COMPONENT ID CERTIFICATION TEST (DVD-64C)

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1 v2.0 This test consists of fifty multiple-choice questions. All questions are from the IPC Component Identification training video (DVD-64C). Each question has only one most correct answer. Circle the letter corresponding to your selection for each test item. If you want to change an answer, erase your choice completely. You should read through the questions and answer those you are sure of first. After your first pass through the test, then go back and answer the questions that you were not sure of. If two answers appear to be correct, pick the answer that seems to be the most correct response. When you are finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (35 or more correct answers). Good luck! 1

2 1. Through-hole components a. have leads that are soldered directly onto lands on the surface of a circuit board b. have leads that are inserted through mounting holes on the circuit board c. are always semiconductors 2. Components that can amplify or interpret a signal are called a. active components b. discrete components c. passive components d. metallized components 3. Passive components a. always have axial leads b. always have radial leads c. interpret signals d. cannot change an electrical signal except to reduce it in size or delay it 4. A group of interconnected elements assembled into a single package is a. a surface mount component b. a discrete component c. an integrated circuit d. a through-hole component 5. A listing of the components and quantities for an electronic assembly is found on the a. assembly drawing b. router c. assembly instructions d. bill of materials 6. The assembly drawing a. lists component part numbers and quantities b. shows the components and their locations on the circuit board c. details the exact process steps in assembly d. provides an engineering drawing of each component 7. The letters and numbers used to identify components on circuit boards are called a. reference designators b. manufacturer s part numbers c. numerical values d. color bands 2

3 8. Components may be identified by a. reference designator b. part number c. value and tolerance 9. Components requiring negative and positive connections have a. terminations b. capacitance c. polarity d. resistance 10. The positive lead of a component is called the a. anode b. cathode c. diode d. electrode 11. Proper orientation means a. the component is placed next to the proper reference designator b. pin 1 of the component is in the same position as the pin 1 hole on the circuit board c. components have correct negative and positive connections d. components are placed far enough away from magnetic fields 12. Identify this component: a. dual-in-line package (DIP) b. Pin Grid Array (PGA) c. capacitor d. single-in-line package (SIP) 13. Identify this component: a. DIP b. PGA c. capacitor d. SIP 3

4 14. On this component, identify the location of pin 1: a. the first pin clockwise from the notch b. the first pin counter-clockwise from the notch c. upper right hand corner d. upper left hand corner 15. The most common reference designator for an IC is the letter a. I b. C c. U d. L 16. Identify this component: a. IC can b. resistor network c. SIP d. polarized capacitor 17. Identify this component: a. IC can b. DIP c. SIP d. PGA 18. Identify the axial-leaded resistor: a. b. c. d. 4

5 19. Resistors are measured in a. microfarads b. amps c. ohms d. megahertz 20. Resistor color bands are used to a. identify the manufacturer of the resistor b. calculate the value and tolerance of the resistor c. give the resistor a stylish look 21. A unit of electrical capacitance is called a a. henry b. volt c. watt d. farad 22. Identify this component: a. radial capacitor b. axial capacitor c. diode d. inductor 23. The negative lead on a polarized capacitor is called the a. square land b. anode c. cathode d. pin 1 lead 24. Identify the diode: a. b. c. d. 5

6 25. Identify this component: a. transistor b. LED c. resistor d. polarized capacitor 26. Identify this component: a. transistor b. LED c. resistor d. diode 27. Identify this component: a. radial capacitor b. filter c. crystal d. inductor 28. An example of a coiled component is a a. transformer b. torroid c. inductor 29. Identify this component: a. inductor b. connector c. filter d. diode 30. Crystals are measured in a. farads b. hertz c. henries d. watts 6

7 31. Identify the crystal: a. b. c. d. 32. Sockets, headers and jumpers are examples of a. polarized components b. front panel switches c. connecting hardware d. resistor networks 33. Surface mount components a. are larger than their through-hole counterparts b. are smaller than their through-hole counterparts c. have few electronic functions than their through-hole counterparts d. are inserted through mounting holes on the surface of the circuit board 34. Surface mount components come from the manufacturer a. on tape and reel b. in tubes c. in waffle trays 35. Identify this type of surface mount lead: a. J-lead b. I-lead c. gull wing d. L-lead 7

8 36. Identify this type of surface mount lead: a. J-lead b. I-lead c. gull wing d. L-lead 37. Lead pitch is the a. angle of the lead b. shape of the lead c. termination point of the lead d. distance between the center of one lead to the center of the next lead 38. What do we call this type of leadless connection: a. castellation b. termination c. ball grid array d. flat lead 39. Identify this component: a. QFP b. PLCC c. BGA d. flat pack 40. Identify this component: a. QFP b. PLCC c. BGA d. flat pack 8

9 41. The solder connections on a leadless chip carrier are called a. terminations b. L-leads c. flat leads d. castellations 42. Identify this component: a. QFP b. BGA c. LCC d. flat pack 43. Identify this component: a. SOIC b. VSOP c. SOL-J d. TSOP 44. Identify this component: a. SOIC b. VSOP c. SOL-J d. TSOP 45. Part numbers for chip components are usually marked on the a. body of the component b. tape reel c. circuit board 9

10 46. Identify this component: a. crystal b. MELF resistor c. chip resistor d. molded tantalum capacitor 47. Identify this component: a. crystal b. MELF resistor c. chip resistor d. molded tantalum capacitor 48. Identify this component: a. chip component b. MELF c. molded tantalum capacitor d. none of the above 49. Identify this component: a. MELF b. molded tantalum capacitor c. SOT d. QFP 50. DPAKs house a. small transistors or diodes b. higher powered transistors or diodes c. light emitting diodes 10

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