Power Management and Multimarket

Transcription

1 LED Driver ICs for High Power LEDs ILD65 Data Sheet Revision 3.2, Power Management and Multimarket

2 Edition Published by Infineon Technologies AG 8726 Munich, Germany 24 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

3 Revision History Page or Item Subjects (major changes since previous revision) Revision 3.2, Table 2 Footnote updated respective ESD protection on pin VS Revision 3., Table Pin function changed to bias control input voltage Table 2 Upper spec limit of bias control voltage changed to V S Table 4 Operating conditions for bias control voltage V B added Figure 6 Pin to V S connection updated Revision 3., 23-- All Initial release of final data sheet Trademarks of Infineon Technologies AG AURIX, C66, CanPAK, CIPOS, CIPURSE, EconoPACK, CoolMOS, CoolSET, CORECONTROL, CROSSAVE, DAVE, DI-POL, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPIM, EconoPACK, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, I²RF, ISOFACE, IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OptiMOS, ORIGA, POWERCODE ; PRIMARION, PrimePACK, PrimeSTACK, PRO-SIL, PROFET, RASIC, ReverSave, SatRIC, SIEGET, SINDRION, SIPMOS, SmartLEWIS, SOLID FLASH, TEMPFET, thinq!, TRENCHSTOP, TriCore. Other Trademarks Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, KEIL, PRIMECELL, REALVIEW, THUMB, µvision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS, FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. murata of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2-- Data Sheet 3 Revision 3.2,

4 Table of Contents Table of Contents Table of Contents List of Figures List of Tables Features Product Brief Maximum Ratings Thermal Characteristics Electrical Characteristics DC Characteristics Switching Characteristics Digital Control Signals Switching Parameters Application Circuit Setting the average LED current Inductor Selection Guideline Package Information Data Sheet 4 Revision 3.2,

5 List of Figures List of Figures Figure Block Diagram Figure 2 Total Power Dissipation Figure 3 Typical Output Current Duty Cycle of Over-Temperature Protection vs. T J and R Tadj Figure 4 PWM Input Figure 5 Typical Integrated PWM Duty Cycle vs. PWM Control Voltage Figure 6 Application Circuit Figure 7 Minimum Inductance for.35 A Average LED Current Figure 8 Minimum Inductance for.7 A Average LED Current Figure 9 Minimum Inductance for.5 A Average LED Current Figure Package outline PG-DSO-8-27 (dimensions in mm) Figure Recommended PCB Footprint for Reflow Soldering (dimensions in mm) Figure 2 Tape Loading (dimensions in mm) Data Sheet 5 Revision 3.2,

6 List of Tables List of Tables Table Pin Definition and Function Table 2 Maximum Ratings Table 3 Maximum Thermal Resistance Table 4 DC Characteristics Table 5 Switching Characteristics Table 6 Digital Control Parameter at Pin PWM Table 7 Analog Control Parameter at Pin PWM Data Sheet 6 Revision 3.2,

7 Features Wide input voltage range from 4.5 V to 6 V Capable to provide up to.5 A average output current Up to MHz switching frequency Soft-start capability Analog and PWM dimming possible Integrated PWM generator for analog dimming input Typical 3% output current accuracy Very low LED current drift over temperature Adjustable over-temperature protection Undervoltage lockout Over-current protection Thermally optimized package: PG-DSO-8-27 Applications LED driver for general lighting Retail, office and residential downlights Street and tunnel lighting LED ballasts Product Name Package Marking ILD65 PG-DSO-8-27 ILD65 Data Sheet 7 Revision 3.2,

8 Product Brief 2 Product Brief The ILD65 is a hysteretic buck LED driver IC for driving high power LEDs in general lighting applications with average currents up to.5 A. The ILD65 is suitable for LED applications with a wide range of supply voltages from 4.5 V to 6 V. A multifunctional PWM input signal allows dimming of the LEDs with an analog DC voltage or an external PWM signal. To minimize colorshifts of the LEDs an analog PWM voltage is converted to an internal.6 khz PWM signal modulating the LED current. The ILD65 incorporates an undervoltage lock-out that will shut down the IC when the minimum supply voltage threshold is exceeded. The over-current protection turns off the output stage once the output current is above the current threshold. An integrated over-temperature protection circuit will start to reduce the LED current by internal PWM modulation once the adjustable junction temperature threshold of the IC is exceeded. Realizing a thermal coupling between LED driver IC and LEDs this feature eliminates the need of external temperature sensors as NTCs or PTCs. Thanks to the hysteretic concept the current control is extremely fast and always stable. A maximum contrast ratio of 3: can be achieved depending of the dimensioning of the external components. The efficiency of the LED driver IC is remarkable high, reaching up to 98% of efficiency over a wide range. The output current accuracy from device to device and under all load conditions and over temperature is limited to a minimum, making ILD65 the perfect fit for LED ballasts. ILD65 Buck LED Driver VB 8 Tadj UVLO VSTAB Vstab PWM 2 VREF I / V 7 VS GND 3 DC to PWM Hysteretic Comparator 6 Vsense OTP OCP GND 4 5 Vswitch EP Figure Block Diagram Data Sheet 8 Revision 3.2,

9 Product Brief Pin Definition Table Pin Definition and Function Pin No. Name Pin Buffer Function Type Type VB Input Bias control input voltage, recommended to connect to pin VS 2 PWM Input Dimming signal: Analog dimming PWM dimming 3 GND GND IC ground 4 GND GND IC ground 5 Vswitch Output Power switch output 6 Vsense Input LED current sense input 7 VS Input Supply voltage 8 Tadj Output Over-temperature adjustment EP Exposed Pad GND IC ground and heat spreader Data Sheet 9 Revision 3.2,

10 Maximum Ratings 3 Maximum Ratings Table 2 Maximum Ratings Parameter Symbol Values Unit Note / Min. Typ. Max. Test Condition Supply voltage V S V Bias control voltage V B -.3 V S V PWM voltage V PWM V Tadj voltage V Tadj V Sense voltage V sense V S -.3 V S V Switch voltage V switch V Average switch output current I out.5 A Total power dissipation, T S 6 C P tot 2 W Junction temperature T J -4 5 C Storage temperature range T STG C ESD capability at all pins ) V ESD HBM 2 kv HBM acc. to JESD22 - A4 ) Two different classes of ESD protection elements are implemented within ILD65:. ESD protection at pin VS will be triggered if the voltage at pin VS rises by more than 5 V with a slew rate of more than 5 V/µs. This condition is met during an ESD event, but might also occur if the LED driver gets hotplugged into a power supply and the VS blocking capacitor has a too small capacitance. ESD protection will remain triggered as long as the slewrate condition is met. If the ESD protection gets triggered while VS is supplied the IC might be damaged. 2. ESD protection at all other pins is triggered once the connected voltage signal exceeds a threshold higher than the maximum voltage rating specified for each pin. No preventions regarding slew rate control need to be taken for these pins. Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet Revision 3.2,

11 Thermal Characteristics 4 Thermal Characteristics Table 3 Maximum Thermal Resistance Parameter Symbol Values Unit Note / Min. Typ. Max. Test Condition Junction - soldering point ) R thjs 7 K/W ) For calculation of R thja please refer to application note AN77 (Thermal Resistance Calculation) P tot [W] T S [ C] Figure 2 Total Power Dissipation The major part of the IC power dissipation is caused by the switch resistance in conductive state. Therefore Equation () is a first estimation to calculate the total power dissipation of the IC P tot = R ON I 2 out D + I S V S () D: Duty cycle of the output switch For a more precise analysis measure the soldering point temperature T S of ILD65 at GND pin and use Figure 2 as a reference. Data Sheet Revision 3.2,

12 Electrical Characteristics 5 Electrical Characteristics 5. DC Characteristics All parameters at T A = 25 C, unless otherwise specified. Table 4 DC Characteristics Parameter Symbol Values Unit Note / Min. Typ. Max. Test Condition Operating supply voltage V S V Operating bias control voltage V B 4.5 V S V recommended to connect to V S Under Voltage Lock Out V S, UV, off V IC deactivated ) V S, UV, on V IC operative Supply current consumption open load V S = V sense, I LED =ma I S, OL, 4.5V ma V S = 4.5 V I S, OL, 2V ma V S = 2 V I S, OL, 6V ma V S = 6 V Supply voltage reset time t S, reset µs Reset time after V S power up 2) Current of V sense input I sense µa At any LED current Current of V B input I B, 6V µa V B =6V Output over current protection threshold I out, OCP A Output over current protection delay time t delay, OCP ns turn off delay Output over current protection time out t timeout, OCP 3 57 µs turn off duration 3) Over-temperature protection threshold range (typical), % reduction Over-temperature protection threshold open, % reduction Over-temperature protection threshold short, % reduction T OTP, range C R Tadj = 35 kω... Ω 4) T OTP, open 5 C R Tadj 5 kω T OTP, short 45 C R Tadj = Ω Over-temperature protection, turn off T OTP, off 6 C Tadj pin current source to GND I Tadj, short µa R Tadj = Ω 5) ) IC gets deactivated once the supply voltage drops below V S, UV, off and gets operative once supply voltage rises above V S, UV, on. 2) Reset timer starts after supply voltage exceeds the lower limit of the supply voltage. Output stage gets enabled once reset timer expires. 3) Once the over current protection threshold has been exceeded the output switch gets disabled. It is enabled again once the time out expired. 4) T OTP, range specifies the typical temperature tuning range achievable at a % reduction of LED current using resistors with % accuracy. Temperatures specified refer to junction temperature on chip. Accuracy of the temperature sensor is typical ±5 K. Any resistor value R Tadj Ω can be selected but it might not influence OTP temperature if out of the ranges specified. 5) Definition of current reference: Currents flowing out of the IC have a negative magnitude. ILD65 has an integrated over-temperature protection based upon the junction temperature on chip. The threshold of the over-temperature protection circuit is tunable by resistor R Tadj connected from pin Tadj to GND. Data Sheet 2 Revision 3.2,

13 Electrical Characteristics R Tadj resistor values within to 35 kω define the over-temperature protection behavior as shown in Figure 3. R Tadj values 5 kω set the OTP threshold to T OTP, open. The over-temperature protection is based upon modulation of the LED current with an internal PWM generator. Once the junction temperature exceeds the OTP threshold the PWM duty cycle as well as the average LED current will get reduced. Once junction temperature reaches T OTP, off the PWM duty cycle and LED current will be reduced to zero. 8 I out Duty Cycle [%] kω kω 2 kω 35 kω Open T J [ C] Figure 3 Typical Output Current Duty Cycle of Over-Temperature Protection vs. T J and R Tadj Data Sheet 3 Revision 3.2,

14 Electrical Characteristics 5.2 Switching Characteristics All parameters at T A = 25 C, unless otherwise specified. Table 5 Switching Characteristics Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Switching frequency f switch MHz Mean current sense threshold V sense 52 mv f switch =khz voltage Sense threshold hysteresis V sensehys ±22 % peak to average V S =2V f switch =khz Output current variation over supply voltage I out, Vs ±3 % Output current variation over temperature I out, Ts ±4 % for temperatures below OTP threshold Output current variation over load I out, load ±3 % fixed V S Switch on resistance R ON, 25 C Ω I SW =A, T J =25 C R ON, 25 C Ω I SW =A, T J =25 C Data Sheet 4 Revision 3.2,

15 Electrical Characteristics 5.3 Digital Control Signals All parameters at T A = 25 C, unless otherwise specified. Dimming of the LED current can be achieved by an analog or digital input voltage connected to pin PWM. A digital input signal will modulate the LED current according to Table 6. Table 6 Digital Control Parameter at Pin PWM ) Parameter Symbol Values Unit Note / Min. Typ. Max. Test Condition PWM voltage logic high level V PWM, high V output stage enabled PWM voltage logic low level V PWM, low V output stage disabled PWM output current I CC,PWM µa V PWM =V PWM delay time t d, PWM, on.8 µs V PWM = rising to 2.5 V V switch = falling to V t d, PWM, off.6 µs V PWM = falling to.5 V V switch = rising to V PWM signal frequency f PWM, ext 25 khz ) PWM pin has an internal pull-up circuit to high level if not connected externally on PCB 4.7 V PWM I CC,PWM Figure 4 PWM Input An analog PWM input voltage activates modulation of the LED current by the integrated PWM generator running at frequency f PWM, int. Its duty cycle corresponds to analog PWM control voltage as shown in Table 7 and Figure 5. Data Sheet 5 Revision 3.2,

16 Electrical Characteristics Table 7 Analog Control Parameter at Pin PWM Parameter Symbol Values Unit Note / Min. Typ. Max. Test Condition PWM input voltage for % duty V PWM, %.6 V cycle PWM input voltage for 5% duty V PWM, 5%.52 V cycle PWM input voltage for % duty V PWM, % 2.43 V cycle Sensitivity of PWM duty cycle vs. D.C./V PWM 55 %/V PWM input voltage Integrated PWM generator frequency f PWM, int khz PWM Duty Cycle [%] V PWM [V] Figure 5 Typical Integrated PWM Duty Cycle vs. PWM Control Voltage 5.4 Switching Parameters For all shown switching parameters ILD65 has been measured on evaluation board ILD65 at T A = 25 C. Used LEDs have a typical V fled of 3 V. Efficiency figure shows total efficiency of the application board including losses of external components as inductor or Schottky diode. See the application note for further details. Data Sheet 6 Revision 3.2,

17 Electrical Characteristics Performance vs. supply voltage and number of LEDs: R sense = mω, L =47µH, V fled =3V.54 I LED versus V S and number of LEDs 3 Relative change of I LED versus V S and number of LEDs.53 2 I LED [A] I LEDrelative [%] Efficiency versus V S and number of LEDs 8 f Switch versus V S and number of LEDs.9 6 Efficiency [-].8 f Switch [khz] Duty Cycle [-] Duty Cycle versus V S and number of LEDs Data Sheet 7 Revision 3.2,

18 Electrical Characteristics Performance vs. supply voltage and number of LEDs: R sense = 23 mω, L =68µH, V fled =3V.73 I LED versus V S and number of LEDs 5 4 Relative change of I LED versus V S and number of LEDs I LED [A] I LEDrelative [%] Efficiency versus V S and number of LEDs 8 f Switch versus V S and number of LEDs.9 6 Efficiency [-].8 f Switch [khz] Duty Cycle [-] Duty Cycle versus V S and number of LEDs Data Sheet 8 Revision 3.2,

19 Electrical Characteristics Performance vs. supply voltage and number of LEDs: R sense =422mΩ, L = 5 µh, V fled =3V.37 I LED versus V S and number of LEDs 5 4 Relative change of I LED versus V S and number of LEDs I LED [A] I LEDrelative [%] Efficiency versus V S and number of LEDs 8 f Switch versus V S and number of LEDs.9 6 Efficiency [-].8 f Switch [khz] Duty Cycle [-] Duty Cycle versus V S and number of LEDs Data Sheet 9 Revision 3.2,

20 Electrical Characteristics LED current vs. soldering point temperature: R sense =23mΩ, L =47µH, V fled =3V, R Tadj =Ω. Note: Soldering point temperature was measured on application PCB close to chip exposed pad. See application note AN-EVAL-ILD65 for board details. Over-temperature protection has been adjusted to max. threshold connecting Tadj pin to GND with R Tadj =Ω. I LED versus T S and number of LEDs, supply voltage 4 I LED versus T S and number of LEDs, supply voltage.72 3 I LED [A] , 5 V, 2 V, 24 V, 48 V T S [ C] I LEDrel [%] , 5 V -3, 2 V, 24 V, 48 V T S [ C] LED current vs. soldering point temperature: R sense =mω, L =68µH, V fled =3V, R Tadj =Ω..56 I LED versus T S and number of LEDs, supply voltage 4 I LED versus T S and number of LEDs, supply voltage I LED [A] I LEDrel [%] -.46, 5 V, 2 V, 24 V, 48 V T S [ C] -2, 5 V -3, 2 V, 24 V, 48 V T S [ C] Data Sheet 2 Revision 3.2,

21 Application Circuit 6 Application Circuit Vs R Tadj 8 UVLO VSTAB Vstab PWM 2 VREF I / V 7 C PWM ) R sense L 3 DC to PWM Hysteretic Comparator 6 OTP OCP 4 5 ) C PWM is optional for soft start EP Exposed pad to be connected to GND Figure 6 Application Circuit A V S blocking capacitor shall be placed close to pin 7 to enable a low ripple V sense measurement and to avoid a false triggering of the V S ESD protection element inside the IC. To enable the bias control of the IC it is most simple to connect pin of the IC to supply voltage V S. 6. Setting the average LED current The average output current for the LEDs is set by the external sense resistor R sense. To calculate the value of this resistor a first approximation can be calculated using Equation (2). V sense is slightly dependent on the supply voltage V S and the number of LEDs as shown in Chapter 5.4. V R sense = I sense LED (2) Example calculation V S = 2 V, 47 µh, V fled = 3 V, in series V sense = 52 mv I LED =.5 A R sense = mω Data Sheet 2 Revision 3.2,

22 Application Circuit An easy way to achieve these resistor values is to connect standard resistors in parallel. 6.2 Inductor Selection Guideline The inductance of the inductor L, the supply voltage V S, the number of LEDs driven and their average LED current significantly influence the slew rate of the LED current in on and off condition of the LED driver IC output switch. Due to the hysteretic current control ILD65 will toggle the output driver stage each time upper or lower current threshold are reached. To maintain best regulation capability of the LED driver IC it is reasonable to keep a margin to the minimum switch on and off time defined by internal propagation delay times. Disregard of this recommendation by choosing too small inductor values might result in an increased LED current ripple and loss of LED current regulation accuracy. Minimum 35 ns on and off time are recommended as a reasonable design target for the inductor selection. Below figures provide a guideline concerning minimum inductance value versus supply voltage and number of LEDs. It is assumed that the forward voltage of each LED is within a range of 2.5 V to 3.9 V over temperature and LED production tolerances. Minimum forward voltage (e.g. occuring at high LED temperatures) needs to be considered with respect to the minimum switch on-time while maximum forward voltage (e.g. occuring at low temperatures) needs to be considered with respect to the switch off-time. The saturation current of the chosen inductor has to be higher than the peak LED current and the rating of its continous current needs to exceed the average LED current..35 A Number of LEDs Inductance in µh; 2.5 V V fled 3.9 V Figure 7 Figure 8 Minimum Inductance for.35 A Average LED Current.7 A Number of LEDs Inductance in µh; 2.5 V V fled 3.9 V Minimum Inductance for.7 A Average LED Current Data Sheet 22 Revision 3.2,

23 Application Circuit.5 A Number of LEDs Inductance in µh; 2.5 V V fled 3.9 V Figure 9 Minimum Inductance for.5 A Average LED Current Data Sheet 23 Revision 3.2,

24 Package Information 7 Package Information.35 x Stand Off (.45).7 MAX..4±.9 2).2 M C A-B D C.8 C Seating Plane 8x 3.9 ±. ). CD2x ±.25 8 MAX. 6 ±.2.2 M D 8x D Index Marking A B. C A-B 2x 4.9 ±. ) Bottom View 3 ± ±.2 Figure ) Does not include plastic or metal protrusion of.5 max. per side 2) Dambar protrusion shall be maximum. mm total in excess of lead width 3) JEDEC reference MS-2 variation BA Package outline PG-DSO-8-27 (dimensions in mm) PG-DSO-8-27-PO V Figure PG-DSO-8-27-FP V Recommended PCB Footprint for Reflow Soldering (dimensions in mm) Pin marking ± PG-DSO-8-27-TP V5 Figure 2 Tape Loading (dimensions in mm) Data Sheet 24 Revision 3.2,

25 Published by Infineon Technologies AG