Tillverkning av ett Dubbelsidigt Flex Kort!
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- Quentin McDonald
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1 Tillverkning av ett Dubbelsidigt Flex Kort!
2 Jag gillar komplicerade funktioner gjorda av sofistikerade material på en liten yta! Elektronik Konstruktören
3 Vad är IPC-7351B Mina footprints är från 1903! CADDAREN
4 Ritningar och Filer för Stansverktyg Preparering av: IPC-2223B IPC-7351B IPC-2581 Cover lager Lödmask Stiffener Ritningar
5 IPC-4202A IPC-4203 IPC-4204 PI IPC-4101C Cover Layer Stiffener FR4 DATA from CAM
6
7 Exempel 2-Lager FLEX Topp Botten Förbättringsförslag?
8 Exempel 2-Lager FLEX Topp Botten
9 Tillverkningspanel
10 Tillverkningspanel
11 Qualification and Performance Specification for Rigid Printed Boards
12 The BIG question is: Class 1? Class 2? Class 3? IPC-6011 IPC-6013B
13 IPC Qualification for Printed Board Design IPC-6010 series IPC General. IPC-6013B Flex.
14
15 IPC-6013B
16
17
18
19 Qualification and Performance Specification for Rigid Printed Boards IPC-6010 IPC-6011 IPC-6013B
20 Tillverkning av ett Dubbelsidigt Flex Kort!
21 Double side Flexible PCB Flow Chart Double side base film PI Drilling Laser or Mechanical Chemical Cu 2-3 µm Electrical Plating 10 µm Image Etching AOI Cover Lay Alignment Cover Lay Lamination Inspection OK? No Yes Surface Finish Silkscreen El. Test Outline Repair Scrap Stiffener Assembly Inspection Packing Delivery
22
23 IPC-4202A IPC-4203 IPC-4204 PI IPC-4101C Cover Layer Stiffener FR4 DATA from CAM
24 Laminat Double-sided Flexible Cu Clad Laminat Cu Film Adhesive PI Film Cu Film
25 Bas Flex Laminat Inkl. Adhesive Akryl 2 x 25µm Standard Tjocklek: 12,5, 25 elelr 50 µm PI Standard Cu folie: 17,5 eller 35 µm. Standard Material: Polyimide (PI) Rolling (RA) eller Electro Deposit (ED) Cu Foil
26 STACK-UP Double side + Stiffener Thickness in µm 129,5 12, , , ,5 Cover Lay PI Cover Lay Adhesive (Acrylic) Copper Adhesive Polyimide (PI) Adhesive Copper Cover Lay Adhesive Cover Lay PI Adhesive Stiffener PI
27 STACK-UP Double side + Stiffener Thickness in µm 129,5 12, , , Cover Lay PI Cover Lay Adhesive (Acrylic) Copper Adhesive Polyimide (PI) Adhesive Copper Cover Lay Adhesive Cover Lay PI Adhesive PSA Stiffener FR4 979,5
28 IPC-4202 IPC-4203 IPC-4204 PI IPC-4101C Cover Layer Stiffener FR4 DATA from CAM Cut PI panel
29 Tillverkningspanel Pressad med eller utan Lim
30 Bas Laminat för FLEX Cu 17,5 µm Polyimide PI, 2 x 17,5µm 0,05 mm
31 Cut PI panel PI tacking Laser Drilling Drilling DATA from CAM
32 Laserborrning av hål
33 Cut PI panel PI tacking Laser Drilling Drilling DATA from CAM Chemical Plating 2-3µm
34 DATA from CAM Laser plotter Exposure Mylar removal Developing Etch Cu Stripping Inspect El Plating Cu 12µm
35 Inspect El Plating Cu 12µm AOI
36 Tillverkningspanel
37 Inspect El Plating Cu 12µm AOI Cover lay Alignment & Lamination
38 FLEX & FLEX RIGID DATA from CAM Cover Lager preparation Mekaniskt eller Laser
39 Tillverkningspanel med Cover Lager Adhesive Cu Lager PI Lager
40 Inspection Silkscreen 1. HASL SnPb 2. HASL SnCu 3. ENIG 4. Immersion Ag 5. Immersion Sn 6. OSP HASL
41 Silkscreen
42 Electrical Test Stiffener Assembling Delivery Stiffener Punching Outline
43
44 Tillverkningspanel
45 Outline
46 Double side Flexible PCB Flow Chart Double side base film PI Drilling Laser or Mechanical Chemical Cu 2-3 µm Electrical Plating 10 µm Image Etching AOI Cover Lay Alignment Cover Lay Lamination Inspection OK? No Yes Surface Finish Silkscreen El. Test Outline Repair Scrap Stiffener Assembly Inspection Packing Delivery
47 Tillverkning av ett 8-Lagers FLEX-RIGID
48 Ett färdigt 8-Lager Flex-Rigid Kort
49 Ritningar och Filer för Stansverktyg Preparering av: IPC-2223B IPC-7351A IPC-2581 Cover lager Lödmask Stiffener Ritningar
50
51 Uppbyggnaden av ett 8-Lagers FR 1
52 8-Layer Flex-Rigid PCB Flow Chart 1 Double side base film PI for IL C U T Laminating Dry Film Exposure & Mylar Removal Developing Etching Stripping AOI Cover Lay Application Cover Lay Lamination Inspection Optical Registration Black Oxide Transportation to Multi-Layer Lay up Riveting
53 IPC-4202A IPC-4203 IPC-4204 PI IPC-4101C Cover Layer Stiffener FR4 DATA from CAM
54 PI DATA from CAM Cutter
55 Tillverkningspanel
56 DATA from CAM Laser Plotter Lamination
57 Laser Plotter Exposure Mylar removal Developing Etching Lamination Stripping AOI
58 Inspect El Plating Cu 12µm AOI Cover lay Alignment & Lamination
59 FLEX & FLEX RIGID DATA from CAM Cover Lager preparation Mekaniskt eller Laser
60 Lay up Press Black Oxide Optical Registration
61 Flex kärnan är avbildad och etsad 1
62 Cover lagren är preparerade och laminerade
63 The build up of an 8-Layer FR 2 1 2
64 8-Layer Flex-Rigid PCB Flow Chart 2 Double side FR4 base material for IL Laminating Dry Film Exposure & Mylar Removal Developing Etching Stripping AOI Optical Registration Black Oxide Transportation to Multi-Layer Lay up
65 DATA from CAM Laser Plotter Lamination
66 Laser Plotter Exposure Mylar removal Developing Etching Lamination Stripping
67 AOI Black Oxide Optical Registration
68 Lay up Press Black Oxide Optical Registration
69 8-Layer Flex-Rigid PCB Flow Chart 3 Flex IL plus 2 x FR4 IL Lay up of Precut NF Prepreg Lay up of Teflon release part Lay up of FR4 IL & Prepreg ML Press Drilling Mechanical Deburring Plasma Chemical Cu 2-3µm Laminate Dry film Exposure Mylar removal Developing El. Plating µm Etching AOI Soldermask Surface Finish Silkscreen Profile E-Test Delivery
70 No-flow Prepreg and fillers are pre cut and prepared Fillers Teflon Prepreg 3
71 Multi-Layer Lay Up Inner layers and prepregs and foils are added 3
72 Everything are pressed together Teflon part 0,2-0,3 mm
73 Cut PI panel PI tacking Laser Drilling Drilling DATA from CAM Chemical Plating 2-3µm
74 Holes are drilled and electroless copper processed
75
76
77 DATA from CAM Laser plotter Exposure Mylar removal Developing Etch Cu Stripping Inspect El Plating Cu 25µm
78 Inspect El Plating Cu 25µm El Plating Sn 4-5µm Stripping Etch Cu Stripping Sn resist AOI
79 Holes and pattern are plated, pattern are etched
80 AOI Soldermask application IPC-SM-840D Exposure Cure Developing
81 Inspection Silkscreen 1. HASL SnPb 2. HASL SnCu 3. ENIG 4. Immersion Ag 5. Immersion Sn 6. OSP HASL
82 Soldermask is applied, exposed and developed
83 Electrical Test Stiffener Assembling Routing Delivery Stiffener Punching Outline
84 Surface treatment is applied, board is control dept routed to release flex part.
85 The 8-Layer Rigid-Flex board is completed
86 8-Layer Flex-Rigid PCB Flow Chart 1 Double side base film PI for IL C U T Laminating Dry Film Exposure & Mylar Removal Developing Etching Stripping AOI Cover Lay Application Cover Lay Lamination Inspection Plasma Optical Registration Black Oxide Transportation to Multi-Layer Lay up Riveting
87 8-Layer Flex-Rigid PCB Flow Chart 2 Double side FR4 base material for IL Laminating Dry Film Exposure & Mylar Removal Developing Etching Stripping AOI Optical Registration Black Oxide Transportation to Multi-Layer Lay up
88 8-Layer Flex-Rigid PCB Flow Chart 3 Flex IL plus 2 x FR4 IL Lay up of Precut NF Prepreg Lay up of Teflon release part Lay up of FR4 IL & Prepreg ML Press Drilling Mechanical Deburring Plasma Chemical Cu 2-3µm Laminate Dry film Exposure Mylar removal Developing El. Plating µm Etching AOI Soldermask Surface Finish Silkscreen Profile E-Test Delivery
89 Robust Konstruktion Denna uppbyggnadsmetod är den mest använda, och producerar de mest robusta och tillförlitliga Flex-Rigid korten. Inget Lim i de pläterade hålen. En hård ytteryta (Rigid) för alla komponentplaceringar, tillåter användandet av en foto definierad lödmask.
90 IPC Standarder för FLEX & FLEX RIGID IPC-6011 IPC-6013B IPC-600H IPC-SM-840D IPC-4552 IPC-4553A IPC-4554
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