RClamp7524T. Low Capacitance RClamp. 4-Line Protection PRELIMINARY. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

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1 PROTECTION PRODUCTS - RailClamp Description RailClamp TS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically engineered to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp will protect four lines or two differential pairs. Each line has a maximum capacitance of only.6pf between any I/O pin and ground. This allows it to be used on circuits operating in excess of 5GHz without signal attenuation. They feature high maximum ESD withstand voltage of +/- 25k contact, +/-3k air discharge per IEC The is in a 5-pin SLP138N5T package. It measures 1.3 x.8mm with a nominal height of.4mm. The innovative flow through package design simplifies pcb layout and allows matched trace lengths for consistant impedance between high speed differential lines. The combination of small size, low capacitance, and high level of ESD protection makes this device a flexible solution for applications such as HDMI, MHL, MDDI, and edp interfaces. Dimensions Features Circuit Diagram Low Capacitance RClamp 4-Line ESD protection Applications HDMI 1.3 and HDMI 1.4 -By-One USB 3. MHL edp LDS Interfaces esata Interfaces ESD protection for high-speed data lines to IEC (ESD) ±3k (air), ±25k (contact) IEC (Lightning) 5A (8/2μs) IEC (EFT) 4A (5/5ns) Package design optimized for high speed lines Flow-Through design Protects four high-speed lines Low capacitance:.6pf Maximum (I/O to Ground) Low ESD clamping voltage Low dynamic resistance:.5 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP138N5T 5-pin package (1.3 x.8 x.4mm) Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead Pitch:.45mm Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel BSC BSC Nominal Dimensions in mm (Bottom iew) Revision 7/25/213 4-Line Protection 1

2 PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/2μs) Pulse Current (tp = 8/2μs) P pk 75 Watts I PP 5 A 1 ESD per IEC (Air) SD per IEC (Contact) E 1 ESD +/- 3 +/- 25 k Operating Temperature T J -55 to +125 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off oltage RWM Any I/O to GND 5 Reverse Breakdown oltage R B I t = 1mA, Reverse Leakage Current I R R WM = 5., Clamping oltage C I PP = 1A, tp = 8/2μs Clamping oltage C I PP = 5A, tp = 8/2μs 2 ESD Clamping oltage C IPP = 4A, tlp =.2/1ns 2 ESD Clamping oltage C IPP = 16A, tlp =.2/1ns.5.1 μa Dynamic Resistance R D tp = 1n s.5 Ohms Junction Capacitance C j R =, f = 1MHz, R =, f = 1MHz, Between I/O pins.5.6 pf pf Notes 1)Measured with a 2dB attenuator, 5 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.2ns, I TLP and TLP averaging window: t 1 = 7ns to t 2 = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 16A 213 Semtech Corporation 2

3 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 8/2us Pulse Waveform Peak Pulse Power - P PP (kw) DR Pulse Duration - tp (µs) Percent of IPP e -t td = I PP/2 Waveform Parameters: tr = 8µs td = 2µs Time (µs) Clamping oltage vs. Peak Pulse Current (Between any I/O and Ground) Junction Capacitance vs. Reverse oltage (Between any I/O and Ground) Clamping oltage - C () Waveform Parameters: 7 tr = 8µs td = 2µs Capacitance - C j (pf) f = 1 MHz Peak Pulse Current - I PP (A) Reverse oltage - R () TLP Characteristic (Positive) TLP Characteristic (Negative) Current (A) Transmission Line Pulse Test (TLP) 5 Settings: t p =1ns, t r =.2ns, I TLP and TLP averaging window: t =7ns to t =9ns oltage () Current (A) Transmission Line Pulse Test (TLP) -25 Settings: t p =1ns, t r =.2ns, I TLP and TLP averaging window: -3 t =7ns to t =9ns oltage () 213 Semtech Corporation 3

4 PROTECTION PRODUCTS Typical Characteristics (Con t) ESD Clamping (+8k Contact per IEC ) (Between any I/O and Ground) ESD Clamping (-8k Contact per IEC ) (Between any I/O and Ground) Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane -1-2 oltage () 4 3 oltage () Measured with 5 Ohm scope input impedance, 2GHz bandwidth. Corrected for 5 Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane Time (ns) Time (ns) Typical Insertion Loss S21 Analog Crosstalk Insertion Loss (db) Insertion Loss (db) E+6 1.E+7 1.E+8 1.E+9 1.E+1 Frequency (Hz) E+7 1.E+8 1.E+9 1.E+1 Frequency (Hz) 213 Semtech Corporation 4

5 PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Stencil Opening (21x44 mm) Land Pad (18x4 mm) Assembly Solder Aperture Parameter Stencil Design shape Recommendation Laser cut, Electro-polishe d Rectangular All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Mounting Pattern S older Stencil Thickness.1 mm (.4") Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-2 PCB PCB Solder Pad Design Pad Finish Non-Solder mask defined OSP OR NiAu 213 Semtech Corporation 5

6 PROTECTION PRODUCTS Applications Information HDMI 1.4 Type A Connector RClamp7528T HDMI 1.4 Layout and Eye Diagram with Bus TMDS TMDS+ CBUS GND MHL Layout and Eye Diagram with 213 Semtech Corporation 6

7 PROTECTION PRODUCTS Outline Drawing -- SO-8 SLP138N5T PIN 1 INDICATOR (LASER MARK) aaa C A2 A D A1 B E A C SEATING PLANE DIMENSIONS MILLIMETERS DIM MIN NOM MAX A A1 A2..2 (.13).5 b D E e.45 BSC e1.5 BSC L N 5 aaa.8 bbb.1 D/2 e 1 2 E/2 LxN N e1/2 bxn bbb C A B e1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP138N5T (C) P1/2 G P P1 X Y Z DIMENSIONS DIM MILLIMETERS C (.65) G.25 P.45 P1.5 X.18 Y.4 Z 1.5 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 213 Semtech Corporation 7

8 PROTECTION PRODUCTS Marking Code Ordering Information PIN 1 INDICATOR (LASER MARK) = Date Code Part Number Qty per Reel Reel Size.TNT 1, 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Carrier Tape Specification Pin 1 Location (Towards Sprocket Holes) User Direction of feed Device Orientation in Tape 213 Semtech Corporation 8

9 PROTECTION PRODUCTS Contact Information for Semtech International AG Taiwan Branch Tel: Fax: Korea Branch Tel: Fax: Shanghai Office Tel: Fax: Japan Office (Osaka) Tel: Fax: Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Japan (Tokyo) Office Tel: Fax: Semtech Limited (U.K.) Tel: Fax: Semtech France SARL Tel: 33-() Fax: 33-() Semtech Germany GmbH Tel: 49-() Fax: 49-() Semtech Corporation 9