High Stability - Very High Temperature (270 C) Thin Film Wraparound Chip Resistors, Sulfur Resistant

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1 High Stability - Very High Temperature (27 C) Thin Film Wraparound Chip Resistors, Sulfur Resistant INTRODUCTION For applications such as down hole applications, the need for parts able to withstand very severe conditions (temperature as high as 25 C powered or up to 27 C un-powered) has led to push out the limit of the thin film technology. Designers might read the application note Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (P, PRA etc ) (High Temperature Application) in conjunction with this datasheet to help them to properly design their board and get the best performances of the. research and development engineers will be willing to support any customer design considerations. FATURS Operating temperature range: -55 C; +25 C Storage temperature: -55 C; +27 C Gold terminations (< 1 μm thick) 5 sizes available (42, 63, 85, 126, 21); other sizes upon request Temperature coefficient down to 5 ppm/ C typical, 1 ppm/ C maximum (-55 C; +27 C) Tolerance down to.5 % Load life stability:.8 % typical (1 % max.) after 2 h at 25 C (ambient) at Pn Shelf life stability: 1.5 % typical after 8 h SMD wraparound.2 % upon request TCR remains constant after long term storage at 27 C Sulfur resistant (per ASTM B89-95 humid vapor test) Material categorization: for definitions of compliance please see STANDARD LCTRICAL SPCIFICATIONS MODL SIZ Notes (1) For power handling improvement, please refer to application note 5347 Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications) and consult (2) See derating curve on next page (3) See Table 1 on next page RSISTANC RANG Ω RATD POWR (1)(2) P 25 C W LIMITING LMNT VOLTAG V TOLRANC ± % TMPRATUR COFFICINT (3) ± ppm/ C to 45K ,.1,.5, 1 5, 1, 15, 25, 3, 5, to 18K ,.1,.5, 1 5, 1, 15, 25, 3, 5, to 24K ,.1,.5, 1 5, 1, 15, 25, 3, 5, to 9K ,.1,.5, 1 5, 1, 15, 25, 3, 5, to 2.5M.2 3.5,.1,.5, 1 5, 1, 15, 25, 3, 5, 55 CLIMATIC SPCIFICATIONS Operating temperature range -55 C; +25 C Storage temperature range -55 C; +27 C PRFORMANC VS. HUMID SULFUR VAPOR Test conditions Test results 5 C ± 2 C, 85 % ± 4 % RH, exposure time 5 h Resistance drift < (.5 % R +.5 Ω), no corrosion products observed MCHANICAL SPCIFICATIONS Substrate Alumina Resistive lement Thin Film Passivation Silicon nitride (Si 3 N 4 ) Protection poxy + Silicone Terminations Gold (< 1 μm) over nickel barrier Caution: Performances obtained with following mounting conditions: Test board material: alumina Solder paste: PbSnAg (93.5/5/1.5) Revision: 13-Nov-15 1 Document Number: 536 AR SUBJCT TO SPCIFIC DISCLAIMRS, ST FORTH AT

2 TABL 1 - TMPRATUR COFFICINT Z Y H 5 ppm/ C C; +7 C 1 ppm/ C -55 C; +27 C 1 ppm/ C -55 C; +155 C 15 ppm/ C -55 C; +27 C 25 ppm/ C -55 C; +155 C 3 ppm/ C -55 C; +27 C 5 ppm/ C -55 C; +155 C 55 ppm/ C -55 C; +27 C TABL 2 SRIS RANG (Ω) TOL. (± %) TCR COD 42 From 39 to 45K.5,.1,.5, 1 Z; Y; ; H 63 From 39 to 18K.5,.1,.5, 1 Z; Y; ; H 85 From 39 to 24K.5,.1,.5, 1 Z; Y; ; H 126 From 39 to 9K.5,.1,.5, 1 Z; Y; ; H 21 From 39 to 2.5M.5,.1,.5, 1 Z; Y; ; H POWR DRATING CURV Power Derating Curve 85 Power Derating Curve Power Derating Curve 126 Power Derating Curve Revision: 13-Nov-15 2 Document Number: 536 AR SUBJCT TO SPCIFIC DISCLAIMRS, ST FORTH AT

3 Power Derating Curve DIMNSIONS in millimeters (inches) D A D C B CAS SIZ A MAX. TOL (+.6) MIN. TOL (-.6) B MAX. TOL (+.5) MIN. TOL (-.5) NOMINAL NOMINAL NOMINAL TOLRANC (.39).6 (.24).25 (.1).1 (.4) (.6).85 (.33).4 (.16).38 (.15) (.75) 1.27 (.5) ±.51 (.2).13 (.5) (.12) 1.6 (.63).4 (.16) (.2) 2.54 (.1).48 (.19) C D/ SUGGSTD LAND PATTRN (TO IPC-7351A) G min. X max. Z max. CHIP SIZ DIMNSIONS (in millimeter) Z max. G min. X max Revision: 13-Nov-15 3 Document Number: 536 AR SUBJCT TO SPCIFIC DISCLAIMRS, ST FORTH AT

4 STORAG CURV LOAD LIF STABILITY CURVS Drift (ppm) ΔR/R (%) Sample 1 Sample 2 Sample Sample 1 Sample 2 Sample Time (h) Time (h) 25 C Drift (Storage) vs. Time PACKAGING SD packaging available: waffle-pack, and plastic tape and reel (low conductivity). Paper tape available upon request (SD only). SIZ MOQ NUMBR OF PICS PR PACKAG WAFFL PACK 2" 2" TAP AND RL MIN. MAX. TAP WIDTH mm mm 21:.2 W/25 C Note Test performed on samples of 3 different values coming from different lots. PACKAGING RULS Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get not stacked up waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult for specific ordering code. Tape and Reel See part numbering information to get the quantity desired by tape. GLOBAL PART NUMBR INFORMATION GLOBAL PART NUMBRING: 126Y11BGT63 (Limited to 18 digits: If more digits are necessary a codification of some digits might be used) P V H T Y 1 1 B G T 6 3 GLOBAL MODL SIZ TCR VALU TOLRANC TRMINATION PACKAGING OPTION Z Y H The first three digits are significant figures and the last digit specifies the number of zeros to follow, R designates decimal point 1R = 1 Ω 391 = 39 Ω 14 = 1 MΩ W =.5 % B =.1 % D =.5 % F = 1 % G = gold 1 or 2 digits: see codification of packaging table Leave blank if no option Revision: 13-Nov-15 4 Document Number: 536 AR SUBJCT TO SPCIFIC DISCLAIMRS, ST FORTH AT

5 CODIFICATION OF PACKAGING COD PACKAGING WAFFL PACK W 1 min., 1 mult WA 1 min., 1 mult (available only in size 126) PLASTIC TAP (standard tape for all sizes, except 42) T 1 min., 1 mult TA 1 min., 1 mult TB 25 min., 25 mult TC 5 min., 5 mult TD 1 min., 1 mult T 25 min., 25 mult TF Full tape (quantity depending on size of chips) PAPR TAP (standard for 42, upon request for other sizes) PT 1 min., 1 mult PA 1 min., 1 mult PB 25 min., 25 mult PC 5 min., 5 mult PD 1 min., 1 mult P 25 min., 25 mult PF Full tape (quantity depending on size of chips) Revision: 13-Nov-15 5 Document Number: 536 AR SUBJCT TO SPCIFIC DISCLAIMRS, ST FORTH AT

6 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPCIFICATIONS AND DATA AR SUBJCT TO CHANG WITHOUT NOTIC TO IMPROV RLIABILITY, FUNCTION OR DSIGN OR OTHRWIS. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. xcept as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 91

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