CENTER FOR MICROSYSTEMS TECHNOLOGY (CMST) IMEC UGENT TECHNOLOGIEPARK (BLDG 914) B-9052 GENT
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1 CENTER FOR MICROSYSTEMS TECHNOLOGY (CMST) IMEC UGENT TECHNOLOGIEPARK (BLDG 914) B-9052 GENT
2 CMST: DESIGN & TECHNOLOGY OF MICROSYSTEMS
3 ORGANIZATIONAL STRUCTURE Faculty of Engineering and Architecture Smart Systems and Energy Technology Department of Electronics and Information Systems Body Area Networks Personnel Infrastructure Equipment Personnel Equipment
4 WORKING MODEL Open innovation partnership Funded projects (UGent funds, FWO, IWT-SBO) SIF program Large area electronics Human++, GaN, Solar Funded projects (EC, IWT) Industrial Affiliation programs
5 CMST FIGURES Employees : 55 (status 5/2013) Imec payroll : 25 University payroll : 30 Income UGent : University projects / grants / wages Imec : Industrial project income Investments in : 3 MEuro EU - FP7 Bilateral Ind. IWT - SBO IWT - O&O Personal grants IWT-SBO FWO UGent projects Sponsored grants imec budget UGent budget
6 Biomedical & Health Telecom Energy Ambient intelligence Displays & Lighting CMST TECHNOLOGY AND APPLICATION DOMAINS Advanced Packaging X X X X Stretchable Microsystems X X X Polymer Structuring and microfluidics X X Polymer Photonics and Laser Technology X X X X Smart Power X X X Display technology X X
7 ADVANCED PACKAGING Foil-based interconnects UTCP Component embedding Modeling 2 nd level assembly PET-Cu & PET-Al UTCP processing Embedding in PCB UTCP embedding Yield & Cost Processing Adaptive circuitry RF UTCP Embedding in foil UTCP stacking High-frequency Testing & Analysis CHIP2FOIL IMOLA HOLST-SIF IMEC-IAP PhD Post-PhD HERMES HOLST-SIF IMOLA IMEC-IAP PhD I SEE PROSPERITA GREENELEC THEMA-CNT SUGAR BILATERAL Contact : Maarten.Cauwe@elis.UGent.be
8 RGB display Fitness monitor Conformable light tiles Conformable light systems Washing Endurance testing STRETCHABLE MICROSYSTEMS Printed circuit board and foil based Textile integration Characterization EC-FP7 PLACE-IT HUMAN++ HOLST-SIF EC-FP7 PLACE-IT EC-FP7 PASTA HOLST-SIF EC-FP7 ARMOURS EC-FP7 PLACE-IT EC-FP7 PASTA HOLST-SIF HUMAN++ Contact : Frederick.Bossuyt@elis.UGent.be
9 POLYMER STRUCTURING AND MICROFLUIDICS Soft polymer based bioreactors Rigid bioreactors Electronics integration Porous membrane integration Cell seeding Glass / PC bioreactor Osmotic pump Stretchable MEA s PDMS porous membranes Biodegradable bioreactors Si Microsieve integration Chip in PDMS microfluidics UTCP / thin-film stretch integration IWT-SBO Hepstem, FWO-BioPOM, imec PhD grant EC-FP7-MIRACLE, EC-FP7 Hemibio IWT-SBO Brainstar, imec PhD grants (2) Contact : Jan.Vanfleteren@elis.UGent.be
10 POLYMER PHOTONICS AND LASER TECHNOLOGY Board-level optical interconnects Fiber connectivity Artificial optical skin Opto-electronic nose Laser patterning organic electronics Flex waveguide Laser cleaved fiber OE pressure sensor Stretch waveguide Patterned flex OLED Waveguide fluorescence Embedded VCSEL Self-written waveguide OE shear sensor PEDOT ablation EC-FP7 FIREFLY BILATERAL IWT O&O LIAM IWT O&O EP2CON IWT-SBO FAOS EC-FP7 PHOSFOS EC-FP7 ACTMOST HOLST-SIF HOLST-SIF EC-FP7 FAST2LIGHT EC-FP7 IMPROV Contact : Geert.VanSteenberge@elis.UGent.be
11 DISPLAY SYSTEMS Microdisplays Solid-state projection Multiview 3-D projection Smart lenses LC and polymers LCOS LED drivers Optical setup (VUB) Curved display technology Materials research Micromirrors Cockpit display Efficient multiview coding Solar contact lens Light steering IWT-SBO Gemini EC-FP7 ODICIS EC-FP7 ODICIS FWO 3D FWO 3D FWO Licofast FWO - Licofast IWT-SBO - Secondos Contact : Herbert.DeSmet@elis.UGent.be
12 SMART POWER ASIC DESIGN Integrated power converters Drivers for displays / lighting Smart PV components MEMS devices / drivers Power devices (TCAD) Bistable LCD driver MEMS microswitch Si lateral IGBT Monolithic drivers + rectifiers for DC-DC converters OLED driver Active bypass IC, Reconfiguration switch MEMS bias generator GaN HEMT Bilateral EC-FP7 IMOLA IWT-SBO Smart PV Bilateral IIAP GaN-on-Si Contact : Jan.Doutreloigne@elis.UGent.be
13 CLEANROOM and LAB FACILITIES Cleanroom area : 730 m 2, 438 m 2 production bays 120 m 2 ISO 3 / 306 m 2 ISO 4 / 12 m 2 ISO 5 Lab facilities area : 290 m 2 14
14 Analysis and measurement Process analysis Surface analysis: - 3D optical profilometry (WYKO) - Step height measurement (Tencor) - Static contact angle Microscopy: - Optical - SEM-EDS Electrical measurements Measurement platforms: - Four-point measurements - Custom PCB probe table - Parametric probe station Analysis equipment: Source-measure unit, Parametric analyzer, Precision LCR meter, RF Impedance analyzer, Spectrum analyzer, Vector Network Analyzer (10 MHz 50 GHz) Reliability & Failure Analysis Cross sections: - Molding in resins - Ion beam polisher - Au & C coater Climate Chambers: - TS, THT, TCT - In-situ resistance monitoring Solder ball Mechanical testing: - Peel force (90 &180 ) - Shear and pull testing - Stress/strain - Cyclic endurance 15
15 16
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