S102S01/S102S02 S202S01/S202S02

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1 SS1/// SS1/ / SIP Type SSR for Medium Power Control Features 1. High radiation resin mold package. RMS ONstate current I T : Arms at T C <= C ( With heat sink ) 3. Builtin zerocross circuit (/ ). High repetitive peak OFFstate voltage SS1/ VDRM: MIN. V / VDRM: MIN. V 5. Isolation voltage between input and output ( Viso : V rms ). Approved by CSA, No. LR375 Recognized by UL, file No. E975 Applications 1. Automatic vending machines, programmable controllers. Amusement equipment Model Lineups For V lines For V lines For phase control No builtin zerocross circuit SS1 Builtin zerocross circuit Absolute Maximum Ratings Parameter Symbol SS1 Outline Dimensions A (Model No.) B SS1 A15VAC A5VAC 1.1 ±. 1.5 ±.3. ±. Internal connection diagram SS1 / Rating 1 3 (Ta = 5 C) Input Forward current IF 5 ma Reverse voltage V R V *1 RMS ONstate current IT A rms * Peak one cycle surge current I surge A Output Repetitive peak OFFstate voltage VDRM V Nonrepetitive peak OFFstate voltage VDSM V Critical rate of rise of ONstate current di/dt 5 A/µ s Operating frequency f 5 to 5 Hz *3 Isolation voltage Viso V rms Operating temperature T opr 5 to + C Storage temperature T stg 3 to + 15 C * Soldering temperature T sol C. MAX. Unit B * A ±. (3.) ( Unit : mm) * The metal parts marked * are common to terminal 1. Do not allow external connection. ( ) : Typical dimensions 1.5 ±. 1. ±.3 φ 3. ±. (5.) (7.) (.5). ±.1 (1.) ZeroCross Circuit 3. ±.. MAX. 5. ± MIN ±. / 1 Output (Triac T ) 1 Output (Triac T ) Output (Triac T1 ) Output (Triac T1 ) 3 Input ( + ) 3 Input ( + ) Input ( ) Input ( ) *1 T C <= C * 5Hz sine wave, T j =5 C start *3 Hz AC for 1 minute, to % RH, Apply voltages between input and output, by the dielectric withstand voltage tester with zerocross circuit. ( Input and output shall be shorted respectively ). (Note) When the isolation voltage is necessary at using external heat sink, please use the insulation sheet. * For seconds In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.

2 SS1/// Electrooptical Characteristics Input Output Transfer characteristics Parameter Forward voltage Reverse current Repetitive peak OFFstate current ONstate voltage Holding current Critical rate of rise of OFFstate voltage Critical rate of rise of commutating OFFstate voltage Zerocross voltage Minimum trigger current Isolation resistance Turnon time SS1 SS1 Turnoff time Thermal resistance (Between junction and case) Thermal resistance (Between junction and ambience) Symbol V F IR I DRM V T IH dv/dt ( dv/dt ) C V OX I FT R ISO t on t off R th(j c) Rth(j a) Conditions IF = ma V R =3V VD=VDRM Resistance load IF= ma, I T = Arms ( Ta = 5 C) MIN. TYP. MAX. Unit V A A V rms ma V D = /3 V DRM 3 V/µ s T j = 15 C, di T /dt=.a/ms, V D = V 5 V/µ s IF = ma V D = 1V, R L =3Ω VD= V, R L =3Ω 35 V ma ma DC5V, to % RH Ω AC 5Hz 1 ms ms ms.5 C/W C/W Fig. 1 RMS ONstate Current vs. Ambient Temperature RMS ONstate current I T ( Arms ) 9 7 () (1) (5) () (3) 5 3 () 1 (1) With infinite heat sink () With heat sink ( x x mm Al plate ) (3) With heat sink ( x x mm Al plate ) () With heat sink (75 x 75 x mm Al plate) (5) With heat sink (5 x 5 x mm Al plate) () Without heat sink ( Note) With the Al heat sink set up vertically,tighten the device at the center of the Al heat sink with a torque of.n m and apply thermal conductive silicone grease on the heat sink mounting plate. Forcible cooling shall not be carried out

3 SS1/// Fig. RMS ONstate Current vs. Case Temperature Fig. 3 Forward Current vs. Ambient Temperature RMS ONstate current IT ( Arms ) Forward current I F ( ma ) Case temperature T C ( C) Fig. Forward Current vs. Forward Voltage Fig. 5 Surge Current vs. Poweron Cycle Forward current IF ( ma ) 5 5 T a = C 75 C 5 C 5 C C 5 C Surge current Isurge (A) f= 5Hz T j = 5 C Start Forward voltage V F (V) Poweron cycle ( Times ) Fig. Maximum ONstate Power Dissipation vs. RMS ONstate Current (Typical Value) Maximum ONstate power dissipation (W) T a = 5 C Fig. 7 Minimum Trigger Current vs. Ambient Temperature (Typical Value) Minimum trigger current I FT ( ma ) V D = 1V (SS1/ ) V D =V (/ ) R L =3Ω SS1 1 RMS ONstate current I T ( A rms )

4 SS1/// Fig. Repetitive Peak OFFstate Current vs. Ambient Temperature (Typical Value) Repetitive peak OFFstate currednt I DRM (A) V D = V (SS1/ ) V D = V 5 (/ ) SS Please refer to the chapter Precautions for Use

5 Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: Personal computers Office automation equipment Telecommunication equipment [terminal] Test and measurement equipment Industrial control Audio visual equipment Consumer electronics (ii)measures such as failsafe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) Traffic signals Gas leakage sensor breakers Alarm equipment Various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: Space applications Telecommunication equipment [trunk lines] Nuclear power control equipment Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115

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