MC14049B, MC14050B. Hex Buffer

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1 MC49B, MC5B Hex Buffer The MC49B Hex Inverter/Buffer and MC5B Noninverting Hex Buffer are constructed with MOS PChannel and NChannel enhancement mode devices in a single monolithic structure. These complementary MOS devices find primary use where low power dissipation and/or high noise immunity is desired. These devices provide logic level conversion using only one supply voltage,. The inputsignal high level (V IH ) can exceed the supply voltage for logic level conversions. Two TTL/DTL loads can be driven when the devices are used as a CMOStoTTL/DTL converter ( = V, V OL.4 V, I OL 3.2 ma). Note that pins 3 and 6 are not connected internally on these devices; consequently connections to these terminals will not affect circuit operation. Features High Source and Sink Currents HightoLow Level Converter Supply Voltage Range = 3. V to V V IN can exceed Meets JEDEC B Specifications Improved ESD Protection On All Inputs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ Qualified and PPAP Capable These Devices are PbFree and are RoHS Compliant MAXIMUM RATINGS (Voltages Referenced to ) Symbol Parameter Value Unit DC Supply Voltage Range.5 to +. V V in Input Voltage Range (DC or Transient).5 to +. V V out Output Voltage Range (DC or Transient).5 to +.5 V I in Input Current (DC or Transient) per Pin ± ma I out Output Current (DC or Transient) per Pin ±45 ma P D Power Dissipation, per Package (Note ) (Plastic) (SOIC) 25 7 mw T A Ambient Temperature Range 55 to +25 C T stg Storage Temperature Range 65 to + C T L Lead Temperature (Second Soldering) 26 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. Temperature Derating: See Figure 3. This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields referenced to the pin only. Extra precautions must be taken to avoid applications of any voltage higher than the maximum rated voltages to this highimpedance circuit. For proper operation, the ranges V in V and V out are recommended. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either or ). Unused outputs must be left open. SOIC6 D SUFFIX CASE 75B 6 OUT A xxbg AWLYWW SOIC6 xx A WL, L YY, Y WW, W G or MARKING DIAGRAMS 6 SOEIAJ6 F SUFFIX CASE 966 PIN ASSIGNMENT IN A OUT B IN B OUT C IN C B ALYW TSSOP6 MCxxB ALYWG SOEIAJ6 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = PbFree Indicator ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet TSSOP6 DT SUFFIX CASE 94F (Note: Microdot may be in either location) 9 NC OUT F IN F NC OUT E IN E OUT D IN D Semiconductor Components Industries, LLC, 24 August, 24 Rev. 9 Publication Order Number: MC49B/D

2 MC49B, MC5B MC49B LOGIC DIAGRAM MC5B NC = PIN 3, 6 = PIN = PIN 4 NC = PIN 3, 6 = PIN = PIN ORDERING INFORMATION Device Package Shipping MC49BDG MC49BDR2G NLV49BDR2G* MC49BFELG SOIC6 (PbFree) SOIC6 (PbFree) SOIC6 (PbFree) SOEIAJ6 (PbFree) 4 Units / Rail 25 Units / Tape & Reel 25 Units / Tape & Reel 2 Units / Tape & Reel MC5BDG NLV5BDG* MC5BDR2G NLV5BDR2G* MC5BDTG NLV5BDTG* MC5BDTR2G MC5BFELG SOIC6 (PbFree) SOIC6 (PbFree) SOIC6 (PbFree) SOIC6 (PbFree) TSSOP6 (PbFree) TSSOP6 (PbFree) TSSOP6 (PbFree) SOEIAJ6 (PbFree) 4 Units / Rail 4 Units / Rail 25 Units / Tape & Reel 25 Units / Tape & Reel 96 Units / Rail 96 Units / Rail 25 Units / Tape & Reel 2 Units / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ Qualified and PPAP Capable. 2

3 MC49B, MC5B ELECTRICAL CHARACTERISTICS (Voltages Referenced to ) Output Voltage V in = V in = Characteristic Level Level Input Voltage Level (V O = 4.5 ) (V O = 9. ) (V O = 3.5 ) (V O =.5 ) (V O =. ) (V O =.5 ) Level Output Drive Current (V OH = 2.5 ) Source (V OH = 9.5 ) (V OH = 3.5 ) (V OL =.4 ) Sink (V OL =.5 ) (V OL =.5 ) Symbol V OL V OH V IL V IH I OH I OL 55 C +25 C +25 C Min Max Min Typ (Note 2) Max Min Max Input Current I in ±. ±. ±. ±. Adc Input Capacitance (V in = ) C in 2 pf Quiescent Current (Per Package) I DD Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, per package) (C L = 5 pf on all outputs, all buffers switching I T I T = (. A/kHz) f + I DD I T = (3.5 A/kHz) f + I DD I T = (5.3 A/kHz) f + I DD Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Data labelled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance. 3. The formulas given are for the typical characteristics only at +25 C 4. To calculate total supply current at loads other than 5 pf: I T (C L ) = I T (5 pf) + (C L 5) Vfk Where: I T is in A (per Package), C L in pf, V = ( ) in volts, f in khz is input frequency and k = Unit madc madc Adc Adc 3

4 MC49B, MC5B AC SWITCHING CHARACTERISTICS (Note 5) (C L = 5 pf, T A = + 25 C) Characteristic Output Rise Time t TLH = (.7 ns/pf) C L + 65 ns t TLH = (.25 ns/pf) C L ns t TLH = (.2 ns/pf) C L + ns Output Fall Time t THL = (.2 ns/pf) C L + ns t THL = (.6 ns/pf) C L + 7 ns t THL = (.4 ns/pf) C L + 3 ns Propagation Delay Time t PLH = (.33 ns/pf) C L ns t PLH = (.9 ns/pf) C L +.5 ns t PLH = (.6 ns/pf) C L + 27 ns Propagation Delay Time t PHL = (.2 ns/pf) C L + ns t PHL = (. ns/pf) C L + ns t PHL = ( ns/pf) C L ns Symbol t TLH t THL t PLH t PHL Min Typ (Note 6) Max Unit 5. The formulas given are for the typical characteristics only at 25 C. 6. Data labeled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance ns ns ns ns MC49B MC5B MC49B MC5B I OH I OL V OH V OL I OL V OL I OH V OH V DS = V OH - = V OL 6 I OH, OUTPUT SOURCE CURRNT (madc) V GS = V GS = V GS = MAXIMUM CURRENT LEVEL I OL, OUTPUT SINK CURRENT (madc) 2 V GS = V GS = MAXIMUM CURRENT LEVEL V GS = V DS, DRAIN-TO-SOURCE VOLTAGE () Figure. Typical Output Source Characteristics V DS, DRAIN-TO-SOURCE VOLTAGE () Figure 2. Typical Output Sink Characteristics 4

5 MC49B, MC5B P D, MAXIMUM POWER DISSIPATION (mw) PER PACKAGE (P) PDIP (D) SOIC T A, AMBIENT TEMPERATURE ( C) mw (P) 2 mw (D) Figure 3. Ambient Temperature Power Derating 2 ns 2 ns INPUT 9% 5% % PULSE GENERATOR V in # V out t PHL OUTPUT MC49B t PLH 9% 5% % t THL t PLH t TLH V OH V OL # Invert on MC49B only C L OUTPUT MC5B t PHL 9% 5% % t PHL V OH V OL t TLH t THL Figure 4. Switching Time Test Circuit and Waveforms 5

6 MC49B, MC5B PACKAGE DIMENSIONS SOIC6 D SUFFIX CASE 75B5 ISSUE K A 6 9 B P PL.25 (.) M B S NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION. (.6) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. T SEATING PLANE G D 6 PL K C M R X 45 J F MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D F G.27 BSC BSC J K M 7 7 P R (.) M T B S A S SOLDERING FOOTPRINT* X 6. 6X.2 6 6X.5.27 PITCH 9 DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6

7 MC49B, MC5B PACKAGE DIMENSIONS. (.6) T. (.6) T. (.4) T SEATING PLANE L U PIN IDENT. U D S S 2X L/2 C 6X K REF. (.4) M T U S V S 6 9 A V G B U H TSSOP6 DT SUFFIX CASE 94F ISSUE B J N N J F DETAIL E DETAIL E K K ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ SECTION NN.25 (.) M SOLDERING FOOTPRINT* W NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED. (.6) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED.25 (.) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE. (.3) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C.2.47 D..2.6 F G.65 BSC.26 BSC H J J K K L 6. BSC.252 BSC M PITCH 6X.36 6X.26 DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7

8 MC49B, MC5B PACKAGE DIMENSIONS SOEIAJ6 F SUFFIX CASE 966 ISSUE A e 6 9 Z b D A H E A.3 (.5) M. (.4) E VIEW P M L E Q L DETAIL P c NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED. (.6) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE. (.3) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE.46 (.). MILLIMETERS INCHES DIM MIN MAX MIN MAX A A.2.2. b c D E e.27 BSC BSC H E L L E M Q Z ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 27 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: 3575 ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MC49B/D

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