Mask Aligner Process Enhancement by Spatial Filtering
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1 Mask Aligner Process Enhancement by Spatial Filtering Uwe Vogler*, Andreas Bich, Reinhard Voelkel, L. Stuerzebecher, U. Zeitner, M. Hornung * vogler@suss.ch
2 Micro-Optics in Front-End Lithography Customized Illumination Pupil Shaping (DOE) Now: FlexRay programmable illumination technology from ASML Customized Illumination Excimer Laser (193nm) Laser Beam Shaping Laser Beam Homogenizing Diffractive Optical Elements (DOE) MEMS Mirror Arrays (FlexRay ) Micro-Optics is Key Enabling Technology in Front-End Lithography Microlens Köhler Homogenizer 2
3 Back End Lithography: Mask Aligner Mask Aligners Lithography is Shadow Printing Mask illumination using UV light (High Pressure Mercury) Resolution <=> proximity gap Mask Wafer Mode Gap (µm) Min. Resolution Contact 0 > λ Proximity 10 < gap < 200 3
4 Mask Aligner Lithography All about illumination! Diffraction effects Partial coherence Side lobes Apodization Parallel Light Diffuse Light Customized Illumination? Parallel Light Apodization 4
5 Mask Aligner Illumination System Requirements Good Uniformity < 3% (5%) Max. irradiance intensity Long term stability Diffraction reduction Feature Off-axis Illumination fixed illumination angles Standard Mask Alginer Illumination System 6
6 Mask Illumination Field lens Irradiance 1 st Lens Plate Integrator 2 Fourier lens Mask plane BSV Maskenebene More lenses better uniformity of Irradiance intensity Angular spectrum 7
7 Microlens Optical Integrator (Köhler ) Microlens Array I(x) I(x) x x Flat-Top Intensity Profile 8
8 Microlens Arrays Stability / Telecentricity Standard Mask Illumination Telecentric Mask Illumination Features Stable Light Source Excellent Uniformity Telecentric Illumination Uniform angular spectrum over the entire mask plane centre rim Anglular spectrum at the mask plane Benefits Reduced Maintenance Improved CD Uniformity Larger Process Window Higher Yield 9
9 Funktion IFP s Spatial Filtering Fourier lens Field lens Mask Integrator 1 Monolithic: Doulbe-sided round lenses Integrator 2 Two crossed lens plates: double sided cylindric lenses Variabel Spacial filtering Concepts Axicon telescope Zoom lenses liquid crystal displays (LCD), micro-mirror arrays (DLP) variable membranes (MEMS, MOEMS) spatial light modulators (SLM) variable diaphragms. 10
10 Illumination Filter Plates (IFP s) Fourier lens Field lens Mask IFP s Free form illumination Quick and easy changeover Self-made customized illumination Long term stability Downward compatible (no software moddifications) IIlumination Filter Plate (IFP) Angular spectrum at the mask plane 11
11 Illumination Filter Plates (IFP s) Fourier lens Field lens Mask IFP s Free form illumination Quick and easy changeover Self-made customized illumination Long term stability Downward compatible (no software moddifications) IIlumination Filter Plate (IFP) Angular spektrum at the mask plane 12
12 Customized Illumination - Optimize Pattern Photomask Pattern Square 10x10µm 2 Prints in Photoresist, 1.2µm thick resist (AZ 4110), 100µm Proximity Gap, SUSS MA8 13
13 14 Image formation
14 IFPs: Trail or calculation? Evaluation of the perfect in the laboratory can consume a lot of resources. Simulation needed for the preselection of illumination settings. A stable, telecentric illumination is needed to get reliable simulation results Challenges: Calculation time for big areas Analyses of resist parameters Stability of resist parameters 15
15 Lithography Simulation: LayoutLab Input Mask Design Amplitude Phase Mask design Stack configuration Substrate Resist Parameter Topography Exposure Configuration Wavelength spectrum Gap Angular spectrum Intermediate Data Aerial Image 3D-Energy Spread Resist Image Cross section of the irradiance distribution within the gap Aerial image on top of the resist Cross section of irradiance in resist Analyses Values Process Window Sidewall shape CD vs. Gap CD vs. Dose Normalized Image Log Slope (N.I.L.S.) 3D- Image of the resulting resist cylinder 16
16 Source-Mask Optimization: Mask Optimization Square10µm x 10µm, Proximity Gap 50µm, Photoresist AZ4110, 1.2um thick 17
17 Optical Proximity Correction (OPC) Aerial image (simulation) Mask pattern OPC assist features Ref: Kristian Motzek, FhG-IISB, SUSS Report Sept μm line Aerial image 40μmProximity gap OPC assist features 18
18 19 Source-Mask Optimization Service
19 Application Example: Tablot effect 20 Talbot carpet (Source: Ben Goodman, Wikipedia)
20 Application Example: Talbot Effect Features For periodic structures Information transfer for big gaps and small resolution Mask Simulation of self imaging (pinhole IFP) SEM Reist SEM after RIE Simple pattern change with pixelated Illumination Filter Plate (IFP) 21
21 Grey-Level Structures Printed on Full Wafer in MA6 SE micrograph and atomic force scan of a realized blazed grating structure in photo resist AZ The normalized profile scan of the resist structure (height: 580nm) and the normalized intensity profile are shown together T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel, Half-tone proximity lithography, Photonics Europe, Conf. on Micro-optics Fabrication Technologies, , April 12-16,
22 Summary / Outlook Summary Increase of uniformity, telecentricity higher yield Enables lithography simulation Enables Customized Illumination, Source-Mask-Optimization, Outlook Create further optimization rules 24
23 Acknowledgment Torsten Harzendorf Andreas Erdmann Kristian Motzek Kenneth Weible Pascal Pernet Arianna Bramati 25
24 Thank you for your attention!! SUSS MicroOptics SA Rue Jaquet-Droz 7 CH-2000 Neuchâtel Switzerland Tel Fax info@suss.ch 26
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