Profile the easy way..
|
|
- Juliana Stafford
- 7 years ago
- Views:
Transcription
1 Profile the easy way..
2 WHO s USING SolderStar? SolderStar instruments are in use all around the world helping Engineering setup and maintain their solder process quality. We have over 1000 instruments supported through a Global chain of specialist partners in over 30 countries. Below is a sample list of some of our clients: Alps (Czech Republic) Bosch Automotive (Brazil) Celestica (Thailand) Dolby Laboratories (UK) Emerson (Philippines) FoxConn (China) Goodrich (Aerospace UK/US) Harman Becker (Germany) IComm (India) JJS Electronics (UK) Koki (Denmark) Lacroix Electronique (France) Moog (Ireland) Notifier Fire Controls (UK) Optelecom (Holland) Philips (UK/CHINA/PHILIPINES) Rakon (New Zealand) Samsung (South Korea) Tridonic ATCO (Austria) U-EMS (China) VC Electronics (UK) Wolfson Microelectronics (UK) Yazaki (Romania) Z-COM (China)
3 SOLDERSTAR PRODUCT RANGE L1 SolderStar LITE 4 Channel Profiling System Highlights 4 channel Lead free proven Thermocouple base Wave solder analysis support Typical Customers/Applications Simple/Small SMT Assemblies Small wave solder machines Smaller manufacturers Labs/R&D Applications L2 SolderStar PRO 6,9,12 or 16 Channel Profiling Systems Highlights Industry standard 6 channel configuration 9,12 or 16 channel available through the SmartLink adapter system if required Features the Solderstar SmartLink system Wave Solder Setup pallet accessory Reflow oven repeatability fixture accessory RF Telemetry for real-time profiles Typical Customers/Applications Medium/Large manufacturers Reflow/Wave setup followed by SPC control regimes Wave solder machine calibration Complex SMT assemblies
4 SOLDERSTAR PRODUCT SELECTION : REFLOW SOLDERING REFLOW CONSIDERATIONS PCB Assembly Size / Complexity PRO 16 CHANNEL PRO 12CH PRO 9CH PRO 6CH LITE 4CH Measurement Channels Requirement What factors influence the number of channels required to profile effectively? The main influencing factor is the size and complexity of the assembly to be profiled. A simple assembly with a small mix of high and low mass components can be profiled effectively with 4 measurement points. Large or complex assembly using BGA, or thick substrate PCB s need to be more comprehensively profiled to achieve optimum process results. More thermocouple positions are required for the Engineer to fully map the profiles seen at component levels. It is not un-common for complex assemblies to be instrumented with measurement points.
5 SOLDERSTAR PRODUCT SELECTION : WAVE SOLDERING METHOD 1: CUSTOMER CONSTRUCTED TEST PCB Using standard thermocouples and the SolderStar software for Wave solder support, a customer Can capture basic information from the wave process Advantages/Disadvantages Cheap and simple to make Actual PCB/Component temperature Not robust Repeatability not good Thermocouple based measurement LITE PRO
6 SOLDERSTAR PRODUCT SELECTION : WAVE SOLDERING METHOD 2: WAVESHUTTLE PRO The WaveShuttle PRO is a specially designed fixture for wave solder analysis. It has dedicated measurement Electronics on-board to capture detailed Calibration and repeatability information From wave soldering machine. The WaveShuttle PRO does not use thermocouples to make wave contact/height measurements. Titanium contacts are fitted to the pallet underside to scan the wave shape, contact times and wave height. Thermocouples are fitted to PCB s to measure temperature related parameters. WAVE HEIGHT DWELL/CONTACT TIME PARALELLISM SPEED WAVE SHAPE/LEVEL CHIP/MAIN WAVE DETECT TOPSIDE TEMPERATURE SOLDER TEMPERATURE PEAK TEMPERATURE HEATING SLOPES OPTIONAL DUAL CONVEYOR SPEED SUPPORT Machine edge rail finger Contact pin Solder wave WaveShuttle edge rail PRO
7 SOLDERSTAR LITE Low cost Lead-free Profiling 4 Type K Measurement Channels 65,500 Point Memory +/- 1 C Accuracy High Pb-Free Protection PC Analysis Software Rechargeable via USB Application Areas Reflow Profiling Wave Soldering Glue Cure Vapour Phase
8 SOLDERSTAR PRO- RF The complete solution for Reflow and Wave solder profiling 6 16 channel reflow profiling DeltaProbe - Reflow Oven Analyser 2.4Ghz Wireless Telemetry CORE SYSTEM ACCESSORY - REFLOW ACCESSORY - WAVE WaveShuttle - Wave Solder Analyser SPECIAL APPLICATIONS SmartLink - Special Applications
9 SOLDERSTAR PRO-RF High performance reflow profiling 6-16 Type K Channels 120,000 Point Memory +/- 1 C Accuracy Profile Simulation Software PC Analysis Software SPC Manager Software RF Telemetry Rechargeable via USB Application Areas Reflow Profiling Wave Soldering SPC Data gathering
10 WaveShuttle PRO All Key Parameters in 1 single PASS 5 temperature channels Wave Height Measurement Dwell time accuracy to 10ms Auto Chip & Main wave analysis Detailed PCB/Wave contact map High repeatability platform True contact time measurement Parameters Measured Wave Height. Dwell Time Conveyor Speed Parallelism Solder Temperature Preheat Temperatures
11 DeltaPRObe Eliminates the need for fragile test boards A golden profile for each process is established in 3 easy steps 1. The optimum oven settings are first established by product profile capture and simulation 2. The DeltaProbe is then passed through the reflow oven to capture a golden process profile 3. Tolerance limits can now be set around temperature traces and process parameters Error Conditions Detected Incorrect oven profile loading Conveyor Speed Errors Parallelism Set point & convection level changes
12 Profile Central PC Software Simplicity Itself Profile Viewer Product Manager Process Checker Profile Analysis + Simulation Solder/Machine Library Test board documentation AUTOSeeker Instant Pass/Fail Analysis Professional Reports Solder paste/machine specifications Profile Optimisation Tools Full Profile documentation
13 SOLDERSTAR About SolderStar SolderStar is a specialist in the design, development and manufacture of specialist thermal profiling equipment for the lead-free electronics industry. Incorporating state-of-the-art technology and full lead-free compliance, SolderStar s range of instruments and software tools offers leading-edge performance, functionality, heat-resistance and miniaturization. SolderStar satisfies all of today s thermal process control needs, from full-feature high performance product profiling for reflow and wave solder processes, to fully integrated SPC capabilities for continuous quality and process control. Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world. For more information about SolderStar, visit the company s website at
Lead-Free Rework Optimization Project
Lead-Free Rework Optimization Project Project Co-Chairs: Jasbir Bath, Flextronics International Craig Hamilton, Celestica IPC APEX 2008 Background Reliability tests in the previous inemi lead-free assembly
More informationThermal profiling optimizes printed circuit board assembly
Thermal profiling optimizes printed circuit board assembly Etienne Witte, Axiom Electronics, Beaverton, Oregon, USA, and Paul Austen, ECD, Milwaukie, Oregon, USA Thermal profiling is a critical function
More informationNEBS 2009 Optimization of Telecom Networks Through Energy Efficiency Eitan Amon Type Approval Team Leader Comverse Ltd.
NEBS 2009 Optimization of Telecom Networks Through Energy Efficiency Eitan Amon Type Approval Team Leader Comverse Ltd. Comverse Top Worldwide Customers* * Partial list only 2 Comverse Worldwide Operations
More information3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection ABOUT AKROMETRIX Company Overview Akrometrix mission is to lead the industry in non-contact surface measurement tools.
More informationUser Guide Reflow Toaster Oven Controller
User Guide Reflow Toaster Oven Controller Version 1.5-01/10/12 DROTEK Web shop: www.drotek.fr SOMMAIRE 1. Introduction... 3 2. Preparation of THE REFLOW CONTROLLER... 4 2.1. Power supply... 4 2.2. USB
More informationCONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC
CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC William Beair, Alton Moore, and Eric Gilley Raytheon Company McKinney, TX, USA ABSTRACT With increasing deployment of both micro BGA s, 0201discreet
More informationGood Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
More informationRework stations: Meeting the challenges of lead-free solders
Rework stations: Meeting the challenges of lead-free solders Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders
More information30 GHz 5-Bit Phase Shifter TGP2100
August, 28 3 GHz -Bit Phase Shifter TGP2 Key Features and Performance Positive Control Voltage Single-Ended Logic CMOS Compatible Frequency Range: 28-32 GHz.2µm phemt 3MI Technology Chip dimensions:.88
More informationPCB inspection is more important today than ever before!
PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit.
More informationThe Three Heat Transfer Modes in Reflow Soldering
Section 5: Reflow Oven Heat Transfer The Three Heat Transfer Modes in Reflow Soldering There are three different heating modes involved with most SMT reflow processes: conduction, convection, and infrared
More informationW- Series. Features: WOB. Mechanical Data Case : Moulded plastic. Lead : Solder plated. Weight : 1.10 grams. Page <1> 15/07/08 V1.
Features: Surge overload ratings to 40 amperes peak. Ideal for printed circuit board. Reliable low cost construction. High temperature soldering guaranteed: 260 C/10 seconds/0.375inch (9.5mm) lead lengths
More informationpb tec solutions GmbH, Max-Planck-Str. 11, 63755 Alzenau (Germany) Tel.: +49 6023 94771 0 Fax: +49 6023 94771 29 www.pbtecsolutions.
pb tec solutions GmbH, Max-Planck-Str. 11, 63755 Alzenau (Germany) Tel.: +49 6023 94771 0 Fax: +49 6023 94771 29 www.pbtecsolutions.de info@pbtecsolutions.de Model Description AOI systems MV-3 MV-6E/EM
More informationFractus Compact Reach Xtend
Fractus Compact Reach Xtend Bluetooth, Zigbee, 82.11 b/g/n WLAN Chip Antenna Antenna Part Number: FR5-S1-N--12 This product is protected by at least the following patents PAT. US 7,148,85, US 7,22,822
More informationSelective Soldering Defects and How to Prevent Them
Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering
More informationAmphenol Sincere. Electronic Integration & Flexible Printed Circuits. Aerospace. Health Care. Heavy Equipment HEV. Industrial
Amphenol Sincere Health Care Aerospace Heavy Equipment HEV Industrial Electronic Integration & Flexible Printed Circuits About Amphenol The second largest manufacturers of interconnect products 87 worldwide
More informationBob Willis leadfreesoldering.com
Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed
More informationTraceability Data Integrity: Challenges and Solutions By Mitch DeCaire, Cogiscan, Inc.
Traceability Data Integrity: Challenges and Solutions By Mitch DeCaire, Cogiscan, Inc. The electronics manufacturing industry is experiencing increased demands for material traceability. Competitive pressures
More informationReport. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D 86971 Peiting. Your Order-No.
Zentrum für Verbindungstechnik in der Elektronik Argelsrieder Feld 6 82234 Oberpfaffenhofen-Weßling Telefon: 081 53 / 403-0 Telefax: 081 53 / 403-15 Report Order: Soldering Tests at COM Express Connectors,
More informationRoHS-Compliant Through-Hole VI Chip Soldering Recommendations
APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead
More informationSoldering of SMD Film Capacitors in Practical Lead Free Processes
Soldering of SMD Film Capacitors in Practical Lead Free Processes Matti Niskala Product Manager, SMD products Evox Rifa Group Oyj, a Kemet Company Lars Sonckin kaari 16, 02600 Espoo, Finland Tel: + 358
More informationAgilent 4339B/4349B High Resistance Meters
Agilent 4339B/4349B High Resistance Meters Technical Overview Within Budget Without Compromise Introducing the Agilent Technologies 4339B and 4349B High Resistance Meters Used for Making Ultra- High Resistance
More informationUltraprint 2000 HiE. Ultraprint 2000 HiE Features MODULAR DESIGN ENSURES SUPERIOR ADAPTABILITY
Ultraprint 2000 HiE Since its introduction, the Ultraprint 2000 HiE has become the industry choice for high performance, reliable automated stencil printing. A key factor in its immediate worldwide acceptance
More informationHOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology
HOT BAR REFLOW SOLDERING FUNDAMENTALS A high quality Selective Soldering Technology Content 1. Hot Bar Reflow Soldering Introduction 2. Application Range 3. Process Descriptions > Flex to PCB > Wire to
More informationSurface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY
Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Abstract: The automotive technology is fast moving in integrating
More informationPolyimide labels for Printed Circuit Boards
Polyimide labels for Printed Circuit Boards The right match for any PCB labelling application Labels on Printed Circuit Boards Matching product performance with application needs Printed Circuit Boards
More informationMultilevel Socket Technologies
Multilevel Socket Technologies High Performance IC Sockets And Test Adapters Overview Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs & Turn-Key Solutions
More informationAN3353 Application note
Application note IEC 61000-4-2 standard testing Introduction This Application note is addressed to technical engineers and designers to explain how STMicroelectronics protection devices are tested according
More informationSCHATZ - TEST Tool testing systems. SCHATZ -certest-w. Dynamic testing of torque tools
SCHATZ - TEST Tool testing systems SCHATZ -certest Dynamic testing of torque tools SCHATZ -calitest Calibrator for indicating and click-type torque tools SCHATZ -combitest Mobile test center for all torque
More informationCASE STUDY. Automotive Components. Bosch Drancy, France Brake NVH Testing. Braking Systems. France. Automotive. PULSE, Transducers
CASE STUDY Bosch Drancy, France Brake NVH Testing France Automotive PULSE, Transducers The world-renowned Bosch group is a major producer of a vast range of automotive components. The company is an OEM
More informationProduct Name Hexa-Band Cellular SMD Antenna GSM / CDMA / DCS / PCS / WCDMA /UMTS /HSDPA / GPRS / EDGE 800 MHz to 2200 MHz
Anam PA.25a Specification Part No. PA.25a Product Name Anam Hexa-Band Cellular SMD Antenna GSM / CDMA / DCS / PCS / WCDMA /UMTS /HSDPA / GPRS / EDGE 800 MHz to 2200 MHz Feature High Efficiency Multi-Band
More informationVECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION
VECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION Mark J. Norris Vision Inspection Technology, LLC Haverhill, MA mnorris@vitechnology.com ABSTRACT Traditional methods of identifying and
More informationGet the benefits of Norgren s unique range of Online services
Get the benefits of Norgren s unique range of Online services Make your job easier and save time - everything you need to select, design and purchase Norgren pneumatics is in one convenient location, available
More informationAssembly of LPCC Packages AN-0001
Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)
More informationAccuracy counts! SENSORS WITH ANALOG OUTPUT
Accuracy counts! SENSORS WITH ANALOG OUTPUT OTHER APPLICATIONS: KEY ADVANTAGES: Distance measurement Positioning Profile detection Deformation monitoring Vibration monitoring Process monitoring Detection
More informationMake the invisible visible! SENSORS WITH EXCELLENT BACKGROUND SUPPRESSION
Make the invisible visible! SENSORS WITH EXCELLENT BACKGROUND SUPPRESSION photoelectric sensors Thanks to its vision for innovation and technological enhancement, Contrinex keeps on setting new standards
More informationAntenna Part Number: FR05-S1-R-0-105
Fractus EZConnect Zigbee, RFID, ISM868/9 Chip Antenna Antenna Part Number: FR5-S1-R--15 This product is protected by at least the following patents PAT. US 7,148,85, US 7,22,822 and other domestic and
More informationfleischhauer tickets RFID
fleischhauer tickets RFID RFID solutions tailor-made Tickets for Public Transport Tickets in Motion RFID ticketing revolutionises access systems for mass transit facilities worldwide. Public transport
More informationElectronic Board Assembly
Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -
More informationLogistics. EMS manufacturing solutions can be supplied in any format to suit a customer s requirements, including;
Vision EMS (Electronic Manufacturing Solutions Ltd,) offers a complete range of manufacturing solutions for the CEM electronics marketplace. EMS is focused on the provision of fast, cost effective solutions
More informationDiode, Schottky SMB/DO-214AA. Page <1> 24/04/08 V1.1. Dimensions Inches (Millimeters)
Features: For surface mounted application. Metal to silicon rectifier, majority carrier conduction. Low forward voltage drop. Easy pick and place. High surge current capability. Plastic material. Epitaxial
More information1.5 GHz Active Probe TAP1500 Datasheet
1.5 GHz Active Probe TAP1500 Datasheet Easy to use Connects directly to oscilloscopes with the TekVPI probe interface Provides automatic units scaling and readout on the oscilloscope display Easy access
More informationRE-8500 BGA Rework Station
Jovy Systems Limited RE-8500 BGA Rework Station User Manual Ver1.0 1 Contents 1- Introduction. Page:4 a. General product information b. RE-8500 features c. Field of applications and components types d.
More informationA and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058
A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058 "When Quality Counts, Choose A&M Electronics" SMT, BGA, & Through
More informationERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test
ERNI Systems USA Backplanes Sub-Racks: Design, Simulation, Manufacturing and Test www.erni.com Engineering From Beginning to End Conceptualization From Customer Idea to Statement of Work (SOW) Structuring
More informationSOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES
SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines 1, Kirk Peloza 2, Adam Stanczak 3, David Geiger 4 1 Molex Lisle, IL, USA 2 Molex Lisle, IL, USA 3 Molex Lisle, IL,
More informationIFS ApplIcAtIonS For ElEctronIc components xxxxxxxxxxxxx
IFS Applications for ELECTRONIC COMPONENTS xxxxxxxxxxxxx OUR SOLUTION S DNA When we first set out to create IFS Applications over 25 years ago, our goal was to make the most usable business software on
More informationIFS ApplIcAtIonS For Document management
IFS Applications for Document management OUR SOLUTION S DNA When we first set out to create IFS Applications over 25 years ago, our goal was to make the most usable business software on the market. And
More informationMMIC packaging. 1. Introduction 2. Data interface. Data submittal methods. Data formats. Single chip & MCM solutions. Contents
MMIC packaging MMIC packaging Contents 1. Introduction Page 2 2. Data Interface Page 2 3. Microwave package design requirement Page 3 4. Materials Page 3 5. Package layout design guidelines Page 4 6. Package
More informationSoldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules
Seite 1 Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules Soldering with alloys containing lead (SnPb) is the standard connection technology
More informationAgilent 4338B Milliohm Meter
Agilent 4338B Milliohm Meter 10 µω to 100 kω Technical Overview Introduction Ideal for precise measurements of extremely low resistances using an ac test signal, the Agilent Technologies 4338B suits bench-top
More informationVJ 6040 UHF Chip Antenna for Mobile Devices
VJ 64 UHF Chip Antenna for Mobile Devices VJ 64 The company s products are covered by one or more of the following: WO2862 (A1), US2833 (A1), US283575 (A1), WO281173 (A1). Other patents pending. DESCRIPTION
More informationComputer Specifications
Computer Specifications Specifications Imaging Systems Bulletin 6126 These tables list current specifications for Bio-Rad imaging systems. Refer to the following pages for information about each imaging
More informationMS9000SAN Rework Station
MS9000SAN Rework Station MS9000SAN is the all-round rework system which almost all SMD can be reworked. And the original ITTS auto profiler system is operates of the system easily and exactly. Many kinds,
More informationAgilent Automotive Power Window Regulator Testing. Application Note
Agilent Automotive Power Window Regulator Testing Application Note Abstract Automotive power window regulator tests require the use of accurate data acquisition devices, as they cover a wide range of parameters
More informationControl your process and stay local
Agilent SJ50, Automated Optical Inspection Agilent SJ50 Automated Optical Inspection Control your process and stay local With the current discussions on the migration of European manufacturing to Asia,
More informationCOMPARISON BETWEEN THERMAL PERFORMANCE OF SILVER CONDUCTIVE ADHESIVE AND Sn-Ag-Cu SOLDER JOINTS IN A MEDICAL ULTRASOUND ARRAY TRANSDUCER
XIX IMEKO World Congress Fundamental and Applied Metrology September 6 11, 2009, Lisbon, Portugal COMPARISON BETWEEN THERMAL PERFORMANCE OF SILVER CONDUCTIVE ADHESIVE AND Sn-Ag-Cu SOLDER JOINTS IN A MEDICAL
More informationMachine Vision Optimizing Electronics Production
Expert Guide Machine Vision Optimizing Electronics Production Introduction Today, semiconductors cannot be manufactured without using machine vision. In fact, machine vision is an enabling technology that
More informationAgilent OSS Wireless QoS Manager
Agilent OSS Wireless QoS Manager The leading-edge solution for wireless-data service assurance New Wireless Challenges To manage today s wireless data services in a manner that ensures top service quality,
More informationWave Soldering Problems
Wave Soldering Problems What is a good joint? The main function of the solder is to make electrical interconnection, but there is a mechanical aspect: even where parts have been clinched or glued in position,
More informationIntroduction to the Plastic Ball Grid Array (PBGA)
Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder
More informationROBOTIC PRINTED CIRCUIT BOARD ASSEMBLY LINE
ROBOTIC PRINTED CIRCUIT BOARD ASSEMBLY LINE MET 415 By Martin Houlroyd 03/29/14 DEPARTMENT MAP 1. BARE PCBS 2. SOLDER PASTE 3. IC ASSEMBLY 4. REFLOW SOLDERING 5. AQUEOUS CLEANING 6. VISUAL INSPECTION 7.
More informationPreface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental
More information17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie
17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is
More informationAuditing Contract Manufacturing Processes
Auditing Contract Manufacturing Processes Greg Caswell and Cheryl Tulkoff Introduction DfR has investigated multiple situations where an OEM is experiencing quality issues. In some cases, the problem occurs
More informationApplication Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies
Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Table of Contents Page Method...2 Thermal characteristics of SMDs...2 Adhesives...4 Solder pastes...4 Reflow profiles...4 Rework...6
More informationE-Seminar. Financial Management Internet Business Solution Seminar
E-Seminar Financial Management Internet Business Solution Seminar Financial Management Internet Business Solution Seminar 3 Welcome 4 Objectives 5 Financial Management 6 Financial Management Defined 7
More informationAgilent T-1 3 / 4 (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet
Agilent T-1 3 / (5 mm), T-1 (3 mm), 5 Volt, 12 Volt, Integrated Resistor LED Lamps Data Sheet HLMP-16, HLMP-161, HLMP-162, HLMP-1621 HLMP-16, HLMP-161, HLMP-36, HLMP-361 HLMP-365, HLMP-3651, HLMP-36, HLMP-361
More informationMolded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.
Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct
More informationBe the best. PCBA Design Guidelines and DFM Requirements. Glenn Miner Engineering Manager March 6, 2014 DFM DFT. DFx DFC DFQ
and DFM Requirements DFM DFQ DFx DFT DFC Glenn Miner Engineering Manager Electronics, Inc. Not to be reproduced or used in any means without written permission by Benchmark. Guidelines and Requirements
More informationTaking the Pain Out of Pb-free Reflow
Taking the Pain Out of Pb-free Reflow Paul N. Houston & Brian J. Lewis Siemens Dematic Electronics Assembly Systems (770) 797-3362 Presented at APEX 2003, Anaheim CA Daniel F. Baldwin Engent, Inc. Norcross,
More informationHow To Build A Powerline Box Powerline Generator
Quick Reference Guide DYNAMIC Series Dynamic Series is a broad product family that provides connector solutions ranging from signal level circuitry through power circuit connectivity in a ruggedized, industrialized
More informationRack C. 25 slots (maximum 50 components) Maximum placement area 620 445 mm. Standard placement area 500 360 mm. Rack A
placeall 510 Basic machine Range of applications Dispensing and picking and placing of low volume SMT and small series, up to 4.000 components per hour (cph). Component capability Chips 0402 up to 45 45
More informationE'tow. Egemin Towing System for Product Transport & Sorting
E'tow. Egemin Towing System for Product Transport & Sorting Increase your transport capacity with reliable and high-performing in-floor chain conveyors www.egemin-automation.com Handling Automation Life
More informationMPM. Accela Stencil Printer. The premier printing platform for the perfect balance of throughput and quality. The world s most.
The world s most accurate printer provides extraordinary performance. MPM Accela Stencil Printer The premier printing platform for the perfect balance of throughput and quality Accela MPM Introducing the
More informationCASE STUDY. History. National Renewable Energy Laboratory Testing Wind Turbine Power Generators using PULSE. United States of America
CASE STUDY National Renewable Energy Laboratory Testing Wind Turbine Power Generators using PULSE United States of America Industrial Products PULSE The National Renewable Energy Laboratory (NREL) is operated
More informationMeasuring of the Temperature Profile during the Reflow Solder Process Application Note
Measuring of the Temperature Profile during the Reflow Solder Process Application Note Abstract With reference to the application note Further Details on lead free reflow soldering of LEDs the present
More informationOptimizing Insertion Extraction Force in a Pin-Socket Interconnect
Optimizing Insertion Extraction Force in a Pin-Socket Interconnect IC Socket industry trends are impacted by a combination of technology and market- driven factors. Technology driven factors include miniaturization,
More informationSolder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering
Freescale Semiconductor Application Note Document Number: AN3298 Rev. 0, 07/2006 Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering 1 Processability of Integrated
More informationGUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY
GUIDELINES FOR PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) OF UTAC GROUP S GRID ARRAY PACKAGE (GQFN) AND ITS BOARD LEVEL RELIABILITY Kyaw Ko Lwin*, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang
More informationInstallation Qualification/Operational Qualification Protocols and Instructions. Experion Automated Electrophoresis Station and Software
Installation Qualification/Operational Qualification Protocols and Instructions Experion Automated Electrophoresis Station and Software Validation Kit (Catalog #700-7051) Security Edition Software (Catalog
More informationThermal Management of Electronic Devices used in Automotive Safety A DoE approach
Thermal Management of Electronic Devices used in Automotive Safety A DoE approach Vinod Kumar, Vinay Somashekhar and Srivathsa Jagalur Autoliv India Private Limited, Bangalore, India Abstract: Electronic
More informationLogix5000 Clock Update Tool V2.00.36. 12/13/2005 Copyright 2005 Rockwell Automation Inc., All Rights Reserved. 1
Logix5000 Clock Update Tool V2.00.36. 1 Overview Logix5000 Clock Update Tool 1. 1. What is is it? it? 2. 2. How will it it help me? 3. 3. How do do I I use it? it? 4. 4. When can I I get get it? it? 2
More informationTime-Correlated Multi-domain RF Analysis with the MSO70000 Series Oscilloscope and SignalVu Software
Time-Correlated Multi-domain RF Analysis with the MSO70000 Series Oscilloscope and SignalVu Software Technical Brief Introduction The MSO70000 Series Mixed Oscilloscope, when coupled with SignalVu Spectrum
More informationCHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors
More informationImage Lab Software How to Obtain Stain-Free Gel and Blot Images. Instructions
Image Lab Software How to Obtain Stain-Free Gel and Blot Images Instructions Table of Contents Obtaining Stain-Free Gel images...1 5 Obtaining Stain-Free Blot Images...6 9 If the Gel Doc XR+ or ChemiDoc
More informationPDP TV. quick start guide. imagine the possibilities
PDP TV quick start guide imagine the possibilities Thank you for purchasing a Samsung product. To receive a more complete service, please register your product at www.samsung.com/global/register 02134A_CMS.indd
More informationHow To Clean A Copper Board With A Socket On It (Ios)
Den-on Rework Reference Process for Desktop platform and new Intel Socket LGA-1156 using the Den-on BGA rework station RD-500II and III *This document shows the whole process on how to repair the Intel
More informationSuccessFactors Employee Central: Cloud Core HR Introduction, Overview, and Roadmap Update Joachim Foerderer, SAP AG
Orange County Convention Center Orlando, Florida June 3-5, 2014 SuccessFactors Employee Central: Cloud Core HR Introduction, Overview, and Roadmap Update Joachim Foerderer, SAP AG SESSION CODE: 1812 Cloud
More informationValuetronics Holdings Limited. A pictorial tour of our Daya Bay facility
Valuetronics Holdings Limited A pictorial tour of our Daya Bay facility In early 2006, we acquired the land use rights to a 110,200 sqm land parcel in the Daya Bay Technology District, Huizhou City, Guangdong
More informationAgilent Mobile WiMAX R&D Test Set Solutions: Software and Technical Support Contract
Agilent Mobile WiMAX R&D Test Set Solutions: Software and Technical Support Contract Product Overview Maximize the potential of the E6651A Mobile WiMAX test set and related software with the latest software
More informationHARTING. Electronic Connectors
HARTING Electronic Connectors HARTING Electronic Connectors Global Innovative Technology The HARTING Technology Group has established a reputation for excellence and innovation with decades of experience
More informationToday's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering
Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Dipl.-Ing. Helmut Leicht; Andreas Thumm IBL-Löttechnik GmbH www.ibl-loettechnik.de, Germany ABSTRACT In the beginning
More informationTable of Contents. Conferencing Basics 3. Ready Bridge Set Up Options 4. Call Control Features 5. Security Features 6. Call Control Commands 7
Table of Contents Conferencing Basics 3 Ready Bridge Set Up Options 4 Call Control Features 5 Security Features 6 Call Control Commands 7 Conference Call Recording 8 International Conferencing 10 Page:
More informationApplication Note AN-1080. DirectFET Technology Inspection Application Note
Application Note AN-1080 DirectFET Technology Inspection Application Note Table of Contents Page Inspection techniques... 3 Examples of good assembly... 3 Summary of rejection criteria... 4 Types of faults...
More information10 Reasons to Choose Image-based ID Readers. White Paper
10 Reasons to Choose Image-based ID Readers White Paper 10 Reasons to Choose Image-based ID Readers INTRODUCTION Image-based ID readers stand poised to replace laser scanners in a wide range of industries
More informationCIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE
ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE Mohammad S. Sharawi Electrical Engineering Department, King Fahd University of Petroleum and Minerals Dhahran, 31261 Saudi Arabia Keywords: Printed Circuit
More informationRelease Notes: PowerChute plus for Windows 95 and Windows 98
: PowerChute plus for Windows 95 and Windows 98 These release notes supplement the User s Guide: PowerChute plus, Version 5.0.2, for Windows 95 and Windows 98 (pc98ug.pdf) and the Installation Guide: PowerChute
More informationConfiguring DHCP for ShoreTel IP Phones
Configuring DHCP for ShoreTel IP Phones Network Requirements and Preparation 3 Configuring DHCP for ShoreTel IP Phones The ShoreTel server provides the latest application software and configuration information
More informationAgilent E5063A ENA Series Network Analyzer
Agilent E5063A ENA Series Network Analyzer 100 khz to 4.5/ 8.5/18 GHz Configuration Guide Ordering Guide The following steps will guide you through configuring your E5063A. Standard furnished item Description
More information