PRODUCT SPECIFICATION of g WM-G(B)-MR-02 Wireless Lan Module

Transcription

1 802.11g Wireless LAN SiP Module (WM-G-MR -02) Data Sheet Aug Rev PRODUCT SPECIFICATION of g WM-G(B)-MR-02 Wireless Lan Module

2 Introduction The Wireless SiP module WM-G-MR-02 which refers as SiP-g module is a full function 54 Mbps wireless networking module that provides PC Card 16 bit /CF+, SDIO,SPI host interface via 60 pins surface mount type solder balls for direct soldering assembly. The host interface can be set at factory to enables different system interface, which is flexible for system/processor s resource management. The small size & low profile physical design make it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption (Sleep mode 1.2mA) and excellent radio performance make it the best solution for OEM customers who require embedded g Wi-Fi features, such as, Wireless PDA, Scanner Smart phone, Media player Notebook, barcode,mini-printer, VoIP phone etc. For hardware feature, Marvell Libertas chipset solution is used. The ZERO IF radio architecture & high integration MAC/BB chip provide excellent sensitivity with rich system performance. WM-G-MR-02 provides outstanding BT WiFi coexistence solution through 2 wires, 3 wires hardware interface to optimized connection with 3 rd party BT module even without good antenna isolation between BT & WiFi module. In addition to WEP 64/128, WPA and TKIP, AES is supported to provide the latest security requirement on your network. For the software and driver development, USI provides extensive technical document and reference software code for the system integration under the agreement of Marvell International Ltd. Features Lead Free design which supporting Green design requirement. RoHS Compliance. 2 wires, 3 wires QoS aware hardware signaling BT WiFi co-existence supported. Small size suitable for low volume system integration. Low power consumption & excellent power management performance, extend battery life GHz two SKUS for worldwide market. Easy for integration into mobile and handheld device with flexible system configuration and antenna design. Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers.

3 Change Sheet Rev. Date Description of change Approval & Date Page Par Change(s) /24/04 All All Draft version for Review /21/04 Power consumption updated. OS supporting 3.0 3/1/05 Revised the pin out /16/05 Revised footrpint and mechanical drawing

4 TABLE OF CONTENTS 1. EXECUTIVE SUMMARY DELIVERABLES REFERENCE DOCUMENTS TECHNICAL SPECIFICATION ABSOLUTE MAXIMUM RATING RECOMMENDABLE OPERATION CONDITION TEMPERATURE, HUMIDITY VOLTAGE AND CURRENT COMPACTFLASH SPECIFICATION DC ELECTRICALS AC ELECTRICALS COMPACTFLASH PROTOCAL TIMING WIRELESS SPECIFICATIONS RADIO SPECIFICATIONS G RADIO CHARACTERISTICS DIMENSIONS, WEIGHT AND MOUNTING DIMENSIONS WEIGHT MOUNTING SHOCK AND VIBRATION COMPATIBILITY AND INTEROPERABILITY WI-FI LOGO WHQL COMPLIANCE CONFIGURABILITY SECURITY OPERATING SYSTEM COMPATIBILITY LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS EMC PRODUCT SAFETY SPECIFICATION COMPONENT SPECIFICATION RADIO REQUIREMENTS AND APPROVALS PRODUCT MARKING ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS FUNCTIONAL DESCRIPTION HARDWARE HOST INTERFACE LED INTERFACE ANTENNA INTERFACE... 27

5 BLUETOOTH INTERFACE SOFTWARE DESIGN FOR EXCELLENCE (DFX) MANUFACTURABILITY TESTABILITY LOGISTICS HUMAN FACTORS INDUSTRIAL DESIGN RELIABILITY PACKAGE... 29

6 1. EXECUTIVE SUMMARY WM-G-MR g/(b) Wireless module is the solution which targeting for system customer who require small size & cost effective g solution. This module is part of the embedded wireless module product line offered by USI communication BU. The WM-G-MR-02 module providing Surface mount type IO interface for assembly. With different product variant, B to B type connector is provided as option for customers, who want to have Board to board type assembly. This product is targeted for first shipments by end of 4Q 2005 and is designated for use in embedded applications mainly in the mobile device, which required, small size and high data rate wireless connectivity. The application such as, Wireless PDA, DSC, Media Adapter, Barcode scanner, mini-printer, VoIP phone, Data storage device could be the potential application for wireless WM-G-MR DELIVERABLES The following products and software are part of the product SDK.. WM-G-MR-02 Module with packaging Source code Linux. Evaluation kits, including application (CF/SDIO, PCMCIA Adapter card, RF cable with SMA connector, antenna), Software utility which supporting customer for integration, performance test, and homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the WM-G-MR-02 module. Please refer to the development utility of WiFi latest version, Software development package Unit Test / Qualification report Product Specifications. Agency certification pre-test report base on adapter boards

7 3. REFERENCE DOCUMENTS C.I.S.P.R. Pub. 22 CB Bulletin No. 96A CFR 47, Part 15-B CFR 47, Part 15-C CSA C22.2 No EN IEC 950 IEEE MCM QD plan "Limits and methods of measurement of radio interference characteristics of information technology equipment." International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, "Adherence to IEC Standards: Requirements for IEC 950, 2 nd Edition and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing to Standards for Safety of Electrical Equipment (IECEE), April "Unintentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Radio Frequency Devices, Subpart B. "Intentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Subpart C. URL: "Safety of Information Technology Equipment including Electrical Business Equipment, Third Edition." Canadian Standards Association, 1995, including revised pages through July "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization (CENELEC), 1996, (IEC 950, Second Edition, including Amendment 1, 2, 3 and 4). "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization, Intentional Electrotechnical Commission. 1991, Second Edition, including Amendments 1, 2, 3, and 4. Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY) Specifications. Institute of Electrical and Electronics Engineers USI wireless LAN COB module qualification plan latest version 4. TECHNICAL SPECIFICATION The WM-G-MR-02 is a Surface mounted assembly part, technical supporting, package requirement support Surface mount assembly.

8 4.1. ABSOLUTE MAXIMUM RATING Supply Power Max +3.6 Volt Non Operating Temperature - 40 to 85 Celsius Voltage ripple +/- 2% Max. Values not exceeding Operating voltage 4.2. RECOMMENDABLE OPERATION CONDITION TEMPERATURE, HUMIDITY The WM-G-MR-02 module has to withstand the operational requirements as listed in the table below. Operating Temperature -10 to 70 Celsius Humidity range Max 95% Non condensing, relative humidity VOLTAGE AND CURRENT Power supply for the WM-G-MR-02 module will be provided by the host via the power pins Voltage : VDD Operating Voltage 3.3 Volt +- 10% Current Transmit 480 ma Typical Receive 275 ma Idle Deep Sleep connected 1.2 ma Average The power consumption is standard related.

9 4.3. COMPACTFLASH SPECIFICATION DC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the Recommended Operation Condition unless specified. Power supply : VDD=3.3V Symbol Parameter Condition Min Typ Max Units VIH Input high voltage 0.5 VDD - VDD+0.5 V VIL Input low voltage VDD V VOH Output high voltage V VOL Output low voltage V AC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the Recommended Operation Condition unless specified. Power supply : VDD = 3.3V Symbol Parameter Condition Min Typ Max Units IOH Input high voltage =0.7 VDD ma IOL Input low voltage =0.18VDD ma VOH Output high voltage 0.2VDD- 0.6VDD V/ns VOL Output low voltage 0.6VDD-0.2VDD V/ns

10 COMPACTFLASH PROTOCAL TIMING RESET SPECIFICATION

11 ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION

12

13 I/O READ/WRITE TIMING SPECIFICATION

14

15 4.4. WIRELESS SPECIFICATIONS The WM-G-MR-02 module complies with the following features and standards; Features WLAN Standards Antenna Data Rates Medium Access Protocol Network Access Description IEEE 802 Part 11g/b Antennas diversity supported 1,2,5.5, 11, 6,9,12,18,24,36,48,54 Mbps CSMA/CA (Collision Avoidance) with ACK Ad-hoc, Infrastructure 4.5. RADIO SPECIFICATIONS G The Radio specification complies with the spec of g. Features Frequency Band Number of selectable Sub channels Modulation Description GHz (2.4 GHz ISM Band) 14 channels OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK, 16QAM, 64QAM Maximum receive level - 10dBm (with PER < 8%) Output Power 14 dbm +/- 1 dbm for Data rate 1,2,5.5,11,6,9 12 dbm +/- 1 dbm for Data rate 12,18,24,36,48, RADIO CHARACTERISTICS Receive Data Rate Sensitivity -72 dbm 54Mbps 48 Mbps 36Mbps 24Mbps 18Mbps 12Mbps - 85 dbm 11 Mbps 9 Mbps 6 Mbps - 89 dbm 5.5 Mbps - 91 dbm 2.0 Mbps - 93 dbm 1.0 Mbps

16 4.7. DIMENSIONS, WEIGHT AND MOUNTING The following paragraphs provide the requirements for the size, weight and mounting of the WM-G-MR-02 module DIMENSIONS The size and thickness of the WM-G-MR-02 module is listed below: WEIGHT Weight is less than 10 gram including the shielding MOUNTING The WM-G-MR-02 module is surface mounted type component. The LGA (Land Grid Array) solder pads provide mounting mechanism to secure the WM-G-MR-02 module against vibration and shock on the host system.

17 RECOMMEND FOOTPRINT (TOP VIEW)

18 RECOMMEND REFLOW PROFILE Recommended Maximum two time soldering reflow SHOCK AND VIBRATION All shock and vibration test will be performed by using an interface adapter card. Additional shock and vibration tests can be performed on request by using the real host being PDA, Textbook or any other application. The interface card will provide mounting facility base on the recommendation /application guide provided. Vibration Operating Frequency sweep from Hz with a constant 0.25 G input Non-Operational Frequency sweep from Hz with a constant 0.5 G input Shock Operational 25 G peak within 3.75 msec in normal base position Non-Operational 65 G peak in 3.75 msec in normal base position. 30 G within 8 msec square or trapezoidal shock in + and - direction along the 3 axis. (Total 6 shocks) Note: Above tests are executed without packaging material.

19 5. COMPATIBILITY AND INTEROPERABILITY 5.1. WI-FI LOGO The product needs to be verified and proved Wi-Fi certificated base on CF/SDIO form factor to prove the hardware compatibility. For the other specific application, Wi-Fi certification is dependent on the capability and application of the host system WHQL COMPLIANCE Not required for WM-G-MR-02 module, only if the host system required WHQL logo. 6. CONFIGURABILITY No user configuration needed. The CIS and MAC Address will be loaded during production of the WM-G-MR-02 module (FTS). 7. SECURITY The WM-G-MR-02 module supports WEP64/128,WPA, AES-CCM which including TKIP (full version TKIP SSN /WPA). Refer to Marvell Libertas solution. 8. OPERATING SYSTEM COMPATIBILITY Drivers are supported for the following OS: Windows CE 4.2 /.NET, Win CE 5.0 Linux Pocket PC LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS The WM-G-MR-02 module is pre-tested to ensure that all requirements met as set forth in the following sections. Final certification (module certification) requires the antenna of targeted system with a leadtime of 6 weeks. The product deliverable shall be a pre-tested WM-G-MR-02 module. No module level certification on WM-G-MR-02 module EMC The module will be pre-tested to ensure that we can certify the product in the following countries when final certification will be performed on products and or platforms. US. FCC CFR47 Part 15-B, Class B Canada. CSA C22.2, Class B Europe. 89/336/EEC, EMC Directive, including CE Mark

20 ETS , EMC standard for 2.4GHz wideband transmission systems EN55022, Class B (Emissions) EN (Immunity) EN (Harmonic AC current emissions) Japan. VCCI Standard, Class 2 (Emissions) Korea (MIC) 9.2. PRODUCT SAFETY SPECIFICATION The WM-G-MR-02 module is tested and passes successfully the following criteria; The testing is to assure the quality of safety requirement on module. Final certification will be conducted on system level. UL1950 /CSA C EN (IEC 950) CB scheme certification from National certification body as listed in CB bulletin No. 96A COMPONENT SPECIFICATION All components used in this device meet the following component approval requirements. PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board material shall be rated 130 C minimum. CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc. "Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated UL 94V-2 or less flammable when tested to UL 94. WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105 C. PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL "Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94. PB FREE - The entire component Suppliers support Green requirement base on USI s policy. All of the components which including process and materials are Lead Free RADIO REQUIREMENTS AND APPROVALS The WM-G-MR-02 module is tested with adapter card to comply with following standard.

21 The testing is to assure the quality of safety requirement on module. No module level certification will be conducted on WM-G-MR-02 US/CAN: FCC CFR47 Part Japan: TELEC Korea: MIC

22 9.5. PRODUCT MARKING The Module is marked by laser marking which containing the following information: Description: Serial number: Revision: WM-G-XX-XX yyllwkxxxx format to follow USI revision level in PDM System For the serial number the following format will be followed: yy = last two digits of current year ll = Assembly Location: UT = USI Taiwan UM = USI Mexico UC = USI China wk = current week (week period = starting on Monday) xxxx = consecutive number, starting at 0000 at beginning of each week. For the WM-G-MR-02 module, the space for marking is limited; if in case, no enough space, the content of marking can be rearrange. The marking must be visible while individual part and after assembly ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS The use of polychlorinated biphenyls (PCB s) is prohibited (specifically) as dielectric in capacitors or transformers. Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or gamma-butyrolactone (i.e. no el caps allowed). No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product. The use of tantalum capacitors should be minimized in any product of the product family [including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions must be made in the manufacturing process to prevent reverse polarization. The WM-G-MR-02 module hardware design should take the safety of operation into consideration and prevent the potential risk on Labor safety for manufacturing process.

23 10. FUNCTIONAL DESCRIPTION The WM-G-MR-02 module provides and interfaces between Compaq Flash or PC Card Interface, SDIO, SPI which suitable for wide range high end processors or low cost ARM7 or other similar type of processors. The core of the WM-G-MR-02 module is the Marvell 88W83 Chipset solution. The module is design base on the Marvell Libertas solution which contain the flip chip package MAC/BB chip - 88W8385, The transceiver 88W8010 low profile package IC to reduce the size of module. All the other components can be implement by all means to reach the mechanical specification. A simplified block diagram of the WM-G-MR-02 module is depicted in the Fig. below. 88W HARDWARE The following sections provide the requirements for the different physical interfaces of the wireless module : Host Interface Antenna connections LED control signal Bluetooth WiFi coexistence control signals Power GND

24 10.2. HOST INTERFACE Pin definition [ ] means optional function of the pin. PD : Signal pull down internally in the chip by 100K ohm register while initialization. PU : Signal pull up internally in the chip by 100K ohm register while initialization. PD xx ohm : Signal pull down internally in the chip by xx ohm register while initialization. PU xx ohm : Signal pull up internally in the chip by xx ohm register while initialization. 5VT: 5 Volt tolerance pin - xxx : Signal pins end with - are active Low Symbol name Pin # Interface Description Type A00 A01 A02 A03 A04 A05 A06 A07 A08 A09 [DATA2] [NC] A10 D00 D01 D02 D03 D04 57 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. Together with REG Signal to define 16 bit /8 bit I/O mode. 58 CF ADDRESS BUS lines driven by the host system which enables I,PU addressing of 0.5K address range within MAC chip. 59 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 6 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 7 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 8 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 9 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 10 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 15 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 17 CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. SDIO Data line bit2 under SDIO/SPI mode I/O,PU SPI Reserved CF ADDRESS BUS lines driven by the host system, which enables I,PU addressing of 0.5K address range within MAC chip. 56 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU 54 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU 12 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU 32 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU 31 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU

25 D05 29 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D06 27 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D07 25 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D08 55 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D09 53 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D10 52 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D11 30 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D12 28 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D13 26 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D14 11 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU D15 23 CF Data Input/Output line constitute a bi-directional bus. D[15:0] are I/O,PU -STSCHG 51 CF STATUS CHANGE indication to the host. O -REG 5 CF ATTRIBUTE MEMORY SELECT is driven by the host system and I, PU is used to access the Attribute Memory & IO registers 48 CF INPUT ACKNOWLEDGE is driven by module. Is asserted when O,PU -INPACK the device is selected and the device is responding to an I/O Read command. -IOIS16 14 CF INPUT ACKNOWLEDGE is driven by module. Is asserted when O,PU the device is selected and the device is responding to an 16 bit I/O -WAIT 13 CF -WAIT is driven by Module and allows for extending the memory or O,PU I/O cycle RESET 39 CF Used to asynchronously reset the complete Module I, PD 10K ohm -IREQ 38 CF INTERRUPT REQUEST to the host. O,PU -WE -IOWR [DATA3] [- CS] -IORD [DATA1] -CE1 -CE2 [CLK] 49 CF WRITE ENABLE is driven by the host during a memory Write I,PU Access 16 CF I/O Write Strobe is driven by the host and is asserted when the host I,PU wants to write to an on-chip I/O register SDIO DATA line bit 3 I/O,PU SPI Chip select I,PU 18 CF I/O Read Strobe is driven by the host and is asserted when the host I,PU wants to read from an on-chip I/O register SDIO DATA line bit 1 I/O,PU SPI Reserved CARD ENABLE1 is driven by the host system and is used as select I,PU strobe in both I/O and memory mode. Enables odd numbered address bytes 21 CF CARD ENABLE2 is driven by the host system and is used as select I,PU strobe in both I/O and memory mode. Enables odd numbered address bytes SDIO I,PU

26 [CLK] -OE [CMD] Clock signal when operating under SDIO mode SPI I,PU Clock signal when operating under SDIO mode 20 The host drives OUTPUT ENABLE during a memory Read I, PU Access. Command / Response I/O,PU [DI] NC [DATA0] [DO] LED BT_RF_ACTIVE BT_TX_CONFG VDDIO VCC1 VCC2 VCC3 VCC4 VCC5 GND1 ANT1 Data in I, PU 19 CF Reserved for CF application. SDIO Data line bit 0 I/O,PU SPI Data out O,PU 41 LED signal status O PU 200K ohm 42 Use only for Open Standard 3-wire interface I,PU Refer to section K ohm 40 Use only for Open Standard 3-wire interface O,PU Refer to section K ohm V or 5 V clamping control signal I Power 33 DC power supply from host interface. POWER 34 DC power supply from host interface. POWER 35 DC power supply from host interface. POWER 46 DC power supply from host interface. POWER 47 DC power supply from host interface. POWER 2 Antenna Ground GND 1 RF output port(tx/rx). 50 ohm impedance required. O 3 RF output port(tx/rx). 50 ohm impedance required. O ANT2 If no antenna diversity implemented. 50 ohm termination is required. GND2 4 Ground of module GND GND3 37 Ground of module GND GND4 36 Ground of module GND GND5 43 Ground of module GND GND6 44 Ground of module GND GND7 45 Ground of module GND GND8 60 Ground of module GND

27 LED INTERFACE The Wireless Module will provide two control signals to the host and capable to drive an LED to indicate the connectivity and operating status. The LED code and behavior of LED can be set by software ANTENNA INTERFACE Diversity will be supported on the Wireless Module. The RF output pins are two Ball grids with GND around the pin. The output impedance of the pins is 50 Ohms. Good 50 Ohm traces are required to have expected RF performance BLUETOOTH INTERFACE There are interfaces signal to routed to the 60 pin BGA to provide coexistence with Bluetooth modules. There are two BT co-existence interface supported, which are 3 Wire QoS aware, and 2 Wire CSR coexistence. The control signals are provided via the 62 pins BGA with the interface defined as below: Symbol Pin Interface Signal name & description BT_RF_ACTIVE BT_TX_CONFG 42 3 Wire-QoS 2 Wire-CSR 40 3 Wire-QoS BT_REQ Input signal to WLAN BCA device Asserted 1 during BT TX/RX time slots. BT _Priority This pin indicates to WLAN BCA device that BT module is active or will soon be active to TX/RX stage. - BT_TX_CONFIRM 0 Output from WLAN BCA o indicates to BT module a confirmation on TX. 2 Wire-CSR Wlan_Active, This pin indicates to BT module that WLAN is active or will soon be active to TX/RX stage. Note 1: WLAN BCA device is a functional block in 88W8385 works as Bluetooth co-existence management. I/O Type I I O O SOFTWARE Software will be running and integrated by the targeted host system. The following source code will be provided for porting to the embedded system; Linux source code Source code of development utility base on Windows CE & Linux.

28 Nucleus 11. DESIGN FOR EXCELLENCE (DFX) MANUFACTURABILITY No manual adjustments are required in factory. Fudicial marks are provided to for the placement during SMT process TESTABILITY The WM-G-MR-02 module can be tested on the by using adapter card or similar interface. The adapter card must be such that from the FTS the WM-G-MR-02 module is seen and recognized as PC Card or Compaq Flash. No additional test pins are required to support in-circuit testing. Additional pin-out requested to have SPI SEEPROM accessed when module is assembled. The purpose is to refresh the SEEPROM in case module is abnormal due to wrong EEPROM content LOGISTICS All customer specific requirements customization will be implemented at the highest possible level to support build to order and keep the number of modules in SMT to a minimum. Additional module variants might be added base on business potential. 12. HUMAN FACTORS Due to the nature of this product (embedded module) no human factors required 13. INDUSTRIAL DESIGN Due to the nature of this product (embedded module) no industrial design requirements are required. 14. RELIABILITY The WM-G-MR-02 module guarantee an MTBF of 150,000 hrs based on an ambient temperature and workload of 2,920 hours. The workload is based on a unit working for 8 hours per day, 365 days per year. The MTBF estimation base on is Bell code standard, Class II.

29 15. PACKAGE To be updated.

30 Marvell is Trademark of 3 rd Party. For Additional information, please contact the following: Universal Scientific Industrial Co., Ltd. Headquarters 141, Lane 351, Taiping Road, Sec. 1, Tsao-Tuen, Taiwan, Tel: , Fax: , , usi@ms.usi.com.tw