ECSEL Consortium Building Event 2015

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1 ECSEL Consortium Building Event 2015 Sub Project proposal (Anti Counterfeiting Technology Integration ON SC industrially relevant packaging environment) Stephanie Pesseguier, STMicroelectronics, Rousset (France)

2 Sub Project Overview Sub Project Title Sub Project Leader Company Profile: ST Contact Sub Project Goals Achievements expected Resources ACTION (Anti Counterfeiting Technology Integration ON SC industrially relevant packaging environment) ST Rousset: sub project leader coordinating the whole Counterfeit activities ST Rousset SAS: 2700 employees (45% engineers) hosting 8 wafer Fab (Automotive quality level, 0.35µ 90nm technologies), Electrical Wafer Sort EU regional center (8 and 12 wafers), R&D, Design & Application centers, Marketing. Stephanie Pesseguier Validate & demonstrate the feasible integration of the anti counterfeiting technologies insertion process onto ICs packages, within ST specified industrially relevant environments: In compliancy with SC industrial packaging constraints & requirements Using innovative tagging, reading & assembly technologies/techniques Testing on industrial prototypes equipment within industrially relevant backend assembly environments Acquire technical & economic performances information upon the industrial integration ST FRANCE (several entities): ~60 men months, ALL: ~150 men months ECSEL Consortium Building Event April Brussels 2

3 Sub Project Benefits Technologies/Techniques brought by ST: its manufacturing and production know how in assembly packaging domain 2 anti counterfeiting technologies (A/T) of different intrinsic properties 2 industrially relevant environments for the A/T integration and industrial demonstration its know how on A/T insertion onto SC packages (ESIP project outcomes, ENIAC) its leadership and technical know how in the fight against the counterfeiting societal plague ECSEL Consortium Building Event April Brussels 3

4 Sub Project Tasks Phase 1: Requirements, specifications, integration schemes elaboration for: Innovative assembly techniques and tagging & reading equipment/material technologies Industrially relevant environments complete profiles Phase 2: Development & unit testing/measurement of: Automatic tagging & reading prototypes equipment Special materials needed for the prototypes cabling/ integration within the relevant industrial environment Phase 3: System integration and validation of tagging & reading prototypes within the assembly lines: System integration and validation testing System optimization Phase 4: System acceptance analysis, final assessment Outcome: Acquired technical and economic performances information of the industrial tagging and reading integrated system and processes ECSEL Consortium Building Event April Brussels 4

5 Sub Project Needs Status: Anti counterfeited technologies validated, but not the tagging/reading equipment technologies/techniques Positioning: TRL5 (Technology validated in industrially relevant environment) so upon the tagging & reading technologies readiness maturity: RIA: exploration of new tagging/reading equipment technologies & processes (applied research, integration, testing and validation of equipment prototypes) IA: design of new, altered or improved processes & tools (pilot line, demonstrators, prototyping, testing) Partners still under prospection: Printing/laser tagging & reading technologies/techniques Aspired approach: to be hosted as a sub project within a larger project (to gain higher impact, spread & momentum) dealing with following domains : Key Enabling Technologies: Smart Production / Smart Society (security enabling components & systems) Essential Technologies: Semiconductor processing, equipment and materials / Process Technologies / Smart Systems integration Hosting project possible fields: packaging, equipment development (laser, screen/pad printing...), assembly manufacturing performances improvement, ECSEL Consortium Building Event April Brussels 5

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