3 Scotch-Weld TM. Thermal Expandable Structural Adhesive Film AF 3090 TEF. Technical Datasheet February 2011

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1 3 Scotch-Weld TM Thermal Expandable Structural Adhesive Film AF 3090 TEF February 2011 Introduction 3M Scotch-Weld is a 250 F (120 C) to 350 F (180 C) curing adhesive film which is designed to give excellent bond properties when used with both metal to metal, and composite bond applications. Scotch-Weld AF 3090 TEF Film has a combination of features that provide exceptional impact and peel strength as well as highly toughened properties. It is also a flexible system that makes the product resistant to cracking and fracturing. Due to this feature, the film provides excellent properties for edge-finishing of sandwich structures to eliminate cracking and repairs during use and manufacturing of these structures. Expansion of the product during cure enables it to provide excellent wide-bondline and gap-filling properties. It is designed for filling of mismatched bond surfaces, and for core-splicing, or reinforcing honeycomb. Due to its flexible nature this material helps dampen impact forces. Advantages Excellent bond strength from -67 F to 350 F Excellent impact resistance Highly-toughened flexible system High peel strength Structural shear strength in thick bondline applications Conformable Extremely durable Excellent shop open time and shelf life Capable of low pressure bonding Film form eliminates mixing and clean up necessary for paste adhesives Sandwich structure edge-finishing/sealing Core-splice Typical Physical Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Color and consistency: Chemistry: Homogenous black film Modified epoxy Form: Unsupported film Normal Caliper and Areal weight: 50 mil (1.27 ± 0.13 mm, 1375 ± 150 g/m mil (2.54 ± 0.25 mm) 2750 ± 300 g/m 2 Suggested cure cycle: 250 F to 350 F (120 C to 180 C) with a heat rise of 2 F to 8 F per minute. Typical expansion ranges (according to EN2667-3): For 250 F (120 C) cure 40-70% For 350 F (180 C) cure % Vertical flow (according to EN M Method):.02" (0.5mm) (250 F or 350 F [120 C or 180 C] cure) Volatiles (according to ASTM D3530 [EN2667-3]): Sag: Service Temperature: <1.0% (250 F or 350 F cure) [120 C or 180 C] Non-sag 250 F to 350 F (120 C to 180 C)

2 Typical Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Thick Adherend Shear Properties (KGR) to ASTM D Cure Cycle: 260 F, 60 minutes, 15 psi, 3 F/min. heat rise Bondline Ultimate Ultimate Yield Yield Shear Test Temp Thickness Shear Elongation Stress Elongation Modulus (in) (psi) (in) (psi) (in) (psi) 75 F ,326 Bondline Ultimate Ultimate Yield Yield Shear Test Temp Thickness Shear Elongation Stress Elongation Modulus (in) (psi) (in) (psi) (in) (psi) 75 F , F ,185 Overlap Shear properties to ASTM D1002 The Overlap Shear strength has been determined using the procedure outlined according to ASTM D1002. Overlap Shear panels were prepared by placing metal shims to off set substrates at various bondline thicknesses. This evaluation was intended to show properties of 3M Scotch-Weld Thermal Expandable Structural Adhesive Film AF 3090 TEF when used to bond metal to metal and composite to composite substrates that have irregular or wide interfacing surfaces or voids that need to be filled. The Overlap Shear values in the table below were established using multiple lots of Scotch-Weld AF 3090 TEF Film in the 50 Mil and 100 Mil form. The Overlap Shear bond panels for the enclosed data were cured in a press using a heat rise of 3 F a minute to 260 F with a dwell of 1 hour followed by a 8 F per minute cool down to 185 F. Light pressure was applied (15 psi) to hold the configuration flat and in place during cure. During this cure cycle the Scotch-Weld AF 3090 TEF Film was applied to the lower substrate surface, and during cure expands to fill the void and attach to the upper substrate surface to simulate voids or irregular wide bond interfacing surfaces

3 Typical Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Overlap Shear Values: ASTM D T3 Clad Aluminum 0.063" Thick Substrates on all Overlap Shear panels Table 1: Metal to Metal Substrate Bonding. Initial Application Screening 1" X 1/2" Overlap. 50 Mil Thickness Adhesive Film Test Group Test Method Test Bondline Average Mode of Condition Thickness and Shear Strength Failure Condition (psi) 1 ASTM D F Wedged Bondline 2841 Cohesive 0.007" to " 2 ASTM D F 0.003" 4644 Cohesive 3 ASTM D F 0.025" 2464 Cohesive 4 ASTM D F Wedged Bondline 2700 Cohesive " to " 5 ASTM D F 0.062" 2008 Cohesive Overlap Shear Continued: ASTM D1002 1" X 1" Overlap 50 Mil Adhesive Film Bondline Test Exposure Peak Load Peak Stress Failure Thickness Temperature Type (lbf) (psi) Mode (Gap Fill) 0.032" -65 F N/A Cohesive Adh " 75 F N/A Cohesive Adh " 180 F N/A Cohesive Adh " 75 F Wet % RH Cohesive 120 F 30 days 0.060" -65 F N/A Cohesive Adh " 75 F N/A Cohesive Adh " 180 F N/A Cohesive Adh " 75 F Wet % RH Cohesive 120 F 30 days Table 2: Wide Area Shear Values Metal to Metal 1" X 1" Test Area (modified) MMM-A-132B Metal 2024T3 Clad Aluminum 0.063" Substrates Bondline Thickness Test Exposure Peak Load Peak Stress (Gap Fill) Temperature Type (lbf) (psi) 0.032" 75 F N/A " 180 F N/A

4 Typical Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Table 3: Metal/Metal Floating Roller Peels ASTM D5167 Metal 2024T3 Clad 0.025" and 0.063" Substrates Bondline Thickness Test Exposure Average Failure (Gap Fill) Temperature Type (lb/in) Mode 0.032" -65 F N/A 25 Cohesive Adh " 75 F N/A 24 Cohesive Adh " 180 F N/A 32 Cohesive Adh " -65 F N/A 20 Cohesive Adh " 75 F N/A 22 Cohesive Adh " 180 F N/A 32 Cohesive Adh. Table 4. Flatwise Tensile ASTM D297 Metal 2024 T3 Clad 0.063" Aluminum Substrates, Aluminum Honeycomb core 1/4" Cell 4 lb Density Bondline Thickness Test Exposure Peak Load Peak Stress (Gap Fill) Temperature Type (lbs) (psi) N/A 75 F N/A N/A 180 F N/A N/A 75 F Wet % RH F 30 days Table 4: Additional Test Values for 0.060" to 0.085" Bondline Thicknesses (Gaps) D1002 Over Lap Shears. Bondline Thickness Test Exposure Peak Load Peak Stress (Gap Fill) Temperature Type (lbs) (psi) F N/A F N/A F N/A F N/A F N/A F N/A F N/A F N/A

5 Typical Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 1. Tube shear strength: The tube shear strength has been determined on 3M Scotch-Weld Thermal Expandable Structural Adhesive Film AF 3090 TEF using the procedures outlined in AE CMA standard EN Tube shear specimens are prepared by placing 50 ± 0.2 grams of Scotch-Weld AF 3090 TEF Film between the walls of two 228 mm (8.97 in.) long tubes. Test specimen Core splice film adhesive Outer and inner tubes: 228 mm long aluminum alloy bare tubes Outer tube has an outer diameter of 25.0 mm and a thickness of 1.25 mm. Inner tube has a outer diameter of 12.5 mm and a thickness of 1.25 mm Tube Shear resistance is calculated by the following formula: F σ [MPa] = πd inner h All tubes were pre-treated with sulfo-chromic etching before bonding operation. Condition Test Temperature Cure Cycle 1 Cure Cycle 2 Initial -55 C (-67 F) 1465 PSI (10 MPa) 1015 PSI (7 MPa) Initial +23 C (73 F) 1610 PSI (11 MPa) 1494 PSI (10 MPa) Initial +80 C (176 F) 957 PSI (7 MPa) 957 PSI (7 MPa) Dry heat at +80 C, 1000h +23 C (73 F) 1479 PSI (10 MPa) 1392 PSI (10 MPa) Dry heat at +120 C, 750h +23 C (73 F) 1508 PSI (10 MPa) Demineralized water at +23 C, 1000h +23 C (73 F) 1378 PSI (9 MPa) 1291 PSI (9 MPa) Demineralized water at +40 C, 750h +23 C (73 F) 1378 PSI (9 MPa) 95% Humidity at 70 C, 750h +23 C (73 F) 1363 PSI (9 MPa) 5% NaCl Saltspray at +35 C, 750h +23 C (73 F) 1537 PSI (11 MPa) Jet fuel F35 at +23 C, 1000h +23 C (73 F) 1537 PSI (11 MPa) 1407 PSI (10 MPa) Tri-N-Butyl Phosphate at +23 C, 1000h +23 C (73 F) 1349 PSI (9 MPa) 1204 PSI (8 MPa) Lubrification oil O-160 at +23 C, 1000h +23 C (73 F) 1624 PSI (11 MPa) 1450 PSI (10 MPa) Cure Cycle 1: 125 C (237 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate, atmospheric pressure. Remark: 3M Scotch-Weld Cured density in this configuration 0.75g/cc. Cure Cycle 2: 175 C (347 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate, atmospheric pressure. Remark: Scotch-Weld AF 3090 Film Cured density in this configuration 0.67g/cc

6 Typical Performance Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 2. Peel properties: The floating roller peel strength has been determined on 3M Scotch-Weld Thermal Expandable Structural Adhesive Film AF 3090 TEF using the procedures outlined in ASTM D-3167 (EN ). Specimens bondline thickness was controlled by a PTFE covered hard shim on all 4 sides (See figure below). Scotch-Weld AF 3090 TEF Film100mil - Hard shim thickness 3.3 mm (0.13 in.) Scotch-Weld AF 3090 TEF Film 50mil - Hard shim thickness 1.7 mm (0.07 in.) Configuration ensures controlled expansion. RIGID ADHEREND FLEXIBLE ADHEREND Clad aluminum 2024T3 peeling skin and backing plate was pretreated with sulfo-chromic etch before bonding operation. Thickness Cure Cycle 1 Cure Cycle 2 Scotch-Weld AF 3090 TEF Film 50mil 293 N/25mm 195 N/25mm Scotch-Weld AF 3090 TEF Film 100mil 220 N/25mm 141 N/25mm Cure Cycle 1: Cure Cycle 2: 125 C (260 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate, 100 kpa. 175 C (350 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate, 100 kpa. 3. Impact properties (shear mode): Impact strength was determined using modified ASTM D-950 test method. Impact specimens are made from FPL etched 2024T3 bare aluminum with (25 x 25) mm bonded area. Shim was used for expansion control to reach a specific thickness as noted in test tables. Film Version Cure 1 Expansion Cure 2 Expansion Scotch-Weld AF 3090 TEF Film 50mil 50-80% % Cure Cycle 1: Cure Cycle 2: 125 C (260 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate. 175 C (350 F) for 60 minutes with a 3.0 C (3-5 F)/min. heat up rate

7 Application Surface preparation A thoroughly cleaned, dry grease-free surface is recommended for maximum performance. Cleaning methods, which will produce a breakfree water film on metal surfaces, are generally satisfactory. A. Aluminum skins (3M company optimized FPL etch and Phosphoric Acid Annodize) 1.) Degreasing with Methyl Ether Ketone (MEK)* 2.) 10 to 20 minutes immersion of alkaline degreasing 8% Oakite Aluminum Cleaner 164 at 85 ± 5 C 3.) Rinsing in tap water 4.) FPL Etch 5.) Rinse 6.) Phosphoric Acid Annodize 7.) Rinsing in tap water 8.) 15 minutes drying at 23 ± 2 C 9.) 10 minutes drying at 70 ± 2 C Caution: Use adequate respiratory, eye and skin, protection when using etch solutions. B. Aluminum Honeycomb core 1.) Soak in clean aliphatic naphtha* (conforms to TT-N-95A) for five minutes at room temperature. 2.) Dry 10 minutes at 65 ± 5 C Optional : 1.) Immerse in etching solution for two minutes at 70 ± 2 C. 2.) Rinsing in tap water 3.) Air dry or force dry in similar manner to skin panels. *Note: When using solvents, extinguish all ignition sources including pilot lights, read and follow manufacturer s precautions and directions for use. Film Care should be taken to avoid contaminating adhesive and cleaned or primed aluminum by any substance that will hinder wetting action of the adhesive. Film application: 1.) Let film adhesive reach room temperature 2.) Cut portion of film to be used from roll with protective liners in place. 3.) Remove liner from one side of the film. 4.) Place film on metal or edge of honeycomb core using the remaining liner as a protective cover. 5.) On metal surfaces, roll film into position with a rubber roller to insure that no air is trapped between the film and metal. 6.) Remove second protective liner. 7.) Assemble parts and cure. Storage Stability Storage at -18 C (0 F) or below is suggested for 3M Scotch-Weld Thermal Expandable Structural Adhesive Film AF 3090 TEF to obtain maximum shelf life of 12 months from date of shipment from 3M. Care must be taken when handling Scotch-Weld AF 3090 TEF Film at low temperatures because it can easily crack. Warm Scotch-Weld AF 3090 TEF Film to ambient conditions in the sealed package to prevent moisture condensation on the adhesive surface. Scotch-Weld AF 3090 TEF Film offers a room temperature stability of 20 days when exposed in controlled conditions (23 ± 2 C [74 ± 5 F], 50+5% RH). Please note that room temperature exposures are accumulative

8 Precautionary Information Refer to Product Label and Material Safety Data Sheet for health and safety information before using this product. For additional health and safety information, please visit or call or (651) For Additional Information In the U.S., call toll free , or fax or For U.S. Military, call If you are outside of the U.S., please contact your nearest 3M office or one of the following branches: Australia Austria Brazil Canada tel tel tel ext tel fax fax fax fax China Denmark France Germany tel tel tel tel fax fax fax fax Italy Japan Korea Netherlands tel tel tel tel fax fax fax fax South Africa Spain Switzerland United Kingdom tel tel tel (0) tel fax fax fax (0) fax Technical Information The technical information, recommendations and other statements contained in this document are based upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed. Product Use Many factors beyond 3M s control and uniquely within user s knowledge and control can affect the use and performance of a 3M product in a particular application. Given the variety of factors that can affect the use and performance of a 3M product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and suitable for user s method of application. Warranty, Limited Remedy, and Disclaimer Unless an additional warranty is specifically stated on the applicable 3M product packaging or product literature, 3M warrants that each 3M product meets the applicable 3M product specification at the time 3M ships the product. 3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the 3M product does not conform to this warranty, then the sole and exclusive remedy is, at 3M s option, replacement of the 3M product or refund of the purchase price. Limitation of Liability Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product, whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract, negligence or strict liability. These products were manufactured under a 3M Quality Management System registered to the AS9100 standard. 3 Aerospace and Aircraft Maintenance Department 3M Center, Building 223-1N-14 St. Paul, MN M and Scotch-Weld are trademarks of the 3M Company. Oakite is a registered trademark of Chemetall GmbH. Please recycle. Printed in U.S.A. 3M 2011 (2/11) All rights reserved

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