Technologies & Sensors for the Internet of Things

Transcription

1 Technologies & Sensors for the Internet of Things Businesses & Market Trends The Internet of Things (IoT) provides big opportunities for technologies. The device business will reach $45B in 224, contributing to a total IoT market of $4B. 214

2 Table of Contents Executive Summary... 7 Introduction Internet of Things Promises Definition Report Scope Sensors for IoT Applications Structure of IoT IoT Map Device Seven Generations of IoT Sensors to appear Industrial sensors Description & Characteristics First Generation Description & Characteristics Advanced Generation Description & Characteristics Integrated IoT Sensors Description & Characteristics Polytronics Systems Description & Characteristics Sensors' Swarm Description & Characteristics Printed Electronics Description & Characteristics IoT Generation Roadmap Market Forecasts Market Structure Value (in $M) Market Value by Application Domain (in $M) Volume Forecasts (Munits) Cost Breakdown per Module (in $M) Market Value per Generation (in $M) Market Volume per Generation (Munits) IoT Characteristics, Challenges & Roadmap Adapted Price Systems Form Factor Low Power Consumption Protocols & Standards Privacy & Security Market Traction Reliability & Lifespan Data to Process IoT Development Examples ACOEM Eagle EnOcean Push Button NEST Sensor Ninja Blocks And more Focus on Wearable Electronics Technological Analysis. 184 Wireless Sensor Structure Energy Storage Module Power Management Module RF Module Sensing Module Conclusion

3 About the Authors Dr. Guillaume Girardin Dr. Guillaume Girardin works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Guillaume holds a Ph.D. In Physics and Nanotechnology from Claude Bernard University Lyon I and a M.Sc. in Technology and Innovation Management from EM Lyon - School of Business. Contact: girardin@yole.fr Antoine Bonnabel Antoine Bonnabel works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Antoine holds a M.Sc. In Microelectronics and Microsystems from Grenoble Institute of Technologies and a M.Sc. In Marketing and Business Management from Grenoble Graduate School of Business. Contact: bonnabel@yole.fr Dr. Eric Mounier Dr. Eric Mounier co-founded Yole Développement in He oversees technology analysis for MEMS-related manufacturing technologies and Optical MEMS (including micromirrors, micro-displays, autofocus and IR micro-bolometers) applications within the company. Eric has also developed a unique cost modeling tool, called MEMSCoSim, which is able to evaluate the cost of MEMS module manufacturing. Contact: mounier@yole.fr 214 3

4 Companies Listed in this Report ACOEM, AdvanticSys, Amazon, Apple, AT&T, Atmel, Ayla Networks, AVAGO Technologies, Blackberry, BOSCH, BLUECHIIP, Cambridge CMOS Sensors, CEA Liten, China Mobile, Cisco, DataVeyes, DG Logik, DISCERA, Enfucell, EnOcean, EPCOS, FitBit, Flutura, Fraunhofer Institute, FREESCALE Semiconductor, GE, Georgia Institute of Technology, Google, HEWLETT PACKARD, Hillcrest Labs, HITACHI, Honeywell, HTC, IBM, Infomotion Sports Technologies, iobridge, INTEL, Intellisense.io, InterSoft, INVENSENSE, Jabra, Jasper Wireless, Jawbone, Kionix, Kistler, KNOWLES Electronics, Koubachi, KTH, KwikSet, KWJ Engineering, Lenovo, Lightning Switch, Lime Microsystems, LogBar Inc., LumoBack, M2M Cyber Security, M2Mi, MC1 Inc., Marlow Industries, MEMSIC, Micropelt, Misfit, MURATA, MYO, Navisens, Nest, Netatmo, Newco, Nike, Nintendo, Nokia, NXP Semiconductors, OnFarm Systems, Optoi MicroElectronics, Oracle, Pebble, Purdue University, Rosemount, Samsung, SemTech, Sensaris, Sensata, Sensirion, Sensonor, SensorSuite, Sharp, Si Time, SiLabs, SmartThings, Sony, STMicroelectronics, Synkera Technologies, TeledyneDALSA, Texas Instruments, ThinFilm Electronics, TriQuint, Tronics MicroSystems, TSMC, Variable Technologies, UCLA, University of Harvard, VitalConnect, VTT MEMS, WiSpry, Withings, X-Fab MEMS Foundry, Xymox technologies Inc

5 Key Features The objectives of this report is to provide: Understanding of IoT value chain structure (device, data cloud), application areas and technologies involved Technology trends and evolution of IoT device in the coming years Market forecast for IoT devices in Munits and $M for , with a focus on sensors IoT applications and examples overview (building automation, transportation, healthcare, industry, etc.) with a focus on wearable electronics The technological challenges faced by IoT devices, with a focus on wireless, energy, power, RF and sensing modules 214 5

6 Who Should Be Interested in this Report? R&D, Components Manufacturers Companies Evaluate market potential of future IoT technologies and products for new applicative markets Spot new opportunities and define diversification strategies Position your company in the ever changing IoT market structure OEMs & Integrator Companies To evaluate benefits of integrating sensors in IoT devices Get the list of key players and emerging start-ups in this industry Cloud & Telecommunications Companies Understand the evolution of IoT devices and the market structure Understand the differentiated value of products and services in this market Identify new business opportunities and prospects Financial & Strategic Investors Understand the potential of incoming Internet of Things revolution Get the list of key players and emerging start-ups in this industry 214 6

7 Report Scope Yole s definition of the Internet of Things is as follows: Internet of Things devices is the aggregation of all the sensing modules that are linked to the Cloud either directly or through a gateway and which data is processed and valorized in any manner (through selling to a third party, through monitoring of a piece of equipment, etc.). This report looks at the Internet of Things market in general, but with a strong focus on sensing modules. We do not detail the cloud computing industry nor the data processing services. We do not include in our valorizations the benefit brought by IoT solutions through productivity gains. The values estimated are from hardware, cloud computing processing services and data processing services charging

8 IoT Global Market Structure (1/3) Information Flux Statistics Targeted Ads Connected Devices Data Hardware Wireless Sensor Module Service Companies Third Party IoT Market structure Wireless Sensor Module Wireless Sensor Module Cloud HUB / Gateway Cloud Companies Information Flux

9 Area Of Application Building Automation Transportation Healthcare & Life Science Retail& Logistics Security & Public Safety Industrial Consumer & Home automation Environment 214 9

10 THE OF Summary of Technologies of IoT Markets and Sensors Here are the main applications of IoT devices and sensors associated with. SENSORS OF Legend: Sensor Level of demand INTERNET THINGS Building Automation Healthcare & Life science Consumer & Home automation Transportation Light (IR, visible) Contact Pressure Bio Sensors Gyroscope Temperature Gyroscope Pressure Temperature Temperature Inertial Accelero Chemical Accelero Temperature Chemical (CO2) Chemical Magneto Magneto Accelero Light (IR, X-Ray) Pressure Chemical Industrial Environment Security & Public Safety Retail & Logistics Pressure Hall Effect Chemical Humidity Gyro Light (IR,XRay,THz) Light (IR/Optical) Magneto Light (IR,Optical) Accelero Temperature Accelero Pressure Chemical Light (IR, visible) Magneto Temperature Temperature Pressure Chemical Chemical

11 IoT Wireless Sensors Map POWER MANAGEMENT MODULE Ultra-capacitors Microbatteries PMU ENERGY STORAGE MODULE Li-Ion battery AAA/AA Batteries Energy Harvesting SENSING MODULE Signal Processing Unit Wifi ZigBee Bluetooth LE RF MODULE Radio Transceiver Duplexer BAW Accelerometers Magnetometers Gyroscopes Acoustic Sensors Pressure Sensors Humidity Sensors Temperature Sensors Proximity Sensors Image Sensors Light Sensors Gas RFID Sensors Micro Flow Sensors

12 Solution Price IoT Roadmap Solution Price per sensor module $2 Rosemount 351C Smart Pressure Transmitter Source: Rosemount $25 NEST Smart Thermostat (current price: $25) Source: NEST $5 Fitness Activity Tracker (current price: $13) Source: Jawbone Multiple temperature sensors for home automation (current price: $75) Source: EnOcean $5 MEMS-based chemical sensing Source: Optoi Microelectronics $1 Sensors' swarm - Michigan Micro-Mote Source: University of Michigan $.5 Batch-level RFID Temperature Sensor Tags (current price: $ range) Source: ThinFilm Electronics $.5 Item-level RFID sensor tags Today

13 Market Value ($M) Summary of Technologies of IoT Forecast : Hardware Market Value by Application Domain 218 $7B Cloud 7, 6, Market Value by Domains of Applications ($M) 5, 4, 3, 2, 1, CAGR Total Value Market ($M) 9,458 17,895 34,426 58,295 69,995 67,2 54,555 54,785 47,5 43,172 46,338 42% Environment ,29 124% Security & Public Safety ,5 1, % Retail & Logistics ,25 1,23 3,1 3, 5,4 6,21 139% Industrial 3,42 4,32 5,58 6,885 11,226 1,725 9,15 9,135 8,29 7,632 7,983 32% Healthcare & Life Science ,338 2,455 3,42 4,62 6,33 165% Consumer & Home Automation - 5,938 13,125 27,575 48,75 52,975 45,45 31,39 26,87 2,72 13,92 12,56 29% Building Automation ,2 2,985 4,94 9,335 11,6 12,25 9,3 7,6 7,27 8% Automotive ,35 2,25 2,91 14%

14 Wearable Electronic Market The global wearable electronics market can be segmented in 5 categories. Head-Wear category includes helmet product and vision aid. There s also a category of products for neck-wear, with collars and necklace products that cover up electronics with jewels. Arm-Wear category is the most burgeoning category with multiples devices expected wristband, smart watches, ring, armband, etc. Body-Wear products include smart clothing, and devices monitoring back/spine position. And the last category concerns foot-wear. Wearable Electronic Market Segmentation: Head-Wear Neck-Wear Arm-Wear Body-Wear Foot-Wear Helmet Jewelry Smart watches Clothing Shoes Smart Glasses Collars Wristband Back/Spine Socks Ring Google Glass Shine Myo Ring Arm-Wear market is one of the most promising market and many actors are targeting it. LumoBack Smart Watch

15 Wearable Electronic A new opportunity for sensor fusion / processing Wearable electronics is a new big opportunity for sensors Fitness / activity monitoring, healthcare, sports applications In many cases the sensor acts as a hub Basic calculations can be done at the device level After transmission (enabled by low energy Bluetooth) : advanced software / fusion can be done by the smartphone Bellow are many examples of such developments: I m watch (212) Integrates accelerometer + magnetometer Moto 36 by Motorola (End 214) Other connected watches are currently in development by major OEMs (LG G Watch, rumors about Apple iwatch ) Pebble Watch (,4 MUnits sold in 213) Features STMicroelectronics accelerometer

16 Wearable Electronic / Connected Devices Examples of new devices (2/4) MYO by ThalmicLabs Proprietary EMG muscle activity sensors Nine-axis IMU containing: - three-axis gyroscope - three-axis accelerometer - three-axis magnetometer BodyMedia (Acquired by Jawbone in 213) Integrates MEMS accelerometer (from Kionix and STMicroelectronics) in its systems for fitness application We note that no gyroscopes are used presently. This would enable more precise monitoring and new sport applications, however power consumption would be too high. It could be part of larger systems in the future. Cell Phone as a Hub NodeKore from Variable Technologies Jawbone Up

17 Available MEMS Reports Uncooled Infrared Imaging Techology & Market Trends Emerging MEMS Status of the MEMS Industry MEMS for Cell Phones and Tablets Infrared Detectors Technology & Market Trends New! New! New! New! New! MEMS Pressure Sensor MEMS Front-End Manufacturing Trends Inertial MEMS Manufacturing Trends 214 RF Filters, PAs, Antenna Switches & Tunability for Cellular Handsets IMU & Gyro for Defense, Aerospace & Industrial New! New! New! Status of the CMOS Image Sensors Technology Trends for Inertials MEMS Ferro-Electric Thin Films Trends in MEMS Manufacturing & Packaging Motion Sensors for Consumer & Mobile applications Sensor fusion of acceleros, gyros & magnetometers Thin Wafer Handling MEMS Cosim+ MEMS Manufacturing Cost Simulation Tool

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21 Market & Technology Report Internet of Things Technologies & Sensors for the Internet of Things: Businesses & Market Trends The Internet of Things (IoT) provides big opportunities for technologies. The device business will reach $46B in 224, contributing to a total IoT market of $4B. REPORT OUTLINE Title: Technologies & Sensors for the Internet of Things June 214 Market & Technology Report PDF file 5,99 - Multi user license (27+ slides) 3,99 - One user license (27+ slides) KEY FEATURES OF THE REPORT Understanding of IoT value chain structure (device, cloud, data), application areas and technologies involved. Technology trends and evolution of IoT devices in the coming years. Market forecasts for IoT devices in Munits and $M for , with a focus on sensors. IoT applications and examples overview (building automation, transportation, healthcare, industry, etc.) with a focus on wearable electronics. The technological challenges faced by IoT devices, with a focus on wireless, energy, power, RF and sensing modules. RELATED REPORTS Silicon Photonics Market & Technologies Emerging MEMS MEMS & Sensors for Mobile Phones and Tablets EnOcean PTM21 Self-Powered Push Button Transmitter Module Find all our reports 3 on FROM $9.5B IN 214 TO $46B IN 224, THE IOT DEVICE MARKET WILL REPRESENT CLOSE TO 15% OF ALL DATA PROCESSING IoT devices offer huge potential for electronic component manufacturers, but this is clearly not where the value will stop. Most of the added value in IoT solutions will come from the processing of the generated data. In fact, the ratio between electronic components and data processing can reach 1:5 in certain long-term cases! This is easily understandable, since the main purpose of the IoT is to make sensing ubiquitous at a very low cost, resulting in extremely strong price pressure on electronic component manufacturers. Nevertheless, the next five years will be extremely fruitful for device makers; the market should reach $7B by 218, before decreasing. This period represents a key window in which manufacturers must seize the opportunity to grab a piece of the IoT business pie. The IoT is a multi-billion dollar market emerging from several different markets (i.e. industrial sensors, wearable electronics and home automation) which will see strong convergence in the next five years. Three industrial and service sectors will be integral to the valorization of this new market: The electronics industry, which will manufacture the sensing devices The communication and cloud data storage industry, which will handle data transmission, storage and processing Service companies, which will valorize the data either through processing or by selling to a third party 3 Some companies have already started positioning themselves in these fields: for example, Oracle and Amazon are developing their cloud computing capabilities; Bosch Connected Devices and Solutions GmbH and STMicroelectronics have teams dedicated to the IoT; and Google and Facebook are continuously developing their data processing models while looking to acquire companies linked to data gathering. Of course, not all of them will be winners. The short-term opportunity lies in the electronics industry. Indeed, very strong price pressure is expected for IoT devices, and strong volumes are expected but at very low cost. Even though the general electronics market will experience strong growth, it will be through decreased costs, increased manufacturing capabilities and reduced margins. This trend has already been seen in the MEMS field over the past few years, and will repeat itself in the future. The same is to be expected for the cloud computing industry. Large investments in terms of data storage will be needed, but strong price pressure is expected, and an overall low value will be attributed to the physical data. Actually, the war on price has already begun between the major cloud computing companies, which are cutting data storage prices while growing their capabilities. Repartition of value in market structure Meanwhile, on the data processing side, more and more information will be available, and at low cost. The more data, the higher the value, and all of this with low overall infrastructural investment. Service companies will be the big winners in this field. In Market value ($B) 2 1 Market value ($B) 2 1 $4B $4B Cloud Cloud CAGR CAGR (Yole Développement, June 214)

22 Integrator Technologies & Sensors for the Internet of Things order to secure some of this value, hardware and cloud companies will have no choice but to try and integrate themselves vertically in order to valorize themselves and the data they ll be responsible for! As an example, we expect the overall IoT market to reach $4B in 224, with $46B coming from hardware, $59B from the cloud and $296B from data processing. This report provides a detailed analysis of applications, business models and technical challenges in order to understand the IoT market s potential. ing sing essing d IoT Market structure Integrator IEEE based IPv6 protocols (6LoWPAN) Standardized low power protocols (ZigBee,WirelessHART, Bluetooth LE) Standardized common protocol (Bluetooth, Wi-Fi) Proprietary industrial protocols IoT sensing modules mandatory characteristics RF transmission protocol Polytronics & Printed electronics maturation Very low power electronics and sensors multiplicity Security and privacy of data Clear definition of the market tractions Other main challenges (Yole Développement, June 214) THE INTERNET OF THINGS TECHNOLOGICAL EVOLUTION: IT S ALL ABOUT HETEROGENEOUS INTEGRATION AT DEVICE AND MODULE LEVELS The Internet of Things roadmap Other main challenges $.5 $.25 $.5 $5 $5 $25 $2 First generation of IoT sensors Large Industrial Smart Sensors Data Market Value in IoT Structure ($M) Data Market Value in IoT Structure Data ($M) Processing Data Processing Data IoT 1 Valorization Market structure 1 Cloud Market Value in IoT Structure ($M) Data 224 CAGRIoT Valorization Cloud Market structure CAGR CAGR Cloud Market Value in IoT Structure ($M) CAGR Cloud Market Value in IoT Structure ($M) Hardware Market Value in IoT Structure ($M) 7 Hardware Market Value in IoT Structure ($M) 8 Hardware CAGR CAGR CAGR 1 (Yole Développement, June ) CAGR Data Market Value in IoT Structure ($M) Advanced Generation of IoT Sensors Integrated IoT sensors Polytronics Systems Printed Electronics Sensors swarm Today Annual Market Volumes per Specific Application FROM HARDWARE TO CLOUD TO DATA PROCESSING: WHERE WILL THE IOT S VALUE FLOW? Data Market Value in IoT Structure ($M) General IoT market 3 structure 4 & forecast The array of technologies available and soon to be available is immense. Nevertheless, the evolution of sensing modules for the IoT will follow a predefined trend that can be summarized in a series of seven product generations, including large industrial smart sensors, an advanced generation of sensors, and polytronics. These generations are detailed in Yole Développement s report, but a few examples are described below: One of these generations, already being seen today, is actually the first generation of sensing modules dedicated to IoT application. These devices represent the integration of off-the-shelf electronic components in a single package in order to offer new functionality. Not much effort has yet been given to integration, as the main focus has been on bringing a new function to market. Today, examples of such devices are numerous; some, such as the Nest (now Google) smart thermostat, find market interest and success - while others, i.e. smart forks, smart sprinklers and other smart devices, don t. Other devices are addressing domains such as wearable electronics and home & building automation. For these devices, we expect a market volume of 2M units by 217, representing a market potential of $83B. One example of a future sensing generation is integrated sensors, which are expected for 22 and which will be the one to democratize IoT. Its general description is the integration of IoT-dedicated electronic components meaning very small, very low-cost, very low-power consumption components like MEMS-based sensors. The essence of such devices is to be low cost and thus ideal for high-volume applications, with lowpower wireless protocols, ultra-low power electronics. One example of such a device is the integration of a hazardous chemicals sensor in an industrial worker s gear. Another example is the integration of connected condition-monitoring sensors in a car engine. We expect a market volume of 2B units for these devices by 221, representing a market potential of $17B This report provides a detailed analysis of these generations and the technical and market challenges they must overcome before reaching the market. Yole Développement s analysis shows how these challenges can be defeated in order to strengthen market growth. Cloud Hardware Integrator Hardware The Internet of Things is a mix of hardware, 8 7 cloud Hardware and Market data Value processing; IoT Structure ($M) a generic concept 6 Hardware encompassing a wide variety of applications that Hardware 4 Hardware Market Value in IoT Structure ($M) Hardware Market Value in IoT Structure ($M) CAGR Data Market Value in IoT Structure ($M) 8 4 belong to numerous 1 domains CAGR CAGR Data IoT Valorization Market CAGR structure CAGR Cloud Market Value in IoT Structure ($M) CAGR 7 6 Data IoT Valorization Market structure 4 3 Data 2 Cloud Market Value in IoT IoT Structure ($M) Valorization Market 1 7 structure CAGR CAGR Integrator Integrator Hardware Market Value in IoT Structure ($M) For Yole Développement, 4 the IoT is defined as the 2 aggregation 1 of all the sensing modules which are Integrator Hardware Market Value in IoT Structure ($M) CAGR linked to the Cloud either directly or through a gateway and with which data is processed and Integrator valorized in any manner (selling to a third party, monitoring a piece of equipment, etc.). We focused on the analysis of technical characteristics of IoT devices such as the nature of the electronic components to use, the corresponding RF protocols, device power consumption, etc.; as well as economic characteristics, especially regarding the IoT s value, and where market potential lies. Hardware Hardware

23 Our roadmap is based on analysis of: Current state-of-the-art electronics, and the large number of technologies in development. The current technological evolution of wireless transmission regarding protocols & standards. The recent discussions and actions pertaining to consumer privacy and data security. Sensor multiplicity and integrated sensor developments. Additional topics such as solutions costs, and where market traction comes from. Market & Technology Report Also, it s still unclear which technological platform will be used, which data transmission protocols will be chosen, and which business model will be proven. Many applications are striving for the blue ribbon, but only the proven ones will drive volume. This report analyzes the strong challenges awaited regarding the identification of those applications which are expected to provide market volume, and those which are bound to fail. OBJECTIVES OF THE REPORT This report aims to provide: An understanding of the IoT value chain structure (device, cloud, data), application areas and technologies involved The future evolutionary trend of IoT device technology A market forecast for IoT devices in Munits and $M for IoT applications & examples overview (building automation, transportation, healthcare, industrial...) The technological challenges facing IoT devices AUTHORS Dr. Eric Mounier has a PhD in microelectronics from the INPg in grenoble. he previously worked at CEA LETI R&D lab in grenoble, France in marketing dept. Since 1998 he is a co-founder of Yole Developpement, a market research company based in France. At Yole Developpement, Dr. Eric Mounier is in charge of market analysis for MEMS, equipment & material. he is Chief Editor of Micronews, and MEMS Trends magazines (Magazine on MEMS Technologies & Markets). COMPANIES CITED IN THE REPORT (non-exhaustive list) ACOEM, AdvanticSys, Amazon, Apple, AT&T, Atmel, Ayla Networks, AVAGO Technologies, BOSCH, BLUECHIIP, Cambridge CMOS Sensors, CEA Liten, China Mobile, Cisco, DataVeyes, DG Logik, DISCERA, Enfucell, EnOcean, EPCOS, FitBit, Flutura, Fraunhofer Institute, FREESCALE Semiconductor, GE, Georgia Institute of Technology, Google, HEWLETT PACKARD, Hillcrest Labs, HITACHI, Honeywell, HTC, IBM, Infomotion Sports Technologies, iobridge, INTEL, Intellisense.io, InterSoft, INVENSENSE, Jabra, Jasper Wireless, Jawbone, Kionix, Kistler, KNOWLES Electronics, Koubachi, KTH, KwikSet, KWJ Engineering, Lenovo, Lightning Switch, Lime Microsystems, LogBar Inc., LumoBack, M2M Cyber Security, M2Mi, MC1 Inc., Marlow Industries, MEMSIC, Micropelt, Misfit, Motorola, MURATA, MYO, Navisens, Nest, Netatmo, Newco, Nike, Nintendo, Nokia, NXP Semiconductors, OnFarm Systems, Optoi MicroElectronics, Oracle, Pebble, Purdue University, Rosemount, Samsung, SemTech, Sensaris, Sensata, Sensirion, Sensonor... TABLE OF CONTENTS Antoine Bonnabel, works as market & Technology analyst for MEMS devices and technologies at Yole Développement. He holds a M.Sc. in microelectronics and microsystems from Grenoble Institute of Technologies and a M.Sc in marketing and business management from Grenoble Graduate School of Business. Executive summary 7 Introduction 29 > Definition > Report scope > Sensors for IoT applications > Structure of IoT > IoT map device Seven generations of IoT sensors to appear 55 > Description & characteristics of: Industrial sensors first generation advanced generation integrated IoT sensors polytronics systems sensors swarm printed electronics > IoT Generation Roadmap Market forecasts > Market structure value (in $M) > Market value by application domain (in $M) > Volume vorecasts (Munits) > Cost breakdown per module (in $M) > Market value per generation (in $M) > Market volume per generation (Munits) IoT characteristics, challenges & roadmap 14 > Adapted price systems > Form factor > Low power consumption > Protocols & standards > Privacy & security > Market traction > Reliability & lifespan > Data to process IoT development examples 136 > ACOEM eagle > EnOcean push button > NEST sensor > Ninja blocks > And more Focus on wearable electronics 167 Technological analysis 184 > Wireless sensor structure > Energy storage module > Power management module > RF module > Sensing module Conclusion 273 Dr. Guillaume Girardin works as Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Guillaume holds a Ph.D. in Physics and Nanotechnology from Claude Bernard University Lyon I and a M.Sc. in Technology and Innovation Management from EM Lyon - School of Business.

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SCOPE 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions I hereby accept Yole s Terms and Conditions of Sale. This results in acceptance by the Buyer. 1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by or to the Buyer s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. MAILING OF THE PRODUCTS 2.1 Products are sent by to the Buyer: within [1] month from the order for Products already released; or within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress. 2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products. 2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article The mailing is operated through electronic means either by via the sales department or automatically online via an /password. If the Product s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 9 days from the date of the original download or receipt of the Product. TERMS AND CONDITIONS OF SALES 2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer s risk. 3. PRICE, INVOICING AND PAYMENT 3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order. 3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 1%. 3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 692 Lyon France Bank code: 356 Branch code: 17 Account n : BIC or SWIFT code: CCFRFRPP IBAN: FR To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 3 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment. 3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages. 4. LIABILITIES 4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof. 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement 4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof. 4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages. 4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. PROTECTION OF THE SELLER S IPR 6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: Information storage and retrieval systems; Recordings and re-transmittals over any network (including any local area network); Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; Posting any Product to any other online service (including bulletin boards or the Internet); Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 1 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 1% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (3) days without solving the problem, the nonbreaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.