Workshop on SMT Stencils. Sakthivel Padmanapan
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1 Workshop on SMT Stencils Sakthivel Padmanapan 1 SMTA Chennai 30th May 2014
2 What is STENCIL? 2 SMTA Chennai 30th May 2014
3 In general, the stencil is a simple tool to make repetitive impression. Is being commonly used by every one at least once in life time. 3 SMTA Chennai 30th May 2014
4 Varieties of STENCILS 4 SMTA Chennai 30th May 2014
5 Varieties of STENCILS 5 SMTA Chennai 30th May 2014
6 What is SMT Stencil? Aluminium Frame Polyester Mesh Aperture Layout Stencil Foil The Stencil foil is tensioned and fixed to the frame by polyester mesh. The Tension of the Stencil Foil is around 40N/cm (± 5N/cm) 6 SMTA Chennai 30th May 2014
7 Stencil Printing 7 SMTA Chennai 30th May 2014
8 Stencil Printing Process 1. Aligning Board to Stencil 8 SMTA Chennai 30th May 2014
9 Stencil Printing Process 2. Moving Squeegee on the Stencil Filling Apertures 9 SMTA Chennai 30th May 2014
10 Stencil Printing Process 3. Separating Stencil from the Board 10 SMTA Chennai 30th May 2014
11 Manufacturing Technology The holes, or apertures, are formed by one of these three methods: Electroforming Electroforming, is an additive process whereby the stencil foil is created by electroforming nickel. Chemical Etching Laser Cutting These TWO processes are subtractive in that the removal of material from the stencil foil, either by chemical etching or laser cutting, creates the aperture. 11 SMTA Chennai 30th May 2014
12 Electroformed Stencil Manufacturing Process 12 SMTA Chennai 30th May 2014
13 Electroformed Stencil Advantages No stress in the material Any thickness Cost price independent from number of apertures Tapered slots High precision Disadvantages Higher initial cost Higher processing time Film tooling required 13 SMTA Chennai 30th May 2014
14 Chemical Etching Stencil Manufacturing Process 14 SMTA Chennai 30th May 2014
15 Chemical Etching Stencil Advantages Disadvantages Other materials possible Low Cost Rough aperture sidewalls Hour Glass Shape of sidewalls Process releases tension in stainless steel Restricted to Minimum pitch size is 0.63mm 15 SMTA Chennai 30th May 2014
16 Chemical Etching Stencil 16 SMTA Chennai 30th May 2014
17 Laser Cut Stencil Stencil Manufacturing by Laser Cutting 17 SMTA Chennai 30th May 2014
18 Why Laser Cut STENCILS? The repeatability of dimensions in laser-cut stencils is generally better than that of chemical etching. With laser cutting, there are no photo films requiring precise alignment or protection from moisture 18 SMTA Chennai 30th May 2014
19 Frameless Laser Cut Stencil Manufacturing Main Process Gerber File Processing DfM Study Check Plot Confirmation Hole Cutting Hole Checking Cutting No Yes Deburring & Polish With Frame Welding Sub Assembly Meshed Frame Framing Stencil & Aluminium Frame Surface Smoothening Silkscreen Assembly Gluing Final QC Packing 19 SMTA Chennai 30th May 2014
20 INPUT Works Direct from CAD/CAM Data Preferably in GERBER-X format Other CAD outputs also can be taken a) AutoCAD DXF/DWG b) HPGL format c) CNC data 20 SMTA Chennai 30th May 2014
21 Laser Cut Stencil Manufacturing Advantages Disadvantages Faster Production Turn around. Tapered slots No film tooling Rough aperture sidewalls Additional Deburring process to smoothen the hole wall. 21 SMTA Chennai 30th May 2014
22 Comparison of Technologies Technology Technology Accurate apertures High number of holes Long production runs Fast delivery Paste yield Price/ performance Etched Laser* Electroformed * Laser Cut Stencils with Hole Wall & Surface Polish 22 SMTA Chennai 30th May 2014
23 Controllable Elements On Design: Aperture Design Aperture Reduction Component PAD Geometric On the Stencil De-Burring Process Stencil Material Laser Cutting Parameters On the Performance of the Stencil DfM Analysis Skill Manufacturing Experience Effect of Squeegee Blades 23 SMTA Chennai 30th May 2014
24 Aperture Dimensional Parameters Empirical relationships between aperture size and thickness Aspect Ratio (for components with L>5W) Width / Thickness (W/T) should be > 1.5 Area Aspect Ratio (for components with L=W) (LW) / (2T(L+W)) should be
25 Aspect Ratio and Area Ratio Rules Aspect ratio ensures that the aperture will allow the printed material to release onto the substrate Area ratio ensures that the forces pulling a material onto the pad are greater than the forces holding it in the aperture Pad Pulling Tension (P) = Retaining Wall Tension (R) Aperture (Length (L) x Width (W)) Stencil Thickness (T) x Aperture Perimeter (2 x (L+W)) SMTA Chennai 30th May 2014
26 Trapezoidal Shaped Apertures Aperture openings which are to mm larger on the contact side (PCB side) than on the squeegee side based on foil thickness. Trapezoidal apertures, which enhances effective solder paste release, also form a brick-like deposit that assists firm component placement 26 26
27 DfM Analysis on Aperture Design Defect Photo Stencil Design After DfM Design Result Mid Chip Solder Balling -R/C Chip -Medial 25% Cut -Solder Ball prevention Solder Bridging at QFN Pads --Centre PAD Cut : Hourglass shape application - Inside 0.18 mm, outside mm -Dummy PAD : Medial 10% Cut Hourglass shape DNA -Reverence (the way) 5% extension -A Round (Oblong) outside application A : CAD PAD width Slitting of Heat Sink area B : 1/4 Cutting work C : Mask reinforcing band width (1.0 mm ) D:Outside : 0.3 mm extension 27 SMTA Chennai 30th May 2014
28 Stencil Design Guide 28 SMTA Chennai 30th May 2014
29 PAD Design for PASSIVE SMD Components Design Home Plate Inverse Home Plate Rounded Inverse Home Plate CAD Data Stencil Output After Print 29 SMTA Chennai 30th May 2014
30 PAD Design for PASSIVE SMD Components Worst Case For MCSB 6 mil foil Best Case For MCSB 5 mil foil Experimental Apertures 5 & 6 mil foils Not recommended Potential squeegee & stencil damage 30 SMTA Chennai 30th May 2014
31 PAD Design for SMD Components Home Plate Zipper Pads Before After Before After Cross Pattern MELF Pads Before After Before After 31 SMTA Chennai 30th May 2014
32 Deburring Process (POLISHING) Electro Polishing F2 Polishing Pumice Polishing 32 SMTA Chennai 30th May 2014
33 ELECTRO POLISHING 33 SMTA Chennai 30th May 2014
34 F2 POLISHING F2 Polishing (Deburring Process) Why is F2 Polish: This F2 Polishing done after Laser Cutting to Deburr the Aperture. The F2 Polishing was developed for the next generation Laser Cut Stencils. This polishing technology is UNIQUE compared to Chemical Polishing and Electro Polishing. 34 SMTA Chennai 30th May 2014
35 F2 Polishing Aperture Hole Wall Deburring Due to extremely smooth processing surface and high dimensional precision, the applied solder paste volume can be uniform and stable. Before F2 processing Opening diameter : 0.200mm Stencil thickness : 0.150mm 35 SMTA Chennai 30th May 2014 After F2 processing
36 Effect of F2 Polishing after QFP Printing Before Polish After Polish [Pitch 0.400mm, Aperture width 0.210mm on 0.150mm thickness] 36 SMTA Chennai 30th May 2014
37 NANO COATING Plane Eye View - No Coating Plane Eye View After NANO Coating 37 SMTA Chennai 30th May 2014
38 NANO COATING Top View No NANO Coating Top View after NANO Coating 38 SMTA Chennai 30th May 2014
39 NANO COATING Side View No NANO Coating 39 SMTA Chennai 30th May 2014 Side View - NANO Coating
40 NANO COATING Water Droplet Test Nano Coated (L) No NANO Coat (R) 40 SMTA Chennai 30th May 2014
41 Stencil Physical Parameters for Paste Release Stencil surface finish Controls proper paste roll over the stencil. Paste should not slip Stencil wall finish Controls proper paste flow & release from apertures. Paste should slip on the wall but not stick to it Dependent on the manufacturing method and secondary operations Trapezoidal shape for the apertures Controls stencil release characteristics also dependent on manufacturing method 41 SMTA Chennai 30th May 2014
42 Materials Stencil Material: SUS 304 Fine Grain SUS Nickel Stencil Material: SUS 304 : For normal stencil with better paste release option Fine Grain SUS : Used for Ultra Fine Pitch component pads Stencil Material Storage: All Stencil materials like Stainless Steel Foils, Screen Mesh, Adhesive Glue should be stored at controlled environment. The storage room to be maintained the temperature below 22 deg C. 42 SMTA Chennai 30th May 2014
43 Materials Conventional SUS vs Fine Grain Material SEM observation of etched surface The etching Magnified View of Etched Portion Grain Size Aperture Wall after Laser Cut Conventional SUS-304 Fine Grain SS 43 SMTA Chennai 30th May 2014
44 Cutting Parameters This is what happens when the Laser Cutting parameters are adjusted to increase the stencil quantity. The operators would often run machines faster than the manufacturers recommendations, creating poor hole wall quality. Other problems encountered included warping or oil canning of the stencil material as well as burn marks on or around the apertures. 44 SMTA Chennai 30th May 2014
45 Cutting Parameters This is what Happens when the Laser Cutting parameters are Controlled and adjusted to increase the stencil quality. A knowledgeable, fully trained staff can run a well-made laser system free of Burr, with smooth walls and a high quality finish. Stencils that have been modified for the component footprint/design and have been properly run on a good laser system, will have maximum paste release and barring outside influences (operator error, poor board quality, non-standard component sizes, etc.), will run defect free. 45 SMTA Chennai 30th May 2014
46 SUMMARY Basic stencil design: - For surface mounted passive components aperture reduction rules apply - For SM perimeter styles components (QFPs, QFNs) aperture reduction rules apply; foil thickness calculation is necessary - For common plastic BGA packages (pitch>1.27 mm) round aperture is recommended with reduction considerations - For fine-pitch plastic BGAs (pitch<1.27) square aperture recommended, aperture reduction rules do not apply Step stencils for Pin-in-Paste technology: - For squeegee side steps, technological distance to the nearest surface mounted component is 36x step_thickness - For contact side steps, recommended technological distance to the nearest surface mounted component is 1.6x step_thickness foil_thickness 46 SMTA Chennai 30th May 2014
47 The Effect Of Squeegees 47 SMTA Chennai 30th May 2014
48 The Effect Of Squeegees Tempered Spring Steel Alloy assures many thousands of flexures while maintaining original shape, unlike softer etched blades made from stencil material. 48 SMTA Chennai 30th May 2014
49 The Effect Of Squeegees Permalex Edge Metal Squeegees eliminate pumping and scavenging Improving solder paste deposit quality. The smooth, lubricated edge reduces stencil pulling and stretching, improving pad registration and stencil life. 49 SMTA Chennai 30th May 2014
50 The Effect Of Squeegees Check that your squeegee, stencil and pcboard stack are parrallel and rigid as possible Set squeegee pressure for a clean wipe Start at a low squeegee pressure force and adjust UP until a clean wipe is achieved; Add 10% more for variations. 50 SMTA Chennai 30th May 2014
51 DISCUSSION ANY QUESTIONS? 51 SMTA Chennai 30th May 2014
52 Speaker Contact Sakthivel Padmanapan Mobile: ASAHITEC STENCILS PRIVATE LIMITED Double Dragon Industrial Park Kannur Village, Kottaiyur, Thiruvallur Dist. Pincode SMTA Chennai 30th May 2014
53 53 SMTA Chennai 30th May 2014
54 Cutting Overlapping Mismatch due to increase of Cutting Speed 54 SMTA Chennai 30th May 2014
55 Improper Overlap at Curves QFP Pads due to increase of Cutting Speed 55 SMTA Chennai 30th May 2014
56 Oval Shaped BGA Pads 56 SMTA Chennai 30th May 2014
57 Oval Shaped BGA Pads 57 SMTA Chennai 30th May 2014
58 Oval Shaped BGA Pads 58 SMTA Chennai 30th May 2014
59 Pad Edge... Oxidation leads to heavy burr Increase of Productivity.. SMTA Increase Chennai 30th of May Process 2014 Problems!
60 Good Stencil: Resistor Pad - Just Cut; No Polish SMTA Chennai 30th May 2014 Process Friendly Better Yield.
61 Smooth QFP Pads SMTA Chennai 30th May 2014 Process Friendly Better Yield.
62 What is SMT Stencil? The SMT stencil is a simple tool typically a sheet of μm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board for applying either solder paste or flux or glue on to a substrate. Stencil printing provides a fast, mass solder paste deposition process; relatively inexpensive, appropriate and recommended for mass production. 62 SMTA Chennai 30th May 2014
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