TESLA C2075 COMPUTING PROCESSOR BOARD

Transcription

1 TESLA C2075 COMPUTING PROCESSOR BOARD BD _v02 September 2011 Board Specification

2 DOCUMENT CHANGE HISTORY BD _v02 Version Date Authors Description of Change 01 July 25, 2011 MC, SM Initial Release 02 September 9, 2011 MC, SM Updated Thermal Qualification Summary section Updated Table 10 in the Cooling Solution Section Computing Processor Board BD _v02 ii

3 TABLE OF CONTENTS Overview... 1 Key Features... 1 Computing Processor Description... 3 Configuration... 4 Mechanical Specifications... 5 PCI Express System... 5 Standard I/O Connector Placement... 6 DVI Connector... 7 Internal Connectors and Headers... 8 External PCI Express Power Connectors Pin Fan Connector Power Specifications Power by Rail Thermal Specifications Thermal Qualification Summary Cooling Solution Support Information Certificates and Agencies Agencies languages Computing Processor Board BD _v02 iii

4 LIST OF FIGURES Figure 1. Block Diagram... 3 Figure 2. Computing Processor Board... 5 Figure 3. Bracket... 6 Figure 4. DVI-I Connector... 7 Figure 5. 6-Pin PCI Express Power Connector... 9 Figure 6. 8-Pin PCI Express Power Connector Figure 7. 4-Pin Fan Connector LIST OF TABLES Table 1. Board Configuration... 4 Table 2. DVI-I Connector Pinout... 7 Table 3. 6-Pin PCI Express Power Connector Pinout Table 4. 8-Pin PCI Express Power Connector Pinout Table 5. 4 Wire Thermal Control Pinout Table 6. Configuration with External PCI Express Connectors Table 7. Power by Rail Table 8. Test Setup and Configuration Table 9. Sample Thermal Results and Specifications Table 10. Environmental Specifications and Conditions Table 11. Languages Supported Computing Processor Board BD _v02 iv

5 OVERVIEW The NVIDIA Tesla C2075 computing processor board is a PCI Express 2.0 full-height (4.376 inches by 9.75 inches) form factor computing add-in card based on the NVIDIA Tesla T20A graphics processing unit (GPU). This board is targeted as high-performance computing (HPC) solution for PCI Express systems. The is capable of running 515 GFLOPs per second of double precision processing performance. The and comes standard with 6 GB of GDDR5 memory. The can be configured by the end user to enable or disable ECC or error correcting codes that can fix single-bit errors and report double-bit errors. Enabling ECC will cause some of the memory to be used for the ECC bits so the user available memory will decrease to 5.25 GB. KEY FEATURES GPU Number of processor cores: 448 Processor core clock: 1.15 GHz Voltage: mv to 975 mv Package size: 42.5 mm 42.5 mm 1981-pin ball grid array (BGA) Computing Processor Board BD _v02 1

6 Overview Board Twelve layers printed circuit board (PCB) PCI Express Gen2 16 system interface Physical dimensions: inches 9.75 inches, dual slot Board power dissipation: less than or equal to 215 W External Connectors Single port, dual-link DVI-I Internal Connectors and Headers One 6-pin PCI Express power connector One 8-pin PCI Express power connector 4-pin fan connector Memory Memory clock: 1.50 GHz Interface: 384-bit 6GB 24 pieces 64M 32 GDDR5 136-pin BGA, SDRAM BIOS 2Mbit Serial ROM Computing Processor Board BD _v02 2

7 Overview COMPUTING PROCESSOR DESCRIPTION Figure 1 is a block diagram of the computing processor. Figure 1. Block Diagram Computing Processor Board BD _v02 3

8 Overview CONFIGURATION There is one configuration available (Table 1) for the board. Table 1. Board Configuration Specification Description Generic SKU reference Chip Package size GPU Processor clock Memory clock Memory size Memory I/O Memory configuration External connectors Internal connectors and headers Board power Thermal cooling solution Tesla T20A GPU 42.5 mm x 42.5 mm 1.15 GHz 1.50 GHz 6 GB 384-bit GDDR5 24 pcs 64M 32 GDDR5 SDRAM Single port, dual-link DVI-I 8-pin PCI Express power connector 6-pin PCI Express power connector 4-pin fan connector < = 215 W Custom active fan sink Computing Processor Board BD _v02 4

9 MECHANICAL SPECIFICATIONS PCI EXPRESS SYSTEM The computing processor board (Figure 2) conforms to the PCI Express full height (4.376 inches by 9.75 inches) form factor inches inches Figure 2. Computing Processor Board Computing Processor Board BD _v02 5

10 Mechanical Specifications STANDARD I/O CONNECTOR PLACEMENT As shown in Figure 3, the includes a single, dual-link DVI-I connector. Dual-link DVI-I Figure 3. Bracket Computing Processor Board BD _v02 6

11 Mechanical Specifications DVI CONNECTOR The computing processor board supports a dual-link DVI-I combined analog and digital interface described in Table 2. Figure 4. DVI-I Connector Table 2. DVI-I Connector Pinout Pin Signal Pin Signal 1 TMDS data 2-13 TMDS data 3+ 2 TMDS data VDC power 3 TMDS data 2/4 shield 15 Ground (Return for +5) 4 TMDS data 4-16 Hot plug detected 5 TMDS data TMDS data 0-6 DDC clock 18 TMDS data 0+ 7 DDC data 19 TMDS data 0/5 shield 8 Analog vertical sync 20 TMDS data 5-9 TMDS data 1-21 TMDS data TMDS data TMDS clock shield 11 TMDS data 1/3 shield 23 TMDS clock+ 12 TMDS data 3-24 TMDS clock- C1 Analog red C4 Analog horizontal sync C2 Analog green C5 Analog ground C3 Analog blue (RGB return) Computing Processor Board BD _v02 7

12 Mechanical Specifications INTERNAL CONNECTORS AND HEADERS The module supports the following internal connectors and headers. 8-pin PCI Express power connector 6-pin PCI Express power connectors 4-pin fan connector External PCI Express Power Connectors The computing processor board is a performance-optimized, high-end product and utilizes power from the PCI Express connector as well as external power connectors. The board can be used in two different ways. Dual 6-pin PCI Express power connectors or One 8-pin PCI Express power connector Figure 5 and Figure 6 show the specifications and Table 3 and Table 4 show the pinouts for the 6-pin and 8-pin PCI Express power connectors. Computing Processor Board BD _v02 8

13 Mechanical Specifications Figure 5. 6-Pin PCI Express Power Connector Computing Processor Board BD _v02 9

14 Mechanical Specifications Figure 6. 8-Pin PCI Express Power Connector Computing Processor Board BD _v02 10

15 Mechanical Specifications Table 3. 6-Pin PCI Express Power Connector Pinout Pin Number Description V V V 4 GND 5 Sense 6 GND Table 4. 8-Pin PCI Express Power Connector Pinout Pin Number Description V V V 4 Sense1 5 GND 6 Sense0 7 GND 8 GND Computing Processor Board BD _v02 11

16 Mechanical Specifications 4-Pin Fan Connector The computing processor board uses a 4-pin fan to control the fan speed of the thermal solution. The details of the connector (P/N: PH-T-4) are given in Figure 7. This part is a 2.0 mm (0.079") pitch disconnectable connector. Table 5 lists the pin assignments for this connector. Figure 7. Table 5. 4-Pin Fan Connector 4 Wire Thermal Control Pinout Pin Number Description V V V 4 Sense1 Computing Processor Board BD _v02 12

17 POWER SPECIFICATIONS The computing processor is a performance-optimized, high-end board solution. Power is taken from the PCI Express host bus as well as the 8-pin and the 6-pin PCI Express power connectors. Without auxiliary power provided to the computing processor board, the board will boot at reduced power and functionality and LED lights on the board will light up as listed in Table 6. This table outlines the different possible scenarios as well as the resulting behaviors. Table 6. Configuration with External PCI Express Connectors 8-Pin Power Connector Connected (either 8-pin or 6- pin) 6-Pin Power Connector Connected Result Full power LED light on the bracket is GREEN by default 8-pin connected Not connected Full power LED light on the bracket is GREEN by default 6-pin connected Not connected LED light is RED board will display warning banner to the user Not connected Connected LED light is RED board will display warning banner to the user Not connected Not connected LED light is RED board will display warning banner to the user Computing Processor Board BD _v02 13

18 Power Specifications POWER BY RAIL Table 7 lists the power by rail numbers for the computing processor board. Power by rail measurements are worst case scenarios per rail while maximum TDP power is based on our worst case power application. Table 7. Power by Rail PEX12V PEX3V3 EXT12V (6-Pin) EXT12V (8-Pin) Total Board Power <= 36 W < = 3 W < = 78 W < = 106 W Less than or equal to 215 W Computing Processor Board BD _v02 14

19 THERMAL SPECIFICATIONS THERMAL QUALIFICATION SUMMARY The information contained in this summary report is intended to provide users of the computing processor with thermal information necessary to assist in thermal management efforts. This information is not intended to provide a specific thermal management solution. However, it does show an approach that result in the reliable operation of the. Note: The ambient air temperature around the inlet of the GPU fan should never exceed 45 C. The product and cooling solutions used are: Device product: computing processor board Thermal test application: DGEMM Result Under the operating described in the following tables, the passed thermal qualifcation. As previously reported, the draws a maximum of 215 W using DGEMM as the TDP application. In cases where an application draws more than 215 W, the will cap power usage at 225 W in all cases. Computing Processor Board BD _v02 15

20 Thermal Specifications Table 8. Test Setup and Configuration System Part Configuration PC Motherboard attached to a chassis frame entire unit placed in an acrylic box Motherboard Power supply CPU SDRAM PC operating system GPU computing processing board GIGABYTE EX58-UD3R / Intel x58 SBIOS: F1 SliverStone SST-ST W Intel Core i7 965 at 3.20 GHZ DDR MHz 12 GB (3 x 4 GB) Linux Cent operating system 64-bit BIOS Display driver GPU Clock speed Tesla T20A 1.15 GHz (core) 1500 MHz (mclk) Table 9. Sample Thermal Results and Specifications Test Application T junction ( C)* T A ( C)** Test 1: Dgemm GPU junction maximum temperature specification Thermal slowdown: 100 At any ambient temperature under any operating conditions Thermal shutdown: 105 * Junction temperature is reported by NVIDIA thermal sensor ** Ambient air temperature average of 3 sensors positioned at the inlet to the GPU fan Computing Processor Board BD _v02 16

21 Thermal Specifications COOLING SOLUTION NVIDIA will utilize a Cooler Master active fan sink to cool the GPU, memories and power components. For environmental specifications refer to Table 10. Table 10. Environmental Specifications and Conditions Specifications Conditions Acoustic noise 25 to 37 db A Storage temperature -40 C to 75 C Storage humidity 5% to 95% RH Computing Processor Board BD _v02 17

22 SUPPORT INFORMATION CERTIFICATES AND AGENCIES Agencies Australian Communications Authority and Radio Spectrum Management Group of New Zealand (C-Tick) Bureau of Standards, Metrology, and Inspection (BSMI) Conformité Européenne (CE) Federal Communications Commission (FCC) Industry Canada - Interference-Causing Equipment Standard (ICES) Korean Communications Commission (KCC) Underwriters Laboratories (cul) Voluntary Control Council for Interference (VCCI) Computing Processor Board BD _v02 18

23 Support Information LANGUAGES Table 11. Languages Supported Windows XP Windows Vista Windows 7 English (US) X X X English (UK) X X X Arabic X X X Chinese, Simplified X X X Chinese, Traditional X X X Czech X X X Danish X X X Dutch X X X Finnish X X X French X X X French (Canada) X X X German X X X Greek X X X Hebrew X X X Hungarian X X X Italian X X X Japanese X X X Korean X X X Norwegian x x x Portuguese (Brazil) X X X Portuguese X X X (European/Iberian) Russian X X X Slovak X X X Slovenian X X X Spanish X X X Swedish X X X Thai X X X Turkish X X X Computing Processor Board BD _v02 19

24 Notice ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS, AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, MATERIALS ) ARE BEING PROVIDED AS IS. NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY, OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE. Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. No license is granted by implication of otherwise under any patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all other information previously supplied. NVIDIA Corporation products are not authorized as critical components in life support devices or systems without express written approval of NVIDIA Corporation. HDMI HDMI, the HDMI logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC. ROVI Compliance Statement NVIDIA Products that support Rovi Corporation s Revision 7.1.L1 Anti-Copy Process (ACP) encoding technology can only be sold or distributed to buyers with a valid and existing authorization from ROVI to purchase and incorporate the device into buyer s products. This device is protected by U.S. patent numbers 6,516,132; 5,583,936; 6,836,549; 7,050,698; and 7,492,896 and other intellectual property rights. The use of ROVI Corporation's copy protection technology in the device must be authorized by ROVI Corporation and is intended for home and other limited pay-per-view uses only, unless otherwise authorized in writing by ROVI Corporation. Reverse engineering or disassembly is prohibited. OpenCL OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. Trademarks NVIDIA, the NVIDIA logo, NVIDIA nforce, and Tesla are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. Copyright 2011 NVIDIA Corporation. All rights reserved.