Thermal Conductive Materials and LED Cooling

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1 Thermal Conductive Materials and LED Cooling

2 Agenda Overview Effects of Thermal Degradation Impact of Higher Voltages Impact on Relative Flux Thermal Interface Materials Considerations of Thermal Materials/Adhesives Thermal Interface Materials Variants Questions to Ask Summary

3 Challenges of Cooling LED Components LEDs may seem cool to the touch but like any electronic component, they produce heat that can impact performance and quality. LED clusters present specific design challenges: Contained in airtight enclosures Larger circuit boards Other heat-generating devices

4 Effects of Thermal Degradation As the temperature rises within an LED: Forward voltage drops Current passing through the diode increases exponentially Junction temperatures increase Light output diminishes over time, efficiency will drop Light color emitted may change due to wavelength shifts Other effects include: Yellowing of the LED lens Broken connections Damage to the thermal interface between the LED and heat sinks/heat spreaders

5 Impact of Higher Voltages A small change in the forward voltage can result in a significant increase in the current passing through the diode. Example: an increase of about 3.5V causes the current to rise by almost 1,000 ma. Net effect is a rise in temperature at the p-n junction, adding to heat dissipation problems.

6 Impact on Relative Flux LED light output can diminish over time with rises in temperature. The example provided for R (red), G (green), and B (blue) LEDs indicates that red lamps tend to lose brightness the most, and the fastest, as the junction temperature increases. As the chart depicts, blue light falls off slightly less than green and much less so than red.

7 Initial Assessment of Electronics & Packaging Thermal management starts with the circuit board and electronics package Various thermal management approaches include: Board-level attachment (through-hole vs. surface mounted) Heat sinks Metal base plates (e.g. copper, aluminum) Constant-current power supplies Fans Heat is generated on the underside of the chip and travels through a metal block, known as a slug, to solder points on the circuit board, and eventually to a heat sink where it is dissipated. The selection and use of materials for attachment/assembly are vital Thermal Interface Materials (TIMs) range from thermally conductive adhesives to die cut pads that are electrically isolating, as well as thermally conductive

8 Thermal Interface Materials (TIMs) Thermal Interface Materials are installed between a heat-generating device and a heat sink or chassis to facilitate heat transfer. Die-Cut Pads Tight dimensional control Range of materials Polymer, metal matrix, carbon/carbon composite Can include adhesive pads Liquids Fills gaps more completely Range of materials: Grease, silicone, epoxy No mechanical stress Some require curing

9 Considerations of Thermal Materials Operating temperature Dielectric strength Bond strength Surface wet-out Shock performance Packaging constraints Airflow Surface flatness (substrate, heat sink) Shape/type of metal used for heat sink Applied mounting pressure Thickness of the interface and contact area Production requirements and part size

10 TIM Variants Pads, Tapes, Films Easily die-cut to complex shapes Excellent high temperature, abrasion, and chemical resistance High or low conductivity Can be coated with an adhesive on one or both sides Formulated to achieve specified performance values in terms of dielectric strength, thermal conductivity, and thermal impedance No clean-up or cure time Dispensing machinery not required Smooth surfaces Can be pressure-sensitive

11 TIM Variants, cont d Thermal Grease Traditional interface material in electronics Silicone or non-silicone varieties Low thermal resistance through excellent gap filling Extremely thin bond line Reworkable, low-cost, reliable Easily applied (including automated dispensing) Can be impregnated into thermal pads Processing and production issues to be considered

12 TIM Variants, cont d Phase-Change Materials Supplement some of the issues related to thermal grease Solid at room temperature, but liquefy with heat application Typically composed of a coating of phase-change compound on an aluminum or polyimide substrate Can be coated directly onto a release liner without using a substrate Better flow when in the liquid stage; better gap/void filling Thinner interface results in greater heat-transfer efficiency Manufacturing-friendly doesn t pump-out of the interface like grease No messy application or cleanup necessary More reliable in terms of thermal management than grease

13 TIM Variants, cont d Thermally Conductive Adhesive Best choice when components aren t connected by mechanical attachment, or when substrate micro-movement requires adhesion so that a component can maintain contact with the substrate Commonly used with semiconductor packages as an interface between a chip and a heat spreader Versions include: Conformable interface pads easy to handle and provide high conductivity Liquid forms ultra-thin bond line, easily integrated w/dispensing equipment Tape maintains high mechanical strength plus good surface wetting and excellent shock absorption

14 TIM Variants, cont d Heat Sink and Component Bonding Bonds provide a thermal pathway for component cooling Films/tapes replace silicone greases and screws for attachment High thermal conductivity, good dielectric properties, high bond strength Highly conformable construction, fewer material interfaces that lead to poor thermal performance Excellent wet-out on surfaces, lowering thermal impedance

15 TIM Variants, cont d Flame Barriers Flexible insulation for electrical flame barriers Inorganic-based, halogen-free materials that are intrinsically flame retardant with good dielectric strength Excellent ignitability, arc, track resistance Low outgassing Dimensionally stable Ideal for general purpose LED luminaires UL & IEC ratings

16 Questions to Ask Experts in materials selection for thermal management help: Insist upon a Design for Manufacturability philosophy Seek experienced engineering support for design and prototyping Identify the most appropriate thermal path for the design Consider if heat dissipating adhesives/greases are required Recommend right materials die-cut pad, liquid adhesive, etc. Provide a material with suitable electrical insulation properties

17 Questions to Ask, cont d Experts in materials selection for thermal management help: Decide on off-the-shelf or custom solutions Source from multiple vendors materials = purchasing power Select right pressure sensitive tape for mounting components to heat sinks Determine tapes, elastomer pads, or coated fabrics to achieve specified dielectric strength, thermal conductivity, thermal impedance Convert, cut/slit, laminate, package finished products Follow industry/gov t specifications and standards

18 Summary Design engineers integrating LEDs into their designs must provide their customers with the highest quality and performance possible. While LEDs have major benefits, there are still thermal considerations to be solved in the product development process. Expert material selection/converting, plus experienced engineering support provide the proper thermal conductivity and electrical insulation for your product.

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