6. Thermal Performance Information
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- Griffin Spencer
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1 Simplified thermal management is one of the benefits of using Vicor converters. High operating efficiency minimizes heat loss, and the low-profile package features an easily accessible, electrically isolated thermal interface surface. Proper thermal management pays dividends in terms of improved converter and system MTBFs, smaller size, and lower product life-cycle costs. The following pages provide guidelines for achieving effective thermal management of Vicor converters. Consideration should be given to the module baseplate temperature during operation. The maximum baseplate temperature specification for Maxi, Mini, and Micro is 1 C. Enhanced module cooling can be achieved with free or forced convection by using the appropriate heat sink. The available Vicor heat sinks and thermal interface options are available on the Vicor website. The relevant nomenclature for the tabulated thermal information supplied in this section for the Maxi, Mini, and Micro modules is defined as follows: Tb = baseplate temperature Ta = ambient temperature Pout = module output power Pin = module input power η = module efficiency = Pout / Pin Pdiss = module power dissipation = Pin Pout = (1/η 1) Pout Supplied thermal resistance values: θbs = baseplate-to-heatsink thermal resistance θba = baseplate-to-ambient thermal resistance Basis of output power versus ambient temperature derating curves: (Ta)max = (Tb)max θba Pdiss = (Tb)max θba (1/η 1) Pout Additional Thermal Data The following pages contain temperature derating curves. For additional thermal data, see the following link: Page of 88 Apps. Eng
2 THERMAL PERFORMANCE CURVES (Maxi) Table Usage: The forced convection thermal impedance data shown in the tables on the next three pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Maxi data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Maxi θba (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θbs =.7 C/W Baseplate.9'' Longitudinal Fins.9'' Transverse Fins.4'' Longitudinal Fins.4'' Transverse Fins Free Air LFM LFM LFM LFM , LFM ,2 LFM Maxi Output Power vs. Ambient Temperature Derating Curves Baseplate (No Heat Sink).4'' (1,1 mm) Heat Sink.9'' (22,8 mm) Heat Sink V V V V Maxi Thermal Performance Curves - No Heat Sink V Maxi Thermal Performance Curves -.4" Heat Sink V Maxi Thermal Performance Curves -.9" Heat Sink V Power Output (Watts) Power Output (Watts) Free Air 2 LFM 4 LFM 6 LFM 8 LFM 1 LFM 12 LFM Page 26 of 88 Apps. Eng
3 2V Mini Thermal Performance Curves -.9" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.4" Heat Sink V Mini Thermal Performance Curves -.9" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.4" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.9" Heat Sink V Mini Thermal Performance Curves -.9" Heat Sink THERMAL PERFORMANCE CURVES (Mini) Table Usage: The forced convection thermal impedance data shown in the tables on the next three pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Mini data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Mini θba (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θbs =.14 C/W Baseplate.9'' Longitudinal Fins.9'' Transverse Fins.4'' Longitudinal Fins.4'' Transverse Fins Free Air LFM LFM LFM LFM , LFM ,2 LFM Mini Output Power vs. Ambient Temperature Derating Curves Baseplate (No Heat Sink).4'' (1,1 mm) Heat Sink.9'' (22,8 mm) Heat Sink 2 V 3.3 V V 12-48V Mini Thermal Performance Curves -.4" Heat Sink V Free Air 2 LFM 4 LFM 6 LFM 8 LFM 1 LFM 12 LFM Page 27 of 88 Apps. Eng
4 2V Micro Thermal Performance Curves -.9" Heat Sink V Micro Thermal Performance Curves -.4" Heat Sink V Micro Thermal Performance Curves -.9 Heat Sink 3.3V Micro Thermal Performance Curves - No Heat Sink V Micro Thermal Performance Curves - No Heat Sink V Micro Thermal Performance Curves -.4" Heat Sink V Micro Thermal Performance Curves -.9" Heat Sink THERMAL PERFORMANCE CURVES (Micro) Table Usage: The forced convection thermal impedance data shown in the tables on the next three pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Micro data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Micro θba (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θbs =.21 C/W Baseplate.9'' Longitudinal Fins.9'' Transverse Fins.4'' Longitudinal Fins.4'' Transverse Fins Free Air LFM LFM LFM LFM , LFM ,2 LFM Micro Output Power vs. Ambient Temperature Derating Curves Baseplate (No Heat Sink).4'' (1,1 mm) Heat Sink.9'' (22,8 mm) Heat Sink 2 V 3.3 V V 12-48V Micro Thermal Performance Curves - No Heat Sink 12-48V Micro Thermal Performance Curves -.4" Heat Sink 12-48V Micro Thermal Performance Curves -.9" Heat Sink V Free Air 2 LFM 4 LFM 6 LFM 8 LFM 1 LFM 12 LFM Page 28 of 88 Apps. Eng
5 Typical Examples Thermal Equations (Maxi, Mini, Micro) EXAMPLE 1 Determine the maximum output power for a Maxi module without a heat sink delivering V in 4 LFM airflow at a maximum ambient temperature of 4ºC. Maximum output power = (Tbmax Tamax) /[θba (1/η 1)] Tbmax = 1ºC Tamax = 4ºC For Maxi module without a heat 4 LFM, θba = 2.17ºC/W For the V Maxi module the typical value for η =.83 Maximum output power = (1 4) / [2.17 (1/.83 1)] ~1 W Or, the same answer could be obtained by using the output power versus ambient temperature derating curves for the Maxi modules. For the case with no heat sink the baseplate chart for the V module would be used. At a 4ºC ambient and 4 LFM airflow this chart indicates a maximum output power of approximately 1 W. For full output power of 4 W the required thermal resistance is; θba = (1 4) / [4 (1/.83 1)] =.73ºC/W What size heat sink would be necessary to operate at full output power (4 W) under the same conditions? From the θba versus airflow charts for the Maxi, the thermal resistance at 4 LFM airflow requires the use of a.9"(22,8 mm) transverse fin heat sink. EXAMPLE 2 Determine the maximum ambient for a Mini module with a.9 (22,8 mm) heat sink in 4 LFM of airflow delivering 2 W at V. From the output power versus ambient temperature chart for the Vout Mini with a.9 (22,8 mm) heat sink, the 2 W at 4 LFM data point results in a Tamax of approximately 48ºC V Mini with.9 (22,8 mm) heat sink Page 29 of 88 Apps. Eng
6 THERMAL MANAGEMENT ACCESSORIES (All parts are RoHS compliant unless otherwise noted) Maxi Heat Sinks Mini Heat Sinks Micro Heat Sinks Threaded Through Hole Threaded Through Hole Threaded Through Hole Transverse Fins Longitudinal Fins.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin P/N 3482 P/N 3718 P/N P/N 319 P/N P/N " (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin P/N 3188 P/N 3181 P/N 3189 P/N 3182 P/N 319 P/N " (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin.4" (1,1 mm) Fin P/N 3778 P/N 372 P/N 3184 P/N 3721 P/N P/N " (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin.9" (22,8 mm) Fin P/N 3196 P/N 3723 P/N 3269 P/N 3724 P/N 327 P/N 37 Low-profile Side-fin Heat Sinks Height only.1" (3,17 mm) above module baseplate* Standoffs and Screws Bulk and single-module kits compatible with all standard mounting configurations.." (13,97 mm)." (13,97 mm)." (13,97 mm) Side Fins Side Fins Side Fins P/N 396 P/N 3219 P/N 39 See the specific products on the Vicor website for more information. Not compatible with standoff kits. ThermMate Thermal Pads For use with Vicor modules, ThermMate thermal pads are a dry alternative to thermal compound and are pre-cut to the outline dimensions of the module. THERMAL PAD PART NUMBER THICKNESS Maxi (1 pc. pkg.) " (,177 mm) Mini (1 pc. pkg.) " (,177 mm) Micro (1 pc. pkg.) 226.7" (,177 mm) * For thermal curves of low-profile side-fin heat sinks and on-line capability for thermal curve calculations, see the following link: Page 3 of 88 Apps. Eng
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