101 North Sepulveda Boulevard, El Segundo, California, 90245, USA Telephone:

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Thomasine Morton
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1 Revised Process Change Notification This is a revised notice from previous PCN sent to clarify the differences in FIT due to minor package outline dimensional differences. Date PCN Reference: PCR Reference: Product Reference: Previous PCN # 67-PCN-90, 67-CUST PCN90-Public-R2 Power Management Devices PQFN 3.3x3.3 FETs To Our Valued Customer: As always we appreciate your use of International Rectifier semiconductor products. Our commitment to customer satisfaction and continuous improvement is demonstrated by our change plans to enhance capacity, quality and reliability. This revised notice is to inform you that the previous PCN sent did not disclose minor dimensional differences between current and future alternative assembly houses. IR needs your help to review this change and advice ASAP if it is acceptable for your assembly application. Please review the details in the Impact Section of this notification and advise if change is acceptable. The JEDEC outline is met in both package outlines, but need your review of differences and advice. Type of Change Notification: Clarification of previous PCN sent regarding Alternative Assembly site to define the Package Outline Dimension (POD) and footprint differences from current to additional assembly site for PQFN 3.3x3.3 Copper Clip Power MOSFET products.

2 Description of Change: ASE-Weihai (China) is the alternate assembly site for the part numbers identified in the following table. The Bill of Materials has changed in wire material, mold compound and die attach material as follows: Material Before After Die attach 92.5Pb5Sn2.5Ag 95.5Pb2Sn2.5Ag Wire 2.0mil Cu/Au wire 2mil Cu wire Source Cu clip Cu clip interconnect Mold compound Material # , 44- Material # Lead finish 100Sn Matte 100Sn Matte Reason for the Change: Additional assembly capacity. Effect Date: / /2015 International Rectifier considers this change approved and will implement if no written response is received within 30 days. Please submit conditions of acceptance and data requests within 30 days of issuance of this report to the PCN coordinator listed at the end of this notice. Impact of Change: The package outline dimensions (POD) and footprint will be slightly different at the new assembly site. Product Datasheets will be revised to reflect the differences listed below. The new assembly site will meet the same qualification level as the existing assembly site. 2

3 Package Outline Dimensions (POD) and Footprint assessment Carsem/PSI assembly sites package outline (this schematic is currently shown on all existing product datasheets): ASE-Weihai (ASEW) site package outline: 3

4 Main differences between products: 4

5 The following table compares the critical dimensions of CARSEM/PSI and ASEW, and JEDEC is added for reference. Below is the unit simulation showing the package footprint overlap using Application Note 1136 recommended PCB footprint. Depending on customer s PCB design shift might occur post SMT reflow. Green: Carsem/PSI POD (current site) Red: Recommended PCB layout Blue: ASEW POD (new site) 5

6 Carsem/PSI package before and after SMT reflow. Before: After ASEW package before and after SMT reflow. Before: After: In both cases, the device moves and aligns itself within the pad tolerances once the solder has melted. The adhesion forces of the solder pull the drain pad of the package to align to the drain pad in the PCB. Conclusion is that the ASE-W product will align differently from Carsem/PSI products, with an off-set of 0.240mm, as ilustraded in SMT simulation below. 6

7 Both package types are within JEDEC requirements, and based on our recommended PCB footprint, backward compatible. This simulation is based on the Substrate/PCB layout suggested in Application Note AN We recommend that you review your PCB layout for compatibility. Products Affected: Part PBF IRFHM830DTRPBF IRFHM830TRPBF IRLHM620TRPBF IRLHM630TRPBF Description MOSFET, 30V, 40A, 4.3mOhm, 13nC Qg, 1.1Ohm RG, MonoFETKy, PQFN 3.3x3.3 MOSFET, 30V, 40A, 3.8mOhm, PQFN 3.3x3.3 MOSFET, 20V, 40A, 2.5mOhm, 2.5V drive capable, PQFN 3.3x3.3 MOSFET, 20V, 40A, 3.5mOhm, 2.5V drive capable, PQFN 3.3x3.3 Qualification: Parts have completed reliability testing requirements. Reliability qualification report is available upon request. Qualification standards can be found on International Rectifier s web site at Data Availability: Please contact the PCN Coordinator for supporting data. 7

8 low volume runners if samples are required due to special circumstances, they may not be available until 1 st authorized shipment of product. Contact Information: CONTACT TYPE NAME PHONE PCN Coordinator Mark Ogden mailto:mogden1@irf.com Technical Cesar Gonzalez mailto:cgonzal1@irf.com 8

Automotive Process Change Notification

Automotive Process Change Notification Date: September 26, 2014 PCN Reference: AU-14-168, D-Pak Leadframe and Bill of Materials (BOM) Product Reference: Automotive Planar Gen5.x and 7.x MOSFETs in D-Pak