Technical Introduction of the New USB Type-C Connector

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1 Technical Introduction of the New USB Type-C Connector Bob Dunstan Principal Engineer, Intel Corporation Yun Ling Principal Engineer, Intel Corporation NETS003

2 Agenda Introducing the USB Type-C Cable and Connector - Motivation and General Approach - Requirement Summary Architectural Overview Mechanical - Receptacles and Plugs - Standard Cable and Adapter Assemblies - Electrical Requirements - Mechanical Requirements Functional - Functional Interface - Detection and Configuration - Power Delivery Options - Functional Extensions 2

3 Agenda Introducing the USB Type-C Cable and Connector - Motivation and General Approach - Requirement Summary Architectural Overview Mechanical - Receptacles and Plugs - Standard Cable and Adapter Assemblies - Electrical Requirements - Mechanical Requirements Functional - Functional Interface - Detection and Configuration - Power Delivery Options - Functional Extensions 3

4 Motivation for USB Type-C 4 Existing USB Type-A host connector is too large for emerging computing platform needs - Ultra-thin, convertible, detachable, and tablet form-factors are in need of thinner connector solutions - Existing USB 3.0 Micro-AB doesn t meet robustness and usability requirements beyond phone usages - Existing USB 3.0 Micro-AB doesn t meet the latest design requirements for phones Existing USB connectors are perceived to be difficult to use - User confusion over plug orientation, cable direction - Difficult to plug in under blind-mating situations The USB cable/connector ecosystem needs to move forward to address the emerging form-factor/id design trends extending and advancing USB as the peripheral connection of choice

5 USB Type-C Initiative Developed a new USB connector better suited to emerging platform designs - Focused on size and usability suitable from phones to PCs - Support legacy USB devices - Planned for USB generational scalability into the solution Extends the family of USB connector/cables Enables a one connector platform - USB, power delivery, proprietary docking, audio adapters, etc. Require no new host controller or device silicon to implement - However, some low-level discrete circuitry needed to deal with cable detect, power configuration, etc. USB Power Delivery (PD) updated to simplify the communications transport and enable functional extensions 5

6 Agenda Introducing the USB Type-C Cable and Connector - Motivation and General Approach - Requirement Summary Architectural Overview Mechanical - Receptacles and Plugs - Standard Cable and Adapter Assemblies - Electrical Requirements - Mechanical Requirements Functional - Functional Interface - Detection and Configuration - Power Delivery Options - Functional Extensions 6 Artist renderings courtesy of Foxconn *

7 USB Type-C Key Aspects Entirely new design - Tailored for emerging product designs New smaller size - Similar to size of USB 2.0 Micro-B Usability enhancements - Reversible plug orientation & cable direction Supports scalable power charging Future Scalability - Designed to establish future USB performance needs 7 Artist renderings courtesy of Foxconn *

8 USB Type-C Functional Pin-out Looking into the product receptacle: A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 GND TX1+ TX1 VBUS CC1 D+ D SBU1 VBUS RX2 RX2+ GND GND RX1+ RX1 VBUS SBU2 D D+ CC2 VBUS TX2 TX2+ GND B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 Looking into the cable or product plug: A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 GND RX2+ RX2 VBUS SBU1 D D+ CC VBUS TX1 TX1+ GND GND TX2+ TX2 VBUS VCONN SBU2 VBUS RX1 RX1+ GND B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 8

9 USB Type-C Functional Model A non-polarity cable model, SS scalability and power delivery flexibility Platform implementation impact varies based on capabilities chosen and level of integration 9

10 Agenda Introducing the USB Type-C Cable and Connector - Motivation and General Approach - Requirement Summary Architectural Overview Mechanical - Receptacles and Plugs - Standard Cable and Adapter Assemblies - Electrical Requirements - Mechanical Requirements Functional - Functional Interface - Detection and Configuration - Power Delivery Options - Functional Extensions USB 3.1 Type-C USB 3.1 Micro-B 10 Artist renderings courtesy of Foxconn *

11 USB Type-C Mechanical USB 3.1 Standard-A USB 3.1 Type-C Mechanical specs: - Receptacle opening: ~8.3mm x ~2.5mm - Durability: 10,000 cycles - Improved EMI and RFI mitigation features - Power delivery capacity: 3A for standard cables 5A for connectors Signal performance: - USB 2.0: LS/FS/HS (480 Mbps) - USB 3.1: Gen1 (5 Gbps) Gen2 (10 Gbps) USB 3.1 Type-C USB 3.1 Micro-B 11 Artist renderings courtesy of Foxconn *

12 USB Type-C Receptacle Standard-A, 9 pins Type-C, 24 pins USB Type-C is low profile, narrower, more aesthetically pleasing, and more robust. Micro-AB, 10 pins

13 USB Type-C Plug USB Type-C Plug USB Micro-B Plug Reversible, flip-able, rounded corners, tactile feeling, and more aesthetically pleasing. USB Standard-A Plug 13

14 USB Type-C Standard Cable Assemblies Two USB Type-C to Type-C cables defined USB 3.1 Type-C to Type-C Cable Assembly 15 wires or USB 2.0 Type-C to Type-C Cable Assembly 5 wires 14 Minimum number, count may differ depending on power/ground/shielding approach Artist rendering courtesy of Foxconn *

15 USB Type-C Legacy Cable Assemblies USB Type-C to USB 3.1 Cable Assemblies: Standard-A USB Type-C to USB 2.0 Cable Assemblies: Standard-A Micro-B Standard-B Standard-B Micro-B Mini-B 8 wires 4 wires 15 Minimum number, count may differ depending on power/ground/shielding approach Artist renderings courtesy of Luxshare-ICT *

16 USB Type-C Legacy Adapters Only two USB Type-C to legacy adapters are defined and allowed USB Type-C to USB Standard-A Receptacle Adapter USB Type-C to USB 2.0 Micro-B Receptacle Adaptor 8 wires 4 wires Intended for legacy thumb drive use with new host platforms Intended for adapting existing Micro-B chargers to new devices 16 Minimum number, count may differ depending on power/ground/shielding approach Artist renderings courtesy of Luxshare-ICT *

17 Mechanical Robustness 15 mm Deep-drawn or formed shell Wrenching strength testing is mandatoryit shall be at least 2x stronger than USB Micro-B connector. Metal re-enforced tongue and tight tolerance/fit between plug and receptacle shells. No holes/cutouts in plug shell and the receptacle can be designed with no holes or cutouts also. 17 Artist rendering courtesy of Foxconn *

18 Durability and Mating/Un-mating Force Side (Retention) Latch in plug Mating force Un-mating force Recess on receptacle tongue Durability cycle: 10,000 min. Mating force: 5 N to 20 N Un-mating force: 8 N to 20 N Pay attention to optimize the un-mating force profile for tactile feeling! 18

19 Cable Assembly Insertion Loss Requirements USB 3.1 Gen 2 Type-C to Type-C cable assembly is allocated with 6 db loss at 5 GHz, supporting a cable about 1-meter long - Control the loss at 10 GHz (20 GHz) to be 11 db for future scalability USB 3.1 Gen 1 Type-C to Type-C cable assembly is allocated with 7 db loss at 2.5 GHz, supporting a cable about 2-meter long Insertion loss Raw cable may be coax or twisted pairs. 19

20 Other High Speed Requirements All SuperSpeed TDR impedance and S-parameters specs are informative, except for Differential-to-Common-Mode Conversion The normative spec is the integrated S-parameters meet certain thresholds Informative Informative Differential Return Loss Differential NEXT 20

21 Low Speed Signal Requirements Low speed signals include CC, SBU and VBUS Impedance for SBU and CC is from ohms The VBUS line loop inductance is 900 nh max to manage load release Couplings between low speed signals are specified Requirement for Differential Coupling between CC and D+/D Requirement for Single-ended Coupling between VBUS and SBU_A/SBU_B and between VBUS and CC 21 Pay attention to cable wire bundle design!

22 EMC Shielding Solutions and Requirements Internal EMC springs in plug EMC pad in receptacle Optional external EMC springs 22 Normative shielding effectiveness test over frequency ranges of interests.

23 Agenda Introducing the USB Type-C Cable and Connector - Motivation and General Approach - Requirement Summary Architectural Overview Mechanical - Receptacles and Plugs - Standard Cable and Adapter Assemblies - Electrical Requirements - Mechanical Requirements Functional - Functional Interface - Detection and Configuration - Power Delivery Options - Functional Extensions 23

24 Understanding USB Type-C Port Behaviors Data roles: - Downstream Facing Port (DFP) typical of Standard-A host or hub ports - Upstream Facing Port (UFP) typical of Standard-B or Micro-B device ports Power roles: - Source typical of Standard-A host or hub ports - Sink typical of Standard-B or Micro-B device ports USB Type-C Ports can be - Host-mode only, Device-mode only or Dual-Role - A Dual-Role Port (DRP) transitions between DFP and UFP port states until it resolves to the appropriate state upon an attach event Roles can be dynamically swapped using USB PD - Data role, power role 24

25 USB Type-C Pull-Up/Pull-Down CC Model Host side can substitute current sources for Rp Powered cables introduce Ra at one CC pin which is used to indicate the need for VCONN over that pin 25

26 USB Type-C Host Detected Connection States The CC pins magic decoder ring 26

27 USB Type-C Host Detected Connection States Typical USB connections Host-to-Host (DFP-to-DFP) and Device-to-Device (UFP-to-UFP) are undetectable sub-states of Open/Open 27

28 USB Type-C Host Detected Connection States Powered Cables Decode to supply VCONN used for Electronically Marked Cables and Active Cables 28

29 USB Type-C Host Detected Connection States Audio adapter decode state allows implementation of a analog USB Type-C to 3.5 mm headset 29

30 USB Type-C Power Options All solutions required to support Default USB Power appropriate to product as defined by USB 2.0 and USB 3.1 Extension options: - USB Type-C Current Defines 1.5 A and 3 5 V ranges - USB BC 1.2 (also requires support of USB Type-C High Current) - USB Power Delivery (PD) Variable voltage/current up to 5 20 V USB PD for USB Type-C implementation is DC coupled and is based on Biphase Mark Coding (BMC) signal encoding over CC 30

31 USB Type-C Powered Cables Uses USB PD to get cable s capabilities VCONN only powered by DFP 31

32 USB Type-C Functional Extensions Alternate Modes enabling OEM product differentiation - Use of USB PD Structured Vendor Defined Messages (VDMs) to extend the functionally a device exposes - Only a subset of the pins can be re-purposed depending on product type Looking into the cable or product plug: A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 GND RX2+ RX2 VBUS SBU1 D D+ CC VBUS TX1 TX1+ GND GND TX2+ TX2 VBUS VCONN SBU2 VBUS RX1 RX1+ GND B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 All USB Type-C ports are required to function as compliant USB ports when not operating in a recognized Alternate Mode 32

33 USB Type-C Docking Example USB PD used to identify the dock and to enter the dock mode USB Billboard Device Class - Used to identify incompatible connections made by users 33

34 USB Type-C Functional Extensions Audio Adapter Accessory Mode alternative for a 3.5 mm audio jack - Enabling the single-connector phone or tablet - Platforms supporting this extension will require accessory mode circuits that include special consideration for both digital and analog grounding 34

35 Summary Key Takeaways USB Type-C extends the USB connector ecosystem - enables new form-factors with single connector - improves user experience - provides path for future USB performance scaling Existing USB silicon with a bit of glue logic can be used to incorporate a USB Type-C receptacle in a design USB Type-C is the connector for the future and the future is now! 35

36 Call to Action Drive your next USB design toward the future - Consider if the USB Type-C connector solution is right for you - Embrace USB Power Delivery for powering your platform or device Register and attend upcoming USB 3.1 / USB Type-C / USB PD Developer Days events USA: September 16-17, 2014 Seattle Europe: October 1-2, 2014 Berlin Asia: November 19-20, 2014 Singapore 36

37 Additional Sources of Information USB-IF links for the specifications - USB 3.1 download includes USB Type-C and latest USB PD specs - Billboard Device Class A PDF of this presentation is available from our Technical Session Catalog: This URL is also printed on the top of Session Agenda Pages in the Pocket Guide. 37

38 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling , or go to: Intel, Look Inside and the Intel logo are trademarks of Intel Corporation in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright 2014 Intel Corporation. 38

39 39 Risk Factors The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forwardlooking statements that involve a number of risks and uncertainties. Words such as anticipates, expects, intends, plans, believes, seeks, estimates, may, will, should and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel s actual results, and variances from Intel s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be important factors that could cause actual results to differ materially from the company s expectations. Demand for Intel's products is highly variable and, in recent years, Intel has experienced declining orders in the traditional PC market segment. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; consumer confidence or income levels; customer acceptance of Intel s and competitors products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term. Intel's gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; and product manufacturing quality/yields. Variations in gross margin may also be caused by the timing of Intel product introductions and related expenses, including marketing expenses, and Intel's ability to respond quickly to technological developments and to introduce new products or incorporate new features into existing products, which may result in restructuring and asset impairment charges. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel s results could be affected by the timing of closing of acquisitions, divestitures and other significant transactions. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC filings. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel s results is included in Intel s SEC filings, including the company s most recent reports on Form 10-Q, Form 10-K and earnings release. Rev. 4/15/14

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