LM1117/LM1117I 800mA Low-Dropout Linear Regulator

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1 LM1117/LM1117I 800mA Low-Dropout Linear Regulator General Description The LM1117 is a series of low dropout voltage regulators with a dropout of 1.2 at 800mA of load current. It has the same pin-out as National Semiconductor s industry standard LM317. The LM1117 is available in an adjustable version, which can set the output voltage from 1.25 to 13.8 with only two external resistors. In addition, it is also available in five fixed voltages, 1.8, 2.5, 2.85, 3.3, and 5. The LM1117 offers current limiting and thermal shutdown. Its circuit includes a zener trimmed bandgap reference to assure output voltage accuracy to within ±1%. The LM1117 series is available in LLP, TO-263, SOT-223, TO-220, and TO-252 D-PAK packages. A minimum of 10µF tantalum capacitor is required at the output to improve the transient response and stability. Typical Application Active Terminator for SCSI-2 Bus Features n Available in 1.8, 2.5, 2.85, 3.3, 5, and Adjustable ersions n Space Saving SOT-223 and LLP Packages n Current Limiting and Thermal Protection n Output Current 800mA n Line Regulation 0.2% (Max) n Load Regulation 0.4% (Max) n Temperature Range LM C to 125 C LM1117I 40 C to 125 C Applications n 2.85 Model for SCSI-2 Active Termination n Post Regulator for Switching DC/DC Converter n High Efficiency Linear Regulators n Battery Charger n Battery Powered Instrumentation October 2002 LM1117/LM1117I 800mA Low-Dropout Linear Regulator Fixed Output Regulator National Semiconductor Corporation DS

2 LM1117/LM1117I Ordering Information Package Temperature Range Part Number Packaging Marking Transport Media NSC Drawing 3-lead 0 C to +125 C LM1117MPX-ADJ N03A Tape and Reel MP04A SOT-223 LM1117MPX-1.8 N12A Tape and Reel LM1117MPX-2.5 N13A Tape and Reel LM1117MPX-2.85 N04A Tape and Reel LM1117MPX-3.3 N05A Tape and Reel LM1117MPX-5.0 N06A Tape and Reel 40 C to +125 C LM1117IMPX-ADJ N03B Tape and Reel LM1117IMPX-3.3 N05B Tape and Reel LM1117IMPX-5.0 N06B Tape and Reel 3-lead TO C to +125 C LM1117T-ADJ LM1117T-ADJ Rails T03B LM1117T-1.8 LM1117T-1.8 Rails LM1117T-2.5 LM1117T-2.5 Rails LM1117T-2.85 LM1117T-2.85 Rails LM1117T-3.3 LM1117T-3.3 Rails LM1117T-5.0 LM1117T-5.0 Rails 3-lead TO C to +125 C LM1117DTX-ADJ LM1117DT-ADJ Tape and Reel TD03B LM1117DTX-1.8 LM1117DT-1.8 Tape and Reel LM1117DTX-2.5 LM1117DT-2.5 Tape and Reel LM1117DTX-2.85 LM1117DT-2.85 Tape and Reel LM1117DTX-3.3 LM1117DT-3.3 Tape and Reel LM1117DTX-5.0 LM1117DT-5.0 Tape and Reel 40 C to +125 C LM1117IDTX-ADJ LM1117IDT-ADJ Tape and Reel LM1117IDTX-3.3 LM1117IDT-3.3 Tape and Reel LM1117IDTX-5.0 LM1117IDT-5.0 Tape and Reel 8-lead LLP 0 C to +125 C LM1117LDX-ADJ 1117ADJ Tape and Reel LDC08A LM1117LDX Tape and Reel LM1117LDX Tape and Reel LM1117LDX Tape and Reel LM1117LDX Tape and Reel LM1117LDX Tape and Reel 40 C to 125 C LM1117ILDX-ADJ 1117IAD Tape and Reel LM1117ILDX I33 Tape and Reel LM1117ILDX I50 Tape and Reel TO C to +125 C LM1117SX-ADJ LM1117SADJ Tape and Reel TS3B LM1117SX-2.85 LM1117S2.85 Tape and Reel LM1117SX-3.3 LM1117S3.3 Tape and Reel LM1117SX-5.0 LM1117S5.0 Tape and Reel 2

3 Block Diagram LM1117/LM1117I Connection Diagrams TO-263 SOT Top iew Top iew TO Side iew LLP Top iew TO-252 Top iew When using the LLP package Pins 2, 3&4must be connected together and Pins 5, 6&7must be connected together Top iew

4 LM1117/LM1117I Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Maximum Input oltage ( IN to GND) Power Dissipation (Note 2) Junction Temperature (T J ) (Note 2) Storage Temperature Range Lead Temperature TO-220 (T) Package 20 Internally Limited 150 C -65 C to 150 C 260 C, 10 sec SOT-223 (IMP) Package 260 C, 4 sec ESD Tolerance (Note 3) 2000 Operating Ratings (Note 1) Input oltage ( IN to GND) 15 Junction Temperature Range (T J )(Note 2) LM C to 125 C LM1117I 40 C to 125 C LM1117 Electrical Characteristics Typicals and limits appearing in normal type apply for T J = 25 C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 0 C to 125 C. Symbol Parameter Conditions REF Reference oltage LM1117-ADJ I OUT = 10mA, IN - OUT = 2, T J = 25 C 10mA I OUT 800mA, 1.4 IN - OUT 10 OUT Output oltage LM I OUT = 10mA, IN = 3.8, T J = 25 C 0 I OUT 800mA, 3.2 IN 10 LM I OUT = 10mA, IN = 4.5, T J = 25 C 0 I OUT 800mA, 3.9 IN 10 LM I OUT = 10mA, IN = 4.85, T J = 25 C 0 I OUT 800mA, 4.25 IN 10 0 I OUT 500mA, IN = 4.10 LM I OUT = 10mA, IN =5T J = 25 C 0 I OUT 800mA, 4.75 IN 10 LM I OUT = 10mA, IN = 7, T J = 25 C 0 I OUT 800mA, 6.5 IN 12 OUT Line Regulation (Note 6) Min (Note 5) Typ (Note 4) Max (Note 5) Units LM1117-ADJ I OUT = 10mA, 1.5 IN - OUT % LM m I OUT = 0mA, 3.2 IN 10 LM m I OUT = 0mA, 3.9 IN 10 LM I OUT = 0mA, 4.25 IN m LM I OUT = 0mA, 4.75 IN m LM I OUT = 0mA, 6.5 IN m 4

5 LM1117 Electrical Characteristics (Continued) Typicals and limits appearing in normal type apply for T J = 25 C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 0 C to 125 C. Symbol Parameter Conditions OUT Load Regulation (Note 6) Min (Note 5) Typ (Note 4) Max (Note 5) Units LM1117-ADJ IN - OUT = 3, 10 I OUT 800mA % LM m IN = 3.2, 0 I OUT 800mA LM m IN = 3.9, 0 I OUT 800mA LM IN = 4.25, 0 I OUT 800mA 1 10 m LM IN = 4.75, 0 I OUT 800mA 1 10 m LM IN = 6.5, 0 I OUT 800mA 1 15 m IN - OUT Dropout oltage I OUT = 100mA (Note 7) I OUT = 500mA I OUT = 800mA I LIMIT Current Limit IN - OUT = 5, T J = 25 C ma Minimum Load Current (Note 8) Quiescent Current LM1117-ADJ IN = ma LM ma IN 15 LM ma IN 15 LM IN ma LM IN ma LM IN ma 60 Thermal Regulation T A = 25 C, 30ms Pulse %/W Ripple Regulation f RIPPLE =1 20Hz, IN - OUT =3 RIPPLE 75 db =1 PP Adjust Pin Current µa Adjust Pin Current Change 10 I OUT 800mA, 1.4 IN - OUT µa Temperature Stability 0.5 % Long Term Stability T A = 125 C, 1000Hrs 0.3 % RMS Output Noise (% of OUT ), 10Hz f 10kHz % Thermal Resistance 3-Lead SOT C/W Junction-to-Case 3-Lead TO C/W 3-Lead TO C/W Thermal Resistance 3-Lead SOT-223 (No heat sink) 136 C/W Junction-to-Ambient 3-Lead TO-220 (No heat sink) 79 C/W (No air flow) 3-Lead TO-252 (Note 9) (No heat sink) 92 C/W 3-Lead TO C/W 8-Lead LLP(Note 10) 40 C/W LM1117/LM1117I 5

6 LM1117/LM1117I LM1117I Electrical Characteristics Typicals and limits appearing in normal type apply for T J = 25 C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 40 C to 125 C. Symbol Parameter Conditions REF Reference oltage LM1117I-ADJ I OUT = 10mA, IN - OUT = 2, T J = 25 C 10mA I OUT 800mA, 1.4 IN - OUT 10 OUT Output oltage LM1117I-3.3 I OUT = 10mA, IN = 5, T J = 25 C 0 I OUT 800mA, 4.75 IN 10 LM1117I-5.0 I OUT = 10mA, IN = 7, T J = 25 C 0 I OUT 800mA, 6.5 IN 12 OUT OUT Line Regulation (Note 6) Load Regulation (Note 6) Min (Note 5) Typ (Note 4) Max (Note 5) Units LM1117I-ADJ I OUT = 10mA, 1.5 IN - OUT % LM1117I-3.3 I OUT = 0mA, 4.75 IN m LM1117I-5.0 I OUT = 0mA, 6.5 IN m LM1117I-ADJ IN - OUT = 3, 10 I OUT 800mA % LM1117I-3.3 IN = 4.75, 0 I OUT 800mA 1 15 m LM1117I-5.0 IN = 6.5, 0 I OUT 800mA 1 20 m IN - OUT Dropout oltage I OUT = 100mA (Note 7) I OUT = 500mA I OUT = 800mA I LIMIT Current Limit IN - OUT = 5, T J = 25 C ma Minimum Load Current (Note 8) Quiescent Current LM1117I-ADJ IN = ma LM1117I-3.3 IN ma LM1117I-5.0 IN ma 60 Thermal Regulation T A = 25 C, 30ms Pulse %/W Ripple Regulation f RIPPLE =1 20Hz, IN - OUT =3 RIPPLE 75 db =1 PP Adjust Pin Current µa Adjust Pin Current Change 10 I OUT 800mA, 1.4 IN - OUT µa Temperature Stability 0.5 % Long Term Stability T A = 125 C, 1000Hrs 0.3 % RMS Output Noise (% of OUT ), 10Hz f 10kHz % Thermal Resistance 3-Lead SOT C/W Junction-to-Case 3-Lead TO C/W Thermal Resistance 3-Lead SOT-223 (No heat sink) 136 C/W Junction-to-Ambient 3-Lead TO-252 (No heat sink)(note 9) 92 C/W No air flow) 8-Lead LLP(Note 10) 40 C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. 6

7 Note 2: The maximum power dissipation is a function of T J(max), θ JA, and T A. The maximum allowable power dissipation at any ambient temperature is P D =(T J(max) T A )/θ JA. All numbers apply for packages soldered directly into a PC board. Note 3: For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF. Note 4: Typical alues represent the most likely parametric norm. Note 5: All limits are guaranteed by testing or statistical analysis. Note 6: Load and line regulation are measured at constant junction room temperature. Note 7: The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100m from the nominal value obtained at IN = OUT Note 8: The minimum output current required to maintain regulation. Note 9: Minimum pad size of 0.038in 2 Note 10: Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22 C. For information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN LM1117/LM1117I Typical Performance Characteristics Dropout oltage ( IN - OUT ) Short-Circuit Current Load Regulation LM1117-ADJ Ripple Rejection

8 LM1117/LM1117I Typical Performance Characteristics (Continued) LM1117-ADJ Ripple Rejection vs. Current Temperature Stability Adjust Pin Current LM Load Transient Response LM Load Transient Response LM Line Transient Response

9 Typical Performance Characteristics (Continued) LM Line Transient Response LM1117/LM1117I Application Note 1.0 External Capacitors/Stability 1.1 Input Bypass Capacitor An input capacitor is recommended. A 10µF tantalum on the input is a suitable input bypassing for almost all applications. 1.2 Adjust Terminal Bypass Capacitor The adjust terminal can be bypassed to ground with a bypass capacitor (C ADJ ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the C ADJ should be less than R1 to prevent the ripple from being amplified: 1/(2π*f RIPPLE *C ADJ ) < R1 The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of Ω. For example, with R1 = 124Ω and f RIPPLE = 120Hz, the C ADJ should be > 11µF. 1.3 Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and ESR (Equivalent Series Resistance). The minimum output capacitance required by the LM1117 is 10µF, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3Ω -22Ω. In the case of the adjustable regulator, when the C ADJ is used, a larger output capacitance (22µf tantalum) is required. 2.0 Output oltage The LM1117 adjustable version develops a 1.25 reference voltage, REF, between the output and the adjust terminal. As shown in Figure 1, this voltage is applied across resistor R1 to generate a constant current I1. The current I ADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA) compared with the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. FIGURE 1. Basic Adjustable Regulator Load Regulation The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 2, shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is obvious that the LOAD is less than the OUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the R LOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. 9

10 LM1117/LM1117I Application Note (Continued) With an extremely large output capacitor ( 1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure FIGURE 2. Typical Application using Fixed Output Regulator When the adjustable regulator is used (Figure 3), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5 regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω xi L. If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. FIGURE 4. Regulator with Protection Diode Heatsink Requirements When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 5. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink FIGURE 3. Best Load Regulation using Adjustable Output Regulator 4.0 Protection Diodes Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of ±25 with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of IN. In the LM1117 regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. R θ JC (Component ariables) Leadframe Size & Material No. of Conduction Pins Die Size Die Attach Material Molding Compound Size and Material R θ CA (Application ariables) Mounting Pad Size, Material, & Location Placement of Mounting Pad PCB Size & Material Traces Length & Width Adjacent Heat Sources olume of Air Ambient Temperatue Shape of Mounting Pad 10

11 Application Note (Continued) LM1117/LM1117I FIGURE 5. Cross-sectional view of Integrated Circuit Mounted on a printed circuit board. Note that the case temperature is measured at the point where the leads contact with the mounting pad surface The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117 must be within the range of 0 C to 125 C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, P D, must be calculated: I IN =I L +I G P D =( IN - OUT )I L + IN I G Figure 6 shows the voltages and currents which are present in the circuit. FIGURE 6. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, T R (max): T R (max) = T J (max)-t A (max) where T J (max) is the maximum allowable junction temperature (125 C), and T A (max) is the maximum ambient temperature which will be encountered in the application. Using the calculated values for T R (max) and P D, the maximum allowable value for the junction-to-ambient thermal resistance (θ JA ) can be calculated: θ JA =T R (max)/p D If the maximum allowable value for θ JA is found to be 136 C/W for SOT-223 package or 79 C/W for TO-220 package or 92 C/W for TO-252 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ JA falls below these limits, a heatsink is required. As a design aid, Table 1 shows the value of the θ JA of SOT-223 and TO-252 for different heatsink area. The copper patterns that we used to measure these θ JA s are shown at the end of the Application Notes Section. Figure 7 and Figure 8 reflects the same test results as what are in the Table 1 Figure 9 and Figure 10 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-223 and TO-252 device. Figures Figure 11 and Figure 12 shows the maximum allowable power dissipation vs. copper area (in 2 ) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages. *Application Note AN-1187 discusses improved thermal performance and power dissipation for the LLP. TABLE 1. θ JA Different Heatsink Area Layout Copper Area Thermal Resistance Top Side (in 2 )* Bottom Side (in 2 ) (θ JA, C/W) SOT-223 (θ JA, C/W) TO

12 LM1117/LM1117I Application Note (Continued) TABLE 1. θ JA Different Heatsink Area (Continued) Layout Copper Area Thermal Resistance *Tab of device attached to topside copper 12

13 Application Note (Continued) LM1117/LM1117I FIGURE 7. θ JA vs. 1oz Copper Area for SOT-223 FIGURE 10. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO FIGURE 8. θ JA vs. 2oz Copper Area for TO-252 FIGURE 11. Maximum Allowable Power Dissipation vs. 1oz Copper Area for SOT FIGURE 9. Maximum Allowable Power Dissipation vs. Ambient Temperature for SOT-223 FIGURE 12. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO

14 LM1117/LM1117I Application Note (Continued) FIGURE 13. Top iew of the Thermal Test Pattern in Actual Scale 14

15 Application Note (Continued) LM1117/LM1117I FIGURE 14. Bottom iew of the Thermal Test Pattern in Actual Scale 15

16 LM1117/LM1117I Typical Application Circuits Adjusting Output of Fixed Regulators Logic Regulator with Electronic Shutdown* Regulator with Reference to 10 Adjustable Regulator with Improved Ripple Rejection 16

17 Typical Application Circuits (Continued) LM1117/LM1117I Battery Backed-Up Regulated Supply Low Dropout Negative Supply

18 LM1117/LM1117I Physical Dimensions inches (millimeters) unless otherwise noted 3-Lead SOT-223 NS Package Number MP04A 18

19 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) LM1117/LM1117I 3-Lead TO-220 NS Package Number T03B 19

20 LM1117/LM1117I Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 3-Lead TO-263 NS Package Number TS3B 20

21 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) LM1117/LM1117I 3-Lead TO-252 NS Package Number TD03B 8-Lead LLP NS Package Number LDC08A 21

22 LM1117/LM1117I 800mA Low-Dropout Linear Regulator Notes LIFE SUPPORT POLICY NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas National Semiconductor Europe Fax: +49 (0) Deutsch Tel: +49 (0) English Tel: +44 (0) Français Tel: +33 (0) National Semiconductor Asia Pacific Customer Response Group Tel: Fax: National Semiconductor Japan Ltd. Tel: Fax: National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

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