APPLICATIO S TYPICAL APPLICATIO. LT6000/LT6001/LT6002 Single, Dual and Quad, 1.8V, 13µA Precision Rail-to-Rail Op Amps FEATURES DESCRIPTIO

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1 FEATRES Ideal for Battery-Powered Applications Low Voltage:.V to V Operation Low Current: µa/amplifier Max Small Packages: DFN, MSOP, SSOP Shutdown to.µa Max (LT, LTDD) Low Offset Voltage: µv Max Rail-to-Rail Input and Output Fully Specified on.v and V Supplies Operating Temperature Range: C to C Single Available in DFN Dual Available in MSOP and DFN Quad Available in SSOP and DFN APPLICATIO S Gas Sensing Portable Instrumentation Battery- or Solar-Powered Systems Low Voltage Signal Processing Micropower Active Filters DESCRIPTIO LT/LT/LT Single, Dual and Quad,.V, 3µA Precision Rail-to-Rail Op Amps The LT /LT/LT are single, dual and quad precision rail-to-rail input and output operational amplifiers. Designed to maximize battery life in always-on applications, the devices will operate on supplies down to.v while drawing only 3µA quiescient current. The low supply current and low voltage operation is combined with precision specifications; input offset is guaranteed less than µv. The performance on.v supplies is fully specified and guaranteed over temperature. A shutdown feature available in the LT and the -lead dual LT version can be used to extend battery life by allowing the amplifiers to be switched off during periods of inactivity. The LT is available in a tiny, dual fine pitch leadless DFN package. The LT is available in the -pin MSOP package; a -lead version with the shutdown feature is available in DFN package. The quad LT is available in the -pin SSOP package and the -pin DFN package. These devices are specified over the commercial and industrial temperature range., LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATIO OXYGEN SENSOR CITY TECHNOLOGY X() V E Ω V S k k V E k Micropower Oxygen Sensor V S / LT TAa / LT 33Ω V OT = V IN AIR, V WITHOT OXYGEN 33Ω V S =.V I SPPLY = µa IN AIR, µa WITHOT OXYGEN SPPLY CRRENT PER AMPLIFIER (µa). Start-p Characteristics Supply Current vs Supply Voltage A V = V CM =.V T A = C T A = C TOTAL SPPLY VOLTAGE (V) TAb fa

2 LT/LT/LT ABSOLTE AXI RATI GS W W W (Note ) Total Supply Voltage (V to V )... V Input Current... ±ma SHDN Pin Voltage (Note 7)... V to V Output Short Current Duration (Note )... Indefinite Operating Temperature Range (Note 3)... C to C Specified Temperature Range (Note )... C to C Junction Temperature... C W PACKAGE/ORDER I FOR ATIO Junction Temperature (DFN Packages)... C Storage Temperature Range... C to C Storage Temperature Range DFN Packages... C to C Lead Temperature (Soldering, sec) MSOP, SSOP Packages... 3 C TOP VIEW TOP VIEW SHDN IN IN 3 ORDER PART NMBER LTCDCB LTIDCB V V OT DCB PACKAGE -LEAD (mm 3mm) PLASTIC DFN T JMAX = C, θ JA = C/W (NOTE ) EXPOSED PAD (PIN 7) IS CONNECTED TO V (PIN ) 7 DCB PART MARKING* LCDM LCDM OT A IN A IN A V 3 ORDER PART NMBER LTCMS LTIMS TOP VIEW V 7 OT B IN B IN B MS PACKAGE -LEAD PLASTIC MSOP T JMAX = C, θ JA = C/W MS PART MARKING* LTBVD LTBVD OT A IN A IN A V NC V 9 OT B 3 IN B 7 IN B SHDN DD PACKAGE -LEAD (3mm 3mm) PLASTIC DFN T JMAX = C, θ JA = C/W (NOTE ) EXPOSED PAD (PIN ) IS CONNECTED TO V (PIN ) ORDER PART NMBER LTCDD LTIDD DD PART MARKING* LBVH LBVH OT A IN A IN A V IN B IN B OT B NC 3 7 A B ORDER PART NMBER LTCGN LTIGN TOP VIEW OT D IN D D IN D 3 V IN C C IN C OT C 9 NC GN PACKAGE -LEAD NARROW PLASTIC SSOP T JMAX = C, θ JA = 3 C/W GN PART MARKING I OT A IN A IN A V IN B IN B OT B NC 3 7 DHC PACKAGE -LEAD (mm 3mm) DFN T JMAX = C, θ JA = C/W (NOTE ) EXPOSED PAD (PIN 7) IS CONNECTED TO V (PIN 3) ORDER PART NMBER LTCDHC LTIDHC A B TOP VIEW 7 D C OT D IN D IN D 3 V IN C IN C OT C 9 NC DHC PART MARKING* Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: *Temperature grades are identified on the shipping container. Consult LTC Marketing for parts specified with wider operating temperature ranges. fa

3 LT/LT/LT ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full specified temperature range, otherwise specifications are. V S =.V, V, V CM = V OT =.V. For the LT and the LTDD, V SHDN = V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX NITS V OS Input Offset Voltage LTMS µv C T A 7 C µv C T A C 9 µv LTDCB, LTDD, LTGN 7 µv C T A 7 C µv C T A C µv LTDHC 3 9 µv C T A 7 C µv C T A C 3 µv V CM = V LTMS µv 3 µv V CM = V LTDCB, LTDD, LTGN µv µv V CM = V LTDHC 3 µv 7 µv V OS / T Input Offset Voltage Drift (Note ) V CM =.V µv/ C I B Input Bias Current V CM =.V na V CM = V na V CM = V na I OS Input Offset Current V CM =.V. na V CM = V. na V CM = V. na Input Noise Voltage.Hz to Hz. µv P-P e n Input Voltage Noise Density f = khz 7 nv/ Hz i n Input Current Noise Density f = khz fa/ Hz R IN Input Resistance Common Mode (V CM = V to.v) 3. GΩ Differential MΩ C IN Input Capacitance pf CMRR Common Mode Rejection Ratio V CM = V to.v, C T A 7 C 9 db V CM =.V to.v, C T A C 9 db V CM = V to.v 7 db Input Voltage Range. V PSRR Power Supply Rejection Ratio V S =.V to V db V CM = V O =.V Minimum Supply V CM = V O =.V. V A VOL Large-Signal Gain V O =.V to.v R L = k to GND V/mV R L = k to GND V/mV R L = k to GND V/mV R L = k to GND V/mV V OL Output Swing Low (Note ) Input Overdrive = 3mV No Load 3 mv I SINK = µa mv V OH Output Swing High (Note ) Input Overdrive = 3mV No Load 3 mv I SORCE = µa mv R L = k to GND mv fa 3

4 LT/LT/LT ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full specified temperature range, otherwise specifications are. V S =.V, V, V CM = V OT =.V. For the LT and the LTDD, V SHDN = V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX NITS I SC Short-Circuit Current Short to GND ma C T A 7 C ma C T A C. ma Short to V.7 ma C T A 7 C. ma C T A C. ma I S Supply Current per Amplifier 3 µa C T A 7 C µa C T A C µa Total Supply Current in Shutdown (Note 7) V SHDN =.3V.. µa I SHDN SHDN Pin Current (Note 7) V SHDN =.V 3 na V SHDN = V 3 na Shutdown Output Leakage Current (Note 7) V SHDN =.3V (V V OT V ) na V L SHDN Pin Input Low Voltage (Note 7).3 V V H SHDN Pin Input High Voltage (Note 7).V V t ON Turn On Time (Note 7) V SHDN = V to.v, µs R L = k t OFF Turn Off Time (Note 7) V SHDN =.V to V, µs R L = k GBW Gain Bandwidth Product (Note ) Freq = khz 3 khz C T A 7 C khz C T A C khz SR Slew Rate A V =, V OT =.V to.v 9 V/ms Measure.V to.v, C T A 7 C 7 V/ms C T A C V/ms FPBW Full Power Bandwidth (Note 9) V OT =.V P-P.3 3. khz fa

5 LT/LT/LT ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full specified temperature range, otherwise specifications are. V S = V, V, V CM = V OT = / Supply. For the LT and the LTDD, V SHDN = V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX NITS V OS Input Offset Voltage LTMS µv C T A 7 C µv C T A C 9 µv LTDCB, LTDD, LTGN 7 µv C T A 7 C µv C T A C µv LTDHC 3 9 µv C T A 7 C µv C T A C 3 µv V CM = V LTMS µv 3 µv V CM = V LTDCB, LTDD, LTGN µv µv V CM = V LTDHC 3 µv 7 µv V OS / T Input Offset Voltage Drift (Note ) V CM = V S / µv/ C I B Input Bias Current V CM = V S / na V CM = V na V CM = V na I OS Input Offset Current V CM = V S /.. na V CM = V.. na V CM = V.. na Input Noise Voltage.Hz to Hz. µv P-P e n Input Voltage Noise Density f = khz 7 nv/ Hz i n Input Current Noise Density f = khz fa/ Hz R IN Input Resistance Common Mode (V CM = V to 3.V) 3. GΩ Differential. MΩ C IN Input Capacitance pf CMRR Common Mode Rejection Ratio V CM = V to 3.V, C T A 7 C 9 db V CM =.V to 3.V, C T A C 9 db V CM = V to V db Input Voltage Range V PSRR Power Supply Rejection Ratio V S =.V to V db V CM = V O =.V Minimum Supply. V A VOL Large-Signal Gain V O =.V to.v R L = k to V S / 3 V/mV R L = k to V S / V/mV R L = k to V S / V/mV R L = k to V S / V/mV R L = k to GND V/mV R L = k to GND V/mV V OL Output Swing Low (Note ) Input Overdrive = 3mV No Load 3 mv I SINK = µa mv I SINK = µa 3 mv fa

6 LT/LT/LT ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full specified temperature range, otherwise specifications are. V S = V, V, V CM = V OT = / Supply. For the LT and the LTDD, V SHDN = V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX NITS V OH Output Swing High (Note ) Input Overdrive = 3mV No Load 3 mv I SORCE = µa mv R L = k to GND mv I SC Short-Circuit Current Short to GND ma C T A 7 C ma C T A C 3 ma Short to V ma C T A 7 C. ma C T A C. ma I S Supply Current per Amplifier µa C T A 7 C µa C T A C 7 µa V S = ±V µa 3 µa Total Supply Current in Shutdown (Note 7) V SHDN =.3V 3 µa I SHDN SHDN Pin Current (Note 7) V SHDN = V 3 na V SHDN = V na Shutdown Output Leakage Current (Note 7) V SHDN =.3V (V V OT V ) na V L SHDN Pin Input Low Voltage (Note 7).3 V V H SHDN Pin Input High Voltage (Note 7).7 V t ON Turn On Time (Note 7) V SHDN = V to V, R L = k µs t OFF Turn Off Time (Note 7) V SHDN = V to V, R L = k µs GBW Gain Bandwidth Product Freq = khz khz C T A 7 C 3 khz C T A C 3 khz SR Slew Rate A V =, V OT =.V to.v V/ms Measure V to V, C T A 7 C V/ms C T A C V/ms FPBW Full Power Bandwidth (Note 9) V OT = V P-P.7. khz Note : Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note : A heat sink may be required to keep the junction temperature below the absolute maximum. This depends on the power supply voltage and how many amplifiers are shorted. The θ JA specified for the DD and DHC packages is with minimal PCB heat spreading metal. sing expanded metal area on all layers of a board reduces this value. Note 3: The LTC/LTI/LTC/LTI and LTC/LTI are guaranteed functional over the temperature range of C to C. Note : The LTC/LTC/LTC is guaranteed to meet specified performance from C to 7 C. The LTC/LTC/LTC are designed, characterized and expected to meet specified performance from C to C but are not tested or QA sampled at these temperatures. The LTI/LTI/ LTI is guaranteed to meet specified performance from C to C. Note : This parameter is not % tested. Note : Output voltage swings are measured between the output and power supply rails. Note 7: Specifications apply to the LT or the LTDD with shutdown. Note : Guaranteed by correlation to slew rate at V S =.V and GBW at V S = V. Note 9: Full-power bandwidth is calculated from the slew rate: FPBW = SR/πV P-P. fa

7 LT/LT/LT TYPICAL PERFOR A CE CHARACTERISTICS W PERCENT OF NITS (%) 3 V OS Distribution V S = V, V V CM =.V MS PACKAGE PERCENT OF NITS (%) TC V OS Distribution V S = V, V V CM =.V MS, GN, DD PACKAGES C TO C SPPLY CRRENT PER AMPLIFIER (µa) Supply Current vs Supply Voltage 3 V CM =.V 3 T A = C T A = C INPT OFFSET VOLTAGE (µv) 3 3 DISTRIBTION (µv/ C) TOTAL SPPLY VOLTAGE (V) G G G3 CHANGE IN OFFSET VOLTAGE (µv) 3 Change in Input Offset Voltage vs Total Supply Voltage T A = C T A = C V CM =.V OFFSET VOLTAGE (µv) 3 Input Offset Voltage vs Total Supply Voltage T A = C T A = C V CM =.V TYPICAL PART OFFSET VOLTAGE (µv) 3 Input Offset Voltage vs Input Common Mode Voltage V S = V, V TYPICAL PART T A = C T A = C.. TOTAL SPPLY VOLTAGE (V) 3 3 TOTAL SPPLY VOLTAGE (V) INPT COMMON MODE VOLTAGE (V) G3 G G INPT BIAS CRRENT (na) Input Bias Current vs Common Mode Voltage V S = V, V T A = C T A = C COMMON MODE VOLTAGE (V) G7 OTPT HIGH SATRATION VOLTAGE (V).... Output Saturation Voltage vs Load Current (Output High) V S = V, V INPT OVERDRIVE = 3mV T A = C T A = C.. SORCING LOAD CRRENT (ma) G OTPT LOW SATRATION VOLTAGE (V).... Output Saturation Voltage vs Load Current (Output Low) V S = V, V INPT OVERDRIVE = 3mV T A = C T A = C.. SINKING LOAD CRRENT (ma) G fa 7

8 LT/LT/LT TYPICAL PERFOR A CE CHARACTERISTICS W OTPT SATRATION VOLTAGE (mv) Output Saturation Voltage vs Input Overdrive OTPT HIGH OTPT LOW V S = V, V NO LOAD OTPT SHORT-CIRCIT CRRENT (ma) Output Short-Circuit Current vs Total Supply Voltage (Sourcing) V CM =.V OTPT SHORTED TO V T A = C T A = C OTPT SHORT-CIRCIT CRRENT (ma) Output Short-Circuit Current vs Total Supply Voltage (Sinking) V CM =.V OTPT SHORTED TO V T A = C T A = C INPT OVERDRIVE (mv) 3 3 TOTAL SPPLY VOLTAGE (V) 3 TOTAL SPPLY VOLTAGE (V) G G G NOISE VOLTAGE (nv/div).hz to Hz Output Voltage Noise V S = ±.V TIME (SECONDS) G3 NOISE VOLTAGE (nv/ Hz) 9 7 Noise Voltage Density vs Frequency V S = V, V V CM =.V V CM =.V FREQENCY (Hz) G INPT NOISE CRRENT DENSITY (fa/ Hz) Input Noise Current vs Frequency V S = V, V V CM =.V V CM =.V FREQENCY (Hz) G CHANGE IN INPT OFFSET VOLTAGE (µv) Open-Loop Gain R L = k R L = k OTPT VOLTAGE (V) V S =.V, V V CM =.V.. G CHANGE IN INPT OFFSET VOLTAGE (µv) Open-Loop Gain R L = k R L = k 3 OTPT VOLTAGE (V) V S = V, V V CM =.V G7 CHANGE IN INPT OFFSET VOLTAGE (µv) Open-Loop Gain R L = k R L = k OTPT VOLTAGE (V) V S = ±.V G fa

9 LT/LT/LT TYPICAL PERFOR A CE CHARACTERISTICS W GAIN BANDWIDTH (khz) Gain Bandwidth and Phase Margin vs Temperature f = khz V S = V, V V CM =.V PHASE MARGIN V S =.V, V V CM =.V 7 7 V S = V, V 7 V CM =.V V S =.V, V V CM =.V 3 GAIN BANDWIDTH 7 TEMPERATRE ( C) G PHASE MARGIN (DEG) SLEW RATE (V/ms) 3 3 Slew Rate vs Temperature A V = R F = R G = k RISING V S =.V, V RISING V S = V, V FALLING V S = V, V 7 TEMPERATRE ( C) FALLING V S =.V, V G GAIN (db) 7 3 Gain and Phase vs Frequency PHASE V CM =.V V CM =.V V CM =.V V CM =.V GAIN V S = V, V R F = R G = k A V = 3. FREQENCY (khz) G9 PHASE (DEG) GAIN BANDWIDTH (khz) 7 3 Gain Bandwidth and Phase Margin vs Supply Voltage R F = R G = k A V = f = khz PHASE MARGIN GAIN BANDWIDTH TOTAL SPPLY VOLTAGE (V) 7 PHASE MARGIN (DEG) OVERSHOOT (%) 3 3 Capacitive Load Handling Overshoot vs Capacitive Load V S = V, V V CM =.V A V = A V = A V = CAPACITIVE LOAD (pf) COMMON MODE REJECTION RATIO (db) Common Mode Rejection Ratio vs Frequency V S = ±.V FREQENCY (khz) G3 G3 G COMMON MODE REJECTION RATIO (db) Power Supply Rejection Ratio vs Frequency NEGATIVE SPPLY V S = ±.V POSITIVE SPPLY.. FREQENCY (khz) G OTPT IMPEDANCE (Ω) Output Impedance vs Frequency V S = ±.V A V = A V =... FREQENCY (khz) G OTPT IMPEDANCE (kω) Disabled Output Impedance vs Frequency (LT/LTDD). V S = ±.V V PIN(SHDN) =.V. FREQENCY (khz) G7 fa 9

10 LT/LT/LT TYPICAL PERFOR A CE CHARACTERISTICS W Large-Signal Response Large-Signal Response Small-Signal Response.V.V mv/div.v.v A V = V S = V, V C L = pf R L = k µs/div G A V = V S =.V, V C L = pf R L = k µs/div G9 A V = V S = ±.V C L = pf R L = k µs/div G3 SPPLY CRRENT BOTH AMPLIFIERS (µa) 3 Total Supply Current vs SHDN Pin Voltage (LTDD) V S =.V, V T A = C T A = C SHDN PIN VOLTAGE (V) SPPLY CRRENT BOTH AMPLIFIERS (µa) 3 Total Supply Current vs SHDN Pin Voltage (LTDD) V S = ±V T A = C T A = C 3 3 SHDN PIN VOLTAGE (V) V SHDN V V OT V Shutdown Response (LT/LTDD) V IN = V A V = V S =.V, V R L = k µs/div G33 G3 G3 Supply Current vs SHDN Pin Voltage (LT) 3 VS =.V, V 3 Supply Current vs SHDN Pin Voltage (LT) V S = ±V T A = C SPPLY CRRENT (µa) T A = C T A = C SPPLY CRRENT (µa) T A = C SHDN PIN VOLTAGE (V) 3 3 SHDN PIN VOLTAGE (V) G37 G3 fa

11 SI PLIFIED SCHE ATIC W W LT/LT/LT V Q Q7 Q R Q R Q R 7M CM V SHDN R Q7 IN IN V V R 3k R3 3k D3 Q3 Q Q Q Q Q C Q Q3 COMPLEMENTARY DRIVE GENERATOR V OT Q Q9 Q Q Q9 Q R R7 V Figure APPLICATIO S I FOR ATIO Supply Voltage W The positive supply of the LT/LT/LT should be bypassed with a small capacitor (about.µf) within an inch of the pin. When driving heavy loads, an additional.7µf electrolytic capacitor should be used. When using split supplies, the same is true for the negative supply pin. Rail-to-Rail Characteristics The LT/LT/LT are fully functional for an input signal range from the negative supply to the positive supply. Figure shows a simplified schematic of the amplifier. The input stage consists of two differential amplifiers, a PNP stage Q3/Q and an NPN stage Q/Q that are active over different ranges of the input common mode voltage. The PNP stage is active for common mode voltages, V CM, between the negative supply to approximately V below the positive supply. As V CM moves closer towards the positive supply, the transistor Q7 will steer Q s tail current to the current mirror Q/Q9, activating the NPN differential pair. The PNP pair becomes inactive for the rest of the input common mode range up to the positive supply. The second stage is a folded cascode and current mirror that converts the input stage differential signals into a single ended output. Capacitor C reduces the unity cross frequency and improves the frequency stability without degrading the gain bandwidth of the amplifier. The complementary drive generator supplies current to the output transistors that swing from rail to rail. Input The input bias current depends on which stage is active. The input bias current polarity depends on the input common mode voltage. When the PNP stage is active, the input bias currents flow out of the input pins. They flow in the opposite direction when the NPN stage is active. The offset error due to the input bias currents can be minimized by equalizing the noninverting and inverting source impedance. fa

12 LT/LT/LT APPLICATIO S I FOR ATIO W The input offset voltage changes depending on which input stage is active; input offset voltage is trimmed on both input stages, and is guaranteed to be µv max in the PNP stage. By trimming the input offset voltage of both input stages, the input offset voltage over the entire common mode range (CMRR) is typically µv, maintaining the precision characteristics of the amplifier. The input stage of the LT/LT/LT incorporates phase reversal protection to prevent wrong polarity outputs from occurring when the inputs are driven up to V below the negative rail. 3k protective resistors are included in the input leads so that current does not become excessive when the inputs are forced below V or when a large differential signal is applied. Input current should be limited to ma when the inputs are driven above the positive rail. Output The output of the LT/LT/LT can swing to within 3mV of the positive rail with no load and within 3mV of the negative rail with no load. When monitoring input voltages within 3mV of the positive rail or within 3mV of the negative rail, gain should be taken to keep the output from clipping. The LT/LT/LT can typically source ma on a single V supply, sourcing current is reduced to ma on a single.v supply as noted in the electrical characteristics. The normally reverse-biased substrate diode from the output to V will cause unlimited currents to flow when the output is forced below V. If the current is transient and limited to ma, no damage will occur. Start-p and Output Saturation Characteristics Micropower op amps are often not micropower during start-up characteristics or during output saturation. This can wreak havoc on limited current supplies, in the worst case there may not be enough supply current available to take the system up to nominal voltages. Also, when the output saturates, the part may draw excessive current and pull down the supplies, compromising rail-to-rail performance. Figure shows the start-up characteristics of the LT/LT/LT for three limiting cases. The circuits are shown in Figure. One circuit creates a positive offset forcing the output to come up saturated high. Another circuit creates a negative offset forcing the output to come up saturated low, while the last circuit brings the output up at / supply. In all cases, the supply current is well controlled and is not excessive when the output is on either rail. SPPLY CRRENT PER AMPLIFIER (µa) OTPT AT V S / OTPT LOW OTPT HIGH SPPLY VOLTAGE (V) F Figure. Start-p Characteristics VS VS VS 3mV V S / 3mV F Output High Output Low Output at V S / Figure. Circuits for Start-p Characteristics fa

13 LT/LT/LT APPLICATIO S I FOR ATIO W The LT/LT/LT outputs can swing to within a respectable 3mV of each rail and draw virtually no excessive supply current. Figure 3 compares the dual LT to a competitive part. Both op amps are in unity gain and their outputs are driven into each rail. The supply current is shown when the op amps are in linear operation and when they are driven into each rail. As can be seen from Figure 3, the supply current of the competitive part increases 3-fold or -fold depending on which rail the output goes to whereas the LT draws virtually no excessive current. VOT (V) COMPETITIVE PART LT V S = ±.V, A V = V IN SPPLY CRRENT PER AMPLIFIER V OT 3 V IN (V) 7 3 ICC (µa) Gain The open-loop gain is almost independent of load when the output is sourcing current. This optimizes performance in single supply applications where the load is returned to ground. The typical performance curve of Open-Loop Gain for various loads shows the details. Shutdown The single LT and the -lead dual LT include a shutdown feature that disables the part reducing quiescent current and makes the output high impedance. The devices can be shut down by bringing the SHDN pin within.3v of V. The amplifiers are guaranteed to shut down if the SHDN pin is brought within.3v of V. The exact switchover point will be a function of the supply voltage. See the Typical Performance Characteristics curves Supply Current vs Shutdown Pin Voltage. When shut down the total supply current is about.µa and the output leakage current is na (V V OT V ). For normal operation the SHDN pin should be tied to V. It can be left floating, however, parasitic leakage currents over µa at the SHDN pin may inadvertently place the part into shutdown. F3 Figure 3. V OT and I CC vs Input Voltage fa 3

14 LT/LT/LT TYPICAL APPLICATIO Gain of Amplifier (khz GBW on 3µA Supply).9V (NiMH) V IN 3 / LT.9V (NiMH) / LT 7 OT 9.9k 9.9k TAa k k GAIN (db) Gain vs Frequency 3 3 k k k M FREQENCY (Hz) TAb fa

15 LT/LT/LT PACKAGE DESCRIPTIO DCB Package -Lead Plastic DFN (mm 3mm) (Reference LTC DWG # --7).7 ±.. ±. 3. ±.. ±. PACKAGE OTLINE. ±.. BSC.3 ±. RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS. ±. R =. TYP R =. TYP. ±. 3. ±.. ±. PIN BAR TOP MARK (SEE NOTE ). REF.7 ±... PIN NOTCH R. OR. CHAMFER (DCB) DFN 3. ±.. BSC.3 ±. BOTTOM VIEW EXPOSED PAD NOTE:. DRAWING TO BE MADE A JEDEC PACKAGE OTLINE M-9 VARIATION OF (TBD). DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED.mm ON ANY SIDE. EXPOSED PAD SHALL BE SOLDER PLATED. SHADED AREA IS ONLY A REFERENCE FOR PIN LOCATION ON THE TOP AND BOTTOM OF PACKAGE fa

16 LT/LT/LT PACKAGE DESCRIPTIO MS Package -Lead Plastic MSOP (Reference LTC DWG # --).9 ±.7 (.3 ±.).3 (.) MIN (..3). ±.3 (. ±.) TYP. (.) BSC 3. ±. (. ±.) (NOTE 3) 7. (.) REF RECOMMENDED SOLDER PAD LAYOT GAGE PLANE. (.7). (.) DETAIL A NOTE:. DIMENSIONS IN MILLIMETER/(INCH). DRAWING NOT TO SCALE TYP.3 ±. (. ±.) DETAIL A SEATING PLANE.9 ±. (.93 ±.). (.3) MAX..3 (.9.) TYP. (.) BSC 3 3. DIMENSION DOES NOT INCLDE MOLD FLASH, PROTRSIONS OR GATE BRRS. MOLD FLASH, PROTRSIONS OR GATE BRRS SHALL NOT EXCEED.mm (.") PER SIDE. DIMENSION DOES NOT INCLDE INTERLEAD FLASH OR PROTRSIONS. INTERLEAD FLASH OR PROTRSIONS SHALL NOT EXCEED.mm (.") PER SIDE. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE.mm (.") MAX 3. ±. (. ±.) (NOTE ). (.3) REF.7 ±.7 (. ±.3) MSOP (MS) fa

17 LT/LT/LT PACKAGE DESCRIPTIO DD Package -Lead (3mm 3mm) Plastic DFN (Reference LTC DWG # --99).7 ±. 3. ±.. ±.. ±. PACKAGE OTLINE. ±.. BSC.3 ±. RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS R =. TYP.3 ±. PIN TOP MARK (SEE NOTE ). REF 3. ±. ( SIDES).7 ±.... ±. (DD) DFN 3. ±.. BSC.3 ±. BOTTOM VIEW EXPOSED PAD NOTE:. DRAWING TO BE MADE A JEDEC PACKAGE OTLINE M-9 VARIATION OF (WEED-). CHECK THE LTC WEBSITE DATA SHEET FOR CRRENT STATS OF VARIATION ASSIGNMENT. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED.mm ON ANY SIDE. EXPOSED PAD SHALL BE SOLDER PLATED. SHADED AREA IS ONLY A REFERENCE FOR PIN LOCATION ON THE TOP AND BOTTOM OF PACKAGE fa 7

18 LT/LT/LT PACKAGE DESCRIPTIO GN Package -Lead Narrow Plastic SSOP (Reference LTC DWG # --). ±..9.9* (..97) (.9) REF. MIN...9. (.7.9)..7** (3. 3.9). ±. RECOMMENDED SOLDER PAD LAYOT. BSC (.7.9). ±. (.3 ±.) TYP.3. (.3.7)..9 (..9).. (..7) NOTE:. CONTROLLING DIMENSION: INCHES INCHES. DIMENSIONS ARE IN (MILLIMETERS) 3. DRAWING NOT TO SCALE *DIMENSION DOES NOT INCLDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED." (.mm) PER SIDE **DIMENSION DOES NOT INCLDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED." (.mm) PER SIDE.. (.3.3) TYP. (.3) BSC GN (SSOP) fa

19 LT/LT/LT PACKAGE DESCRIPTIO DHC Package -Lead (mm mm) Plastic DFN (Reference LTC DWG # --7). ±. 3. ±.. ±.. ±. PACKAGE OTLINE. ±.. ±.. BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS. ±. R =. TYP 9 R =. TYP. ±. PIN TOP MARK (SEE NOTE ). REF 3. ±..7 ±.. ±... NOTE:. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-) IN JEDEC PACKAGE OTLINE MO-9. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED.mm ON ANY SIDE. EXPOSED PAD SHALL BE SOLDER PLATED. SHADED AREA IS ONLY A REFERENCE FOR PIN LOCATION ON THE TOP AND BOTTOM OF PACKAGE. ±.. BSC. ±. BOTTOM VIEW EXPOSED PAD PIN NOTCH (DHC) DFN 3 fa 9

20 LT/LT/LT TYPICAL APPLICATIO Low Power V-to-F Converter M M 3 A / LT V REF.k M.µF TP V REF M M 3 M V REF 7 LTC V OT V IN M V REF A / LT.k FREQENCY OT 7.Hz/mV V IN LINEARITY %, V IN mv TO mv I SPPLY µa TO µa 7 V REF.µF N7.k pf DIODES: CENTRAL SEMI CMOD33 V S V.3V TO V REF.µF LT79-.9 µf TA3 MX Amplifier.V MX Amplifier Waveforms V IN LT SHDN V OT V OT.V V IN LT SHDN INPT SELECT INPT SELECT SN7LVC TAa V S =.V ms/div V IN = Hz AT V P-P V IN = Hz AT.V P-P INPT SELECT = Hz AT.V P-P TAb RELATED PARTS PART NMBER DESCRIPTION COMMENTS LT7/LT79 7µA Dual/Quad Single Supply Op Amps µv V OS(MAX), Gain Bandwidth = khz LT9A/LT9A µa Dual/Quad Over-The-Top Rail-to-Rail Input and Output Op Amps 9µV V OS(MAX), Gain Bandwidth = khz LT9/LT9/LT9.µA Max Single/Dual/Quad Over-The-Top Precision Rail-to-Rail Input 37µV V OS(MAX), Gain Bandwidth =.7kHz and Output Op Amps LT7/LT73/LT7 µa Max, AV, Single/Dual/Quad Over-The-Top Precision Rail-to-Rail Gain of Stable, Gain Bandwidth = khz Input and Output Op Amps LT7 Micropower, Over-The-Top SOT-3 Rail-to-Rail Input and Output Op Amps SOT-3, µv V OS(MAX), I S = µa (Max), Gain Bandwidth = khz, Shutdown Pin Over-The-Top is a registered trademark of Linear Technology Corporation. fa LT REV A PRINTED IN SA Linear Technology Corporation 3 McCarthy Blvd., Milpitas, CA () 3-9 FAX: () LINEAR TECHNOLOGY CORPORATION