the MAX9791 includes ense and Com inputs that allow the amplifier to evaluate and correct for the difference between the headphone jack ground and the device ground. That further reduces the overall crosstalk of the system. The ense pin senses the voltage difference seen between the headphone amplifier ground and the output jack ground. Any voltage difference is then divided down by the amplifier s gain and fed directly to the amplifier s Com pin. The voltage present at the Com input is subsequently amplified, inverted, and applied to the headphone amplifier output. At the output jack, the voltage potential introduced by the resistive ground return is canceled out. Figure 6 illustrates the effect of the Com and ense pins with 28.5m of ground return path resistance.

7 COTAK (db) -40 COTAK vs. FEQUENCY DD = OUT = 30m M = 32 = 28.5m COM and ENE DIABED -70 MAX9791 CH TO CH MAX9791 CH TO CH FEQUENCY (Hz) Figure 6. The Com and ense inputs on the MAX9791 reduce crosstalk performance by eliminating effects of 28.5 m of ground return path resistance. When using common-mode sense, connect the Com input through a resistor ( COM ) to the quiet analog ground (ND) of the device (Figure 7). For optimum common-mode rejection, use the same value resistors for IN2 and COM. To improve DC CM, add a capacitor equal to C IN2 in between the chip s ND pin and COM.

8 Figure 7. The ense and Com inputs were added at the headphone amplifier of the MAX9791 speaker and headphone amplifier chip to help reduce system headphone crosstalk. The MAX4409 offers the same approach in a stand-alone headphone amplifier chip.

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