Not Recommended for New Designs

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1 - EMIlamp TM Description The Elamp TM 57N is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. They have been optimized for protection of touch screen displays, secure digital (SD) card interfaces, and color LD panels in cellular phones and other portable electronics. The device consists of six pi filter circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 00 and a component capacitance value of 0pF are used to achieve 0dB minimum attenuation from.0ghz to GHz. The device also includes discrete TVS diodes for dedicated ESD protection. All of the TVS diodes provide effective suppression of ESD voltages in excess of ±5kV (air discharge) and ±8kV (contact discharge) per IE , level. PIN onfiguration IN 00 0pF 0pF GND OUT R = 00, =0pF (max) 6X Elamp57N EMI Filter and ESD Protection for Secure Digital ard Interfaces Features Mechanical haracteristics 6 pin QFN RoHS/WEEE ompliant Nominal Dimensions:.0 x.0 x.0 mm Lead Pitch: 0.5mm Lead Finish: Matte Tin Marking: Marking ode Packaging: Tape and Reel per EIA 8 Applications EMI/RFI filter with integrated ESD protection ESD protection to IE (ESD) Level, ±5kV (air), ±8kV (contact) Filter performance: >0dB attenuation at.8ghz TVS working voltage: 5V Resistor: 00 omponent apacitance: 0pF (VR = 0V) EMI & ESD protection for six lines Dedicated ESD protection for four lines Solid-state technology Touch Screen Display Interfaces Secure Digital (SD) Memory ard Interfaces Multimedia ard Interfaces (MI) olor LD Panel Protection ell Phone Handsets and Accessories Package onfiguration IN/OUT IN/OUT 6 GND 5V TVS X 6 Pin QFN (Top Side View) Maximum Dimensions (in mm) Revision 05/6/005

2 Maximum Ratings Rating Symbol Value Units ESD per IE (Air) ESD per IE (ontact) Electrical haracteristics +/- 0 V ESD +/- Junction Temperature T J 5 o Operating Storage TVS TVS Temperature Temperature P arameter r Reverse Stand-Off Voltage Reverse Breakdown Voltage S ymbo l V WM ondition s T op 0 to +85 T STG 55 to +50 M inimu m kv - o - o T ypica l M aximu m R 5 V V R Unit s B I t = ma V T VS Reverse Leakage urrent I V R RW =.V 0. 5 µ A M Total Series Resistance R Each Line Ohms Total Total apacitance apacitance i n Input to Gnd, V R Each Line = 0V, f = MHz i n Input to Gnd, V R Each Line =.5V, f = MHz 0 pf 5 pf 005 Semtech orp.

3 0 db -6 db - db -8 db - db -0 db -6 db - db Typical Insertion Loss S (Each Filter) HS LOG MHz 6 db / REF 0 db 0 MHz 00 MHz START.00MHz STOP MHz ESD lamping (+8kV ontact) apacitance vs. Reverse Voltage (Normalized to 0 volts) GHz GHz : db MHz : db 900 MHz : -.8 db.8 GHz : -.09 db.5 GHz...0 HS LOG Analog rosstalk (Each Line) 6 db / REF 0 db START. 00MHz STOP MHz ESD lamping (-8kV ontact) Series Resistance vs. Temperature (Normalized to 5 Degrees elcius) f = MHz Reverse Voltage - V R (V) Temperature (*) 005 Semtech orp.

4 Applications Information Device onnection The Elamp57N is comprised of six circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. It also includes lines of TVS diodes for ESD protection of power lines or high speed I/O lines. The device is housed in a 6-pin Quad Flat No-Lead (QFN) package. Electrical connection is made via 6 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is designed for easy PB routing as shown in the application examples. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 00% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Pin Identification and onfiguration (Top Side View) Pin Identification,, 5, 7, 9, 0 Input EMI/ESD Protected Lines,,,,, 6 Output EMI/ESD Protected Lines 6, 8,, 5 Input/Output ESD Protected Lines enter Tab Ground Pin onfiguration and Schematic Semtech orp.

5 Typical Applications 005 Semtech orp. 5

6 Outline Drawing - 6L QFN PIN INDIATOR (LASER MARK) NOTES: aaa Land Pattern - 6L QFN.. E A A A N e D/ D D e/ LxN bxn bbb A A B DIMENSIONS INHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A - (.008) - - (0.0) - b D D E E e.00 BS 0.50 BS L N 6 6 aaa bbb SEATING PLANE ONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). OPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. x () NOTES:. R X H P x Y x G B E E/ x Z DIM G H R P X Y Z THIS LAND PATTERN IS FOR REFERENE PURPOSES ONLY. ONSULT YOUR MANUFATURING GROUP TO ENSURE YOUR OMPANY'S MANUFATURING GUIDELINES ARE MET. DIMENSIONS INHES MILLIMETERS (.) (.85) Semtech orp. 6

7 Marking Ordering Information N YYWW Top View Showing Device Marking 0 9 Notes: ) YYWW = Date ode ) Pin indicated by bevel on the ground pad Tape and Reel Specification ontact Information Tape Specifications Bottom View Showing Pin Identifier Part Number Semtech orporation Protection Products Division 00 Flynn Rd., amarillo, A 90 Phone: (805)98- FAX (805)98-80 Qty per Reel ReelSize Elamp57N.TT Inch Elamp and EMIlamp are marks of Semtech orporation Device Orientation in Tape 005 Semtech orp. 7

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