Mini ITX Mainboard D2703-S

Transcription

1 Mini ITX Mainboard D2703-S General Information Andreas Ertel, Peter Hoser Augsburg,

2 Agenda FSC Industrial Mainboard Roadmap Supported CPUs & AMD platform and embedded Roadmap D2703-S and Accessories Extended Lifetime and Revision Control Reasonable System Configurations & Field of Applications Competitive Analysis

3 Industrial Mainboards XLT: months extended availability after EOL All mainboards RoHS compliant Series Mainboard Name Chipset Socket 2007 Q4 Q Q2 Q3 Q4 Q Q2 Q3 Q Q1 IP Mini-ITX D2703-S ATI/AMD Socket S1 SA PL 1) IP ATX D2836-S Intel next generation LGA775 PL 2) IP µatx D2831-S Intel next generation LGA775 PL 2) IP ATX D2156-S i945g LGA775 EOL XLT IP µatx D2151-S i945g LGA775 EOL XLT Note: Min. forecast quantity required for XLT 1) Shipments expectedfrom M01/08 2) Launchexpectedfor earlyq4/ P Premium Mainboard ECN Engineering Change Notification V Value Mainboard LAO After Last Assured Order date, orders can only be accepted based upon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO. PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboard in production FSC_Desktop_Mainboard_Roadmap_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

5 Platform Socket S1 Low-Power Processor Longevity Roadmap embedded until end of 2011! embedded until end of 2011!

6 Platform Socket S1 Low-Power Processor Features

7 Embedded Socket S1 Low-Power Processor Longevity Roadmap (Planned) TL-62 TL-56 TL-52 AMD Turion 64 Mobile Processors Tyler 2.1GHz 35W Socket S1 Dual-Core Processor Tyler 1.8GHz 31W Socket S1 Dual-Core Processor Tylor 1.6GHz 31W Socket S1 Dual-Core Processor Mobile AMD Sempron Processors Sherman 2.0GHz 25W Socket S1 Single-Core Processor Keene 1.8GHz 25W Socket S1 Single-Core Processor AMD Sempron Processors Keene -9W 1.0GHz Lidless Socket S1 Sherman -1.0GHz 8W Lidless Socket S1 Single-Core Processor Production ACN to announce EOL Last Orders through Last Time Ship Two year contractual extension possible For detailed ordering information, please refer to applicable ACN/EOL notification distributed by AMD Business Operations.

8 Embedded Socket S1 Low-Power Processor Features

9 AMD Embedded Client Chipset Production Schedule Model DVT Sample Availability Production Availability ACN to Announce EOL Last Orders Last Ship OPN Code Part Marking M690T Now Q Q Q Q CG TQA6AVA12FG M690E Oct 2007 Q Q Q Q CG EVA6CVA12FG SB600 Now Q Q Q Q CG S6ECLA21FG Note: Embedded components offer 5 year longevity with the option of purchasing an extended 2-year supply (via contract) beyond the standard 5 year offering.

11 D2703-S based on ATI M690E / SB600 Mobile Chipset Specification Mini-ITX for Industrial Applications, up to 60 C AMD Mobile Socket S1g1 o AMD Mobile Turion 64 X2 / Sempron o Up to 35W; HyperTransport 1-800MHz DDR2 800/667 SDRAM, Dual Channel, 2 x SO socket ATI Radeon X1250 graphics; VGA / DVI & LVDS support (up to 256MB) 1 x PCI, 1 x PCIe x1, 1 x CF, 8 x USB 2.0, 4 x SATA 300 / RAID, 1 x IDE Dual LAN 10/100/1000Mbit, High Definition Audio, Firewire 24V DC (via internal connector or external AC adapter) or internal ATX Power Supply 11 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

12 DVI / VGA Splitter Cable T26139-Y3957-V201 Specification Simultaneous use of DVI- and VGA monitor via DVI-I connector of D2703 Cable length 150mm (DVI output) 220mm (VGA output) Notes: DDC data only possible for DVI monitor! 12 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

13 DVI-I / VGA Adapter Plug Ordercode CFO:AD-005-E-ROHS Specification Direct connection of VGA monitor to DVI-I output of mainboard D2703 Adapter length: 45mm 13 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

14 Heatsink / Fan for AMD Mobile Ordercode C26361-D6000-C100 Specification Aluminium heatsink with mounting backplate for mainboard D2703 Supports AMD socket S1, up to 35W Fan 60mm, ball bearing, max rpm Connector 4pin PWM, cable length 50mm Sound level 20 db(a) 46 db(a) max. MTBF ~ hrs 14 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

15 Heatsink (Fanless Design) for AMD Mobile Ordercode V26898-B883-V1/V10 Specification Aluminium heatsink with mounting backplate for mainboard D2703 Supports AMD socket S1 Designed for Sempron (max. 9W) Note: B883-V1 = Heatsink; B883-V10 = mounting backplate 15 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

19 Extendend (XLT) lifetime at a glance up to 5 years standard lifecycle 3 month XLT Period up to 3 years LAO EOL up to 2 years XLT Period up to 2 years quarterly price lists LAO Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Customer A Customer B Customer C unbinding forecast MOQ 500pcs price binding forecast if e.g. a component is going to be discontinued example

20 ECN and ECN+ Process at a glance Engineering Change Notification D2703 S11 GS1 Name Version Revision Name: remains the same throughout the complete lifecycle Version: changes only, if the feature set is changing Revision: can change more often, because of technical improvements Every customer has to decide in advance whether he wants to participate or not Start MP D2703-S11-GS1 ship samples max. 4 weeks of testing GS1 GS2 GS2 LAO GS3 old GS or S21 GS3 ECN to GS2 minor change announced via start shipping immediately ECN+ to GS3, or from S11 to S21 major change announced via start shipping after customer approval

22 Reasonable Fields of Application for mini-itx and D2703-S Industrial Systems Business Systems Consumer Systems Industrial PC KIOSK POS, POI, 1U Entry Server Thin Clients Car PC Home Server Digital Signage Lifestyle PC Gaming Cubes Gaming Cabinets Media Center Medical Systems

23 Reasonable System Configurations fanless low power solutions fanless mid performance solutions standard mid -high performance solutions mainboard D2703-S RAM SO-DIMM 256MB - 8GB, Single Channel or Dual Channel DDR2 800/667 SDRAM, unbuffered, no ECC CPU case Standard mini ITX chassis Mobile Sempron TDP: 8W mini ITX chassis with heat pipe technology Mobile Sempron / / TDP: W or Turion TL-56 TL68 TDP: W Standard mini ITX chassis cooling passive heat sink by FSC heatpipe solution adopted to D2703-S active heat sink with PWM fan by FSC PSU external AC adapter (24V) or internal fanless PSU D2703-S does not require a DC-to-ATX convertor internal ATX PSU

24 Overview Chassis for mini ITX this is only a small overview on vendors of mini ITX chassis. FSC does not guarantee the mechanical fit of its mainboards D2703-S/A. Furhtermore FSC does not take any reliability on the products provided by the named vendors. We kindly recommend to check first before purchase!. Sophie Chen [[email protected]] Jaromir Bajgar EMKO Case A.G. Jaromir Bajgar [[email protected]] contact: AOpen HQ Ms. Claire Shieh Tel: Mail: [email protected] Dana Linde SilverStone Technology GmbH Tel : /MSN: [email protected] Tze Chiew Chenbro Europe BV Tel: Ext Contact person: Amy Lai [[email protected]]

25 Overview 24V AC Adapter suitable for D2703-S under construction

27 The miniitx Motherboard Market - Platforms Performance + acceptable power consumption (approx. 35Watt TDP) + dozens of vendors with a wide portfolio + high performance due to DualCore technology o platform costs vary, depending on configuration + low power consumption (9 25 Watt TDP) + dozens of vendors with a wide portfolio o platform costs vary, depending on configuration o good performance, due to state of the art technology D201GLY2AT + very low platform costs (~60 USD CPU+MB) o acceptable performance (1200 Mhz) o acceptable power consumption (27 Watt TDP) - BGA CPU not scaleable -limited expandability and functionality + low power consumption (3,1-20 Watt TDP) + inexpensive platform costs (~100 USD CPU+MB) + dozens of vendors with a wide portfolio oacceptable performance (from Mhz) + very low power consumption (0,8-5,1 Watt TDP) + very low platform costs (approx. 40 USD CPU+CS) o companion solution (CPU integrated in Chipset) - low performance (from Mhz) 40$ 60$ $ $ 250$ -?? Price

28 Competition Positioning Matrix Fujitsu Siemens Computers Albatron Albatron Axxtend Technology KINO KINO Kontron WINMATE D2703-S KI51PV-754 KI690-AM2 Eagle III ( ASIS-6030 ) MI930/F KINO-690AM2 KINO-690S1 KT690/mITX A270 Chipset AMD M690E/SB600 NVIDIA C51PVG/nForce 430 AMD M690T/SB600 SiS 771CX/966 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600 CPU AMD Turion 64 X2,AMD Turion 64,AMD Sempron Mobile AMD Athlon 64, AMD Turion 64, AMD Sempron Mobile AMD Athlon 64, AMD Athlon 64 X2 AMD Turion 64 X2, AMD Sempron Mobile AMD Athlon 64 X2, AMD Athlon 64 AMD Athlon 64, AMD Athlon 64 X2 AMD Turion 64 X2, AMD Turion 64, AMD Sempron Mobile AMD Turion 64 X2,AMD Turion 64,AMD Sempron Mobile Sockel S1 754 AM2 S1 S1 AM2 S1 S1 AM2 Power Consumption max. 24V/5A 35 Watt 90 Watt [email protected], [email protected] [email protected], [email protected] Input Voltage 12V internal or 24V DC 12V ATX 12V ATX ATX ATX 20 PINs 5V/12V AT/ATX 5V/12V AT/ATX ATX ATX external ATX Mechanical Humidity 5-95% 10-90% 10-90% 0-90% 10-90% 5-95% 5-95% 10-90% op.temp MTBF Shock: 11ms Vibration: 1g (rms - 5 ~ 500Hz) Memory SODIMM DIMMM SODIMM SODIMM DIMM DIMM SODIMM DIMM DIMM max 8 GB 2GB 2GB 2GB 4 GB 2 GB 2 GB 32 GB 2 GB Flash Compact Flash Type II 4GB IDE Compact Flash Type II 4GB Compact Flash Type II AMD Athlon 64, AMD Athlon 64 X2 Display CRT 1600x x1024 yes 1600x x x x x x1440 LCD/DVI 2048x x x x x x x x1600 LVDS 2048x x x x /24 Bit, Dual Channel Dual Channel 18/24 Bit Dual Channel Dual Channel Dual Channel, 24-bit TV-Out NTSC, S-Video NTSC, PAL, SCART, HD, Component, Composite S- Video NTSC, PAL, SCART, S-video HD HD S-Video (optional) - LAN 2 x GbLAN 1 x 10/ x GbLAN 1 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN Typ Realtek RTL8111C Broadcom Marvell Marvell + SIS966 Marvell Broadcom Broadcom Realtek RTL 8111B Realtek Input/Output USB PS/ Audio Digital AC97, HD Audio, S/PDIF In S/PDIF in /out HD-Audio, S/PDIF in /out HD Audio, S/PDIF Out HD Audio AC97 AC97 HD Audio AC97 Analog Line In, Line Out Line Out Line Out Line Out, HS (Headset), Line In, MIC Line Out, L&R out, Center/LFE, Line Out, HS (Headset), Line Line Out, HS (Headset), Line Line Out, Line In, MIC Line Out, Line In, MIC Line In, CD in, MIC In In COM 1 x ext 1 x ext 1 x ext 1 x ext 2 x ext RS232 2 x ext RS232 2 x int RS232 2 x ext RS232 1 x int 1 x int 2 x int 1 x ext RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485 LPT 1 x int (Pinheader) 1 x int RS232 1 x int RS232 1 x int RS232 Digital I/O 8 Channel 8 Channel GPIO 8 Channel GPIO 8 Channel GPIO 8 Channel GPIO 8 Channel Slots Drives PCI Mini PCI 1 PCI x PCI x16 1 (used as x8) Mini PCI x1 1 1 PATA SATA SATA Raid 0,1,0+1 0,1,0+1,5 0,1,0+1 0,1,0+1 0,1,10 0,1,10 0,1,0+1 Floppy 1 shared with LPT Pinheader SW Windows XP/XPe, Redhat Linux, Linux, Windows Vista, Other Windows XP/XPe Windows XP/XPe Windows XP, Linux Windwos XP/XPe, WindowsServer 2003, Redhat Linux, Windows Vista, Linux Terminal Windows XP Windows CE, Winodws XP/Xpe Winodws XPe, Windows XP/XPe, Linux, Windows XP, Windows Vista, VxWorks, Other Windows XP/XPe, Windows Vista Others Longlife components for 24/7 Supports HDTV 720i and 1080i HDMI Connector Supports 2D/3D engine and MPEG-2/1 4 video Port decoder RS232 expansion with Dual Independant Display VGA AND DVI on I/O daughter board Support Full revision control SCART header x 1 Battery Lithium 3V/220 mah TPM onbaord Extended Lifetime up to 5 years AMD XPC header for AMD XPC module Tin-plated PCB

29 Main Competitors D2703-S KINO690S1 KT690/mITX + 24 V DC IN + FW 1394b cost savingsfor not required AC-to-ATX convertor board: ~ 30 -no DC IN -no FW x COM + HDTV Out -no Raid?? -no DC IN -no FW TV Out S-Video + TPM

30 Agenda FSC Industrial Mainboard Roadmap Supported CPUs & AMD platform and embedded Roadmap D2703-S and Accessories Extended Lifetime and Revision Control Reasonable System Configurations & Field of Applications The MiniITX Market Summary

31 Summary -Advantages using the D2703-S Start with a brand new product leads to a, at least 3 year, stable platform strategy With Extended Lifetime up to 5 years of availability possible Scalable AMD platform opens the opportunity to use Images on different solutions Functionality headroom (LVDS, Firewire, CF usw.) for other applications Bundle opportunities with different AMD embedded CPUs Committed Revision Control Process for early announcements of technical changes Direct technical support contact with all clients

32 Mini ITX Mainboard D2703-A General Information Andreas Ertel, Peter Hoser Augsburg,

33 Agenda FSC AMD Desktop Mainboard Roadmap Comparison sheet between D2703-S and D2703-A D2703-A and Accessories

34 Mainboards for AMD processors All mainboards RoHS compliant Mainboard Q1/08 Q2/08 Q3/08 Q4/08 Update Update Update Series V µbtx V µbtx V µbtx Name D2721-A D2721-H 1) D2461-C Chipset nvidia MCP78B nvidia MCP78B nvidia C51PVG Socket AM2+ AM2+ AM2 RAM 4x DDR2 4x DDR2 4x DDR2 VGA PCIe x16 & on Board PCIe x16 & on Board PCIe x16 & on Board 1 2 SA SA 3 PL 2) PL LAO 4 EOL Mini-ITX Thin Client Mainboard -For Projects only - V M-ITX D2703-A 3) ATI M690T AMD S1 1x SO VGA/DVI PL 1) Dedicated model forwebhosting Applications (e.g. Dual Gbit LAN onboard, full AMD Opteron 12xx/13xx Support) 2) Shipment expected from early 03/2008 3) Note: Mainboard will be provided w/o I/O shield, appropriate aperture in housing required! 34 P Premium Mainboard ECN Engineering Change Notification V Value Mainboard LAO After Last Assured Order date, orders can only be accepted based upon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO. PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboard in production FSC_Desktop_Mainboard_Roadmap_2008_01_V1 01/2008 Fujitsu Siemens Computers 2008 All rights reserved

36 Feature Overview mini-itx D2703 Designed for Industrial Applications ( 24/7; up to 60 C) Designed for Thin Client Applications (8/5; fanless) PCB: tin plating ATX I/O-Shield provided by FSC D2703-S Industrial x -- x x D2703-A Thin CLient -- x ) Processor support SO DIMM socket DDR2/667 Single DC power supply option Standard ATX power supply option Processor fan support (4 pin PWM) Chassis fan support (4 pin PWM) PCI slot PCIe X1 slot SATA II onboard SATA II RAID-support (0, 1, 0+1) IDE onboard (e.g. for slimline optical drives) CF connector onboard GbitLAN onboard (Realtek) USB 2.0 onboard (internal connector) 2) USB 2.0 (external, front connector) USB 2.0 (external, rearconnector) Sempron / Turion, DualCore, up to 35W 2 / Dual Channel +24V / 5A x 1 2 x 1 x 1 x 4 x x 1 x (one drive) 1 x 2 x 2 x -- 4 x Sempron, Single Core, max. 9W 1 / Single Channel +19V / 4A x x 1 x 1 x 2 x 4 x

37 Feature Overview mini-itx D2703 Frontpanel audio connector Microphone / Headphone (external, front connector) S/PDIF out onboard Firewire connector internal / external Stereo Audio / Multichannel Audio COM connectorexternal COM connectorinternal General Purpose I/O (8 Bit, internal connector) Frontpanel (FP) connector (internal, 10 pin Intel-compliant) Power switch (internal connector) Power LED / HDD LED (internal connector) LVDS support onboard (dual channel, internal connector) LVDS backlightinverter support (internal connector) Floppy support (internal connector) Parallel Interface support (internal / external connector) TV out support (internal / external connector) Trusted Platform Module TPM V1.2 Mini-PCIe ( Mini-Card ) support D2703-S Industrial x -- / -- 1 x 1 x / 1 x x / -- COM1 COM2 1 x 1 x via FP connector via FP connector 1 x 1 x / / -- stuffing option stuffing option D2703-A Thin CLient -- 1 x / 1 x / -- x / -- COM1, COM x / / -- stuffing option -- 1) Note: Required size extends standard ATX dimension; Chassis must provide required apertures 2) Note: Two channels per connector

39 Specification D2703-A based on ATI M690E / SB600 Mobile Chipset Mini-ITX Thin Client AMD Mobile Socket S1g1 o AMD Mobile Low-Power Sempron Processor o Max. 9W; HyperTransport 1-800MHz DDR2 667 SDRAM, 1 x SO socket ATI Radeon X1250 graphics; VGA & DVI support (up to 256MB) 1 x PCI, 1 x CF for Embedded OS, 8 x USB 2.0 LAN 10/100/1000Mbit, High Definition Audio 19V DC Power Supply (via AC adapter) Designed for fanless operation 39 FSC_Desktop_Mainboard_Details_2008_01_V1 01/2008 Fujitsu Siemens Computers 2008 All rights reserved

40 Proprietary I/O Layout of D2703-A The I/O layout of D2703-A is not fully compliant to ATX standard and therefore requires a proprietary solution for the chassis. standard format of an ATX compliant I/O shield does not cover the COM 2 connector

41 19V AC Adapter suitable for D2703-A S26113-E519-V15 Specification Released for mainboard D2703-A (not suitable for D2703-S which strictly requires 24V!) (20V, 3.25A, 65W) power chords: o EU version: T26139-Y2540-V100-*-Z111 o UK version: T26139-Y2540-V200-*-Z FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved

42 Heatsink (Fanless Design) for AMD Mobile Ordercode V26898-B883-V1/V10 Specification Aluminium heatsink with mounting backplate for mainboard D2703 Supports AMD socket S1 Designed for Sempron (max. 9W) Note: B883-V1 = Heatsink; B883-V10 = mounting backplate 42 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 Fujitsu Siemens Computers 2007 All rights reserved