MODERN VACUUM TECHNOLOGY; COMPARING PLA TO OTHER BARRIER SUBSTRATES. Presented by Jim Lush
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1 MODERN VACUUM TECHNOLOGY; COMPARING PLA TO OTHER BARRIER SUBSTRATES
2 OUTLINE High Barrier Metallizing The Metallizing Process Barrier Properties In Chamber Top Coating The top coating process Barrier properties SiOx Coating The EB coating process in chamber Barrier Properties Summary
3 HIGH BARRIER METALLIZING
4 The Metallization Process
5 The Winding System
6 The Metallizing Zone
7 Barrier Ranges of Films Standard Basic tea and coffee packaging BASIC High Barrier liquid packaging HIGH Ultra High Barrier Bag-in-box, dried soup mix HIGHER!
8 HIGH BARRIER MET PET Standard vs. High Barrier Oxygen Transmission Rates OTR (cc/100 in2/day Standard Conditions 2.3 OD Standard Conditions 2.8 OD Barrier Conditions 2.3 OD Barrier Conditions 2.8 OD WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
9 HIGH BARRIER MET PET Standard vs. High Barrier Water Vapor Transmission Rates WVTR (g/100 in2/day Standard Conditions 2.3 OD Barrier Conditions Standard Conditions 2.8 OD 2.3 OD Barrier Conditions 2.8 OD WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
10 BARRIER VALUES Product MVTR Values g/100in²/24 hr. OTR Values cc/100in²/24 hr. Metallizing Condition PET Standard PET High Barrier <0.02 <0.02 OPP Standard <0.03 <4 OPP High Barrier 0.01 <3.0 PLA Standard PLA High Barrier WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
11 IN CHAMBER TOP COATING
12 The In Chamber Coating Process
13 THE COATING ASSEMBLY
14 Metal layer PINHOLE THEORY Gas transmission rate through a metallized film is controlled by the number of defects in the metal layer Defects Substrate Gas flow
15 PINHOLE THEORY What causes the defects? Roller debris Metal layer Substrate Scratches in the metal layer from debris on rollers Impurities in the surface flaking off Antiblock particles Oligomers & waxes
16 PINHOLE THEORY How does a coating prevent the defects? Roller debris Coating Metal layer Substrate Impressions in the coating instead of scratches in the metal layer Impurities in the surface are trapped
17 PINHOLE THEORY Uncoated Coated
18 BARRIER VALUES Material Metallizing Condition MVTR Values g/100in²/24 hr. Improvement Percentage OTR Values cc/100in²/24 hr. Improvement Percentage PET UNCOATED PET COATED OPP UNCOATED COATED PLA UNCOATED COATED COATED WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
19 SiOx COATING
20 The SiOx Coating Process Rewinder Unwinder Plasma pretreatment Electron beam evaporation
21 The SiOx Winding Zone
22 The SiOx Coating Zone
23 SiOx-PLA Barrier Development MVTR Values g/100in²/24 hr. OTR Values cc/100in²/24 hr. Product SiOx PET SiOx PET laminated to 80g CPP SiOx OPP SiOx OPP laminated to 80g CPP SiOx PLA SiOx PLA laminated to 80g PLA WVTR tested at 100º F, 90% RH OTR tested at 73.4º F, 50% RH
24 SUMMARY
25 SUMMARY PLA films can be effectively run through various barrier processes. Improved barrier values can be achieved, for PLA to be used for flexible packaging applications. In chamber coating significantly improves the barrier values of metallized PLA.
26 Contact information: Office: x235 Mobile: Website:
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