Metal Type-Current Shunt Resistor Specifications

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1 Metal -Current Shunt Resistor s

2 (inch size) L Dimensions M(material) T A C(Max.) P Power Rating Tolerance Range (mω) Operation Temp. Range TCR (PPM/ C) 3

3 Metal Current Shunt Resistor Metal Current Shunt Resistor Performances Environmental Performance 1 Short Time Overload Temperature Coefficient of (T.C.R.) Function Performance Test TestCondition Condition Loading 5 times rate power 5sec +5 C /+15 C. (JIS-C50-5.) Refer to electrical specification. 3 Moisture The specimens shall be placed in a chamber and subjected to a relative humidity of 90~98% percent and a temperature of 5 C / 65 C 10 cycles (MIL-STD-0, Method 106) 4 High Temperature Exposure The ship (mounted on board) is exposed in the heat chamber 15 for 1000 hrs. (JIS-C50-7.) 5 Load Life Apply rated power for 1000 hours with 1.5 hours ON and 0.5 hour OFF. (JIS-C ) Rapid change of temperature 1 Bending Strength Test Condition Test Condition Mount the chip to test 90mm(L)*40mm() FR4 printed circuit board substrate. Apply pressure in direction of arrow unit band width reaches mm(+0./-0mm) illustrated in the figure below and hold for 10±1 sec. (JIS-C50-6.1) The specimen chip shall be immersed into the flux specified in the solder bath 35±5 for ±0.5 sec. It shall be immersed to a point 10mm from its root. (Sn96.5/Ag3.0/Cu0.5) (JIS-C ) The chip (mounted on board) is exposed, -55±3 C (30min.)/+15± C (30min.) for 5 cycles. The following conditions as the following figure. (JIS-C50-7.4) 6 Solderability Solder shall be covered 95% or more of the electrode area. Remark: a. The terminal electron temperature of component should below 100oC. 4 5

4 Metal Current Shunt Resistor Metal Current ShuntMetal Res-Current istor Shunt Resistors Soldering Recommendations Tape Packaging s Peak reflow temperatures and durations - IR Reflow Peak = 60 max for 10 sec - Not suitable for wave soldering Recommended IR Reflow Profile Embossed Plastic Tape s Top Tape Embossed Resistor Carrier Dimensions Carrier Dimensions A A B EE F P0 P1 P B F P0 P1 P 3.55± 6.75± 1.75± 5.5± 1.0± 4.0± ± 1.75± 7.5± 16.0± 4.0± 1.0± 6.0± ± 4.0±.0± D0 D0 TT 1.5± 1.±0. 1.5± 1.±0. ECN Engineering Change Notice The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet. Packaging Size EIA Size EIA(EIAJ) (EIAJ) Standard Packing Quantity (pcs /reel) 4, Storage Conditions Temperature ~8, Humidity 40~75% Recommended Pad Layout PadLayout Layout Dimensions Pad Dimension a b a b cc

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