Ediz.: Issue: HERSCHEL DPUs/ICU PACS DPU UNIT DECLARED PROCESSES LIST. Firma Signature. Data Date. Ricciu A. (DP/OI) Conte M.
|
|
|
- Laura Newman
- 8 years ago
- Views:
Transcription
1 Tipo Doc.: Doc.Type: LIST DRD: DRD : A Doc.: Doc. : Pagin a 1 Di Of 5 Titolo : Title : ome & Funzione ame & Function Firma Signature Data Date LISTA DI DISTRIBUZIOE DISTRIBUTIO LIST A I Preparato da: Prepared by: Approvato da: Approved by: Francini E. (PA/QA) Cinquepalmi C. (PA/CC) Laplena D. (PA) Interna / Internal Laplena D. (PA) Francini E. (PA/QA) Magistrati G. (DP/OI) Ricciu A. (DP/OI) Sciortino A. (DP/OI) Villa M. (DP/OI) X X X X X X Magistrati G. (DP/OI) Applicazione autorizzata da: Application authorized by: Ricciu A. (DP/OI) Esterna / External Conte M. (ASI) 1 X Customer / Higher Level Contractor Accettato da: Accepted by: Approvato da: Approved by: =umero copie A=Applicazione I=Informazione =umber copy A=Application I=Information Gestione documenti: Data Management: Firma / Signature Data / Date File: is..doc Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA: Tutti i ritti sono riservati
2 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST EDIZIOE ISSUE DATA DATE REGISTRAZIOE DELLE MODIFICHE / CHAGE RECORD AUTORIZZAZIOE CHAGE AUTHORITY First issue OGGETTO DELLA MODIFICA E SEZIOI AFFETTE REASO FOR CHAGE AD AFFECTED SECTIOS Updated accorng to design mofication, group 7 item 01 (page 14), group 8 item 01 (page 15), group 16 item 03 (page 3). Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
3 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST LISTA DELLE PAGIE VALIDE / LIST OF VALID PAGES PAGIA PAGE EDIZIOE ISSUE PAGIA PAGE EDIZIOE ISSUE PAGIA PAGE EDIZIOE ISSUE PAGIA PAGE EDIZIOE ISSUE PAGIA PAGE EDIZIOE ISSUE 1-5 Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
4 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST TABLE OF COTET SCOPE...5. APPLICABLE & REFECE DOCUMETS APPLICABLE DOCUMETS...5. REFECE DOCUMETS RESPOSIBILITY METHODOLOGY FOR THE COMPILATIO OF THE DPL DECLARED PROCESSES LIST GROUP 1 ADHESIVE BODIG GROUP COMPOSITE MAUFACTURE GROUP 3 ECAPSULATIO/MOULDIG GROUP 4 PAITIG/COATIG GROUP 5 CLEAIG GROUP 6 WELDIG GROUP 7 CRIMPIG/STRIPPIG/WIRE WRAPPIG GROUP 8 SOLDIG/BRAZIG GROUP 9 SURFACE COVSIO TREATMETS GROUP 10 PLATIG GROUP 11 MACHIIG GROUP 1 FORMIG GROUP 13 HEAT TREATMET GROUP 14 SPECIAL FABRICATIO GROUP 15 MARKIG GROUP 16 MISCELLAEOUS PROCESSES GROUP 17 ISPECTIO PROCEDURES... 5 Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
5 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST SCOPE The scope this document is to define all processes to be used in the PACS DPU Unit for HSCHEL DPUs/ICU Program. This document is based on the PACS DPU Unit architecture defined for the Critical Design Review.. APPLICABLE & REFECE DOCUMETS.1 APPLICABLE DOCUMETS AD DOC.. ISSUE TITLE 1 HS-GE-PL-CGS-00 1 HSCHEL DPUs/ICU Product Assurance Plan. REFECE DOCUMETS RD DOC.. ISSUE TITLE 1 ESA PSS The technical reporting and approval procedure for materials, mechanical and processes Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
6 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST RESPOSIBILITY CGS shall be responsible that all listed processes are in accordance with the applicable documents. 4. METHODOLOGY FOR THE COMPILATIO OF THE DPL The processes list consist 11 columns which shall be completed as incated below in accorng to [RD 1] document. Furthermore, the processes shall be classified as specified in table: GROUP PROCESSES 1 Adhesive bonng Composite manufacture 3 Encapsulation/moulng 4 Painting/coating 5 Cleaning 6 Welng 7 Crimping/stripping/wire wrapping 8 Soldering/brazing 9 Surface conversion treatments 10 Plating 11 Machining 1 Forming 13 Heat treatment 14 Special fabrication: processes developed specifically for the programme 15 Marking 16 Miscellaneous processes 17 Inspection procedures Column 1:Item number Sequential item number in each group. One only per process type. Column :Process identification Process name, title, standard identification. Column 3:Specification Issue/Rev Specification number with issue/revision status relevant the process. Column 4:Process description Brief description the process. Column 5:Use and location Define location and use process in the spacecraft/equipment. Column 6:Manufacturer s name This identifies the abbreviated name the manufacturer and name the supplier if fferent (the one who applies the process). Column 7:Associated items in materials list Corresponng materials list or mechanical list item number. Column 8:Criticality the process Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
![METHODOLOGY FOR THE COMPILATIO OF THE DPL The processes list consist 11 columns which shall be completed as incated below in accorng to [RD 1] document.](/docs-images/49/17042347/images/page_6.jpg "Furthermore, the processes shall be classified as specified in table: GROUP PROCESSES 1 Adhesive bonng Composite manufacture 3 Encapsulation/moulng 4 Painting/coating 5 Cleaning 6 Welng 7")
7 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST Incate here whether process is critical or noncritical. In the case a critical process, add reason for criticality (see the definition in [RD 1] document annex A) Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
![In the case a critical process, add reason for criticality (see the definition in [RD 1]](/docs-images/49/17042347/images/page_7.jpg "document annex A) Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE")
8 Doc: HSCHEL DPUs/ICU HSCHEL DPUs/ICU PACS DPU UIT DECLARED PROCESSES LIST Column 9:Justification for validation approval The purpose this column is to enter any adtional information that may be necessary in order to achieve customer s approval. This information comprises reference and issue the RFA/Approval, processes justification file, evaluation reports and waivers. Column 10:Contractor s approval (Prime val.) The Prime contractor shall complete this subcolumn and by doing so confirms that: the line incations are correct and complete the process has passed all applicability tests (inclung quality control testing) A=Approved. The validation is approved by the Contractor. W=Approved with a waiver. The use such processes shall be reduced to a minimum. The waiver number shall be entered in column 9. P=Penng a decision. Processes for which a validation report or a waiver is awaiting the Contractor s decision. O=Open. ew process or process for which investigations and qualification are in progress. D=Deleted. This classification is used for a process which is no longer use. Column 11:Customer approval (Customer val.) This column will be completed by Customer in accordance with the standard comments listed in [RD 1] document annex G. 5. DECLARED PROCESSES LIST In the following pages are listed the processes envisaged during the manufacturing phase. Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
9 Doc: GROUP 1 ADHESIVE BODIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Adhesion non-structural 0 Adhesion identification label and nonstructural PA07 Is.1 3M Technical bulletin manufacturer Adhesion nonstructural with epoxide adhesive Eccobond 85 cat.11. Mixing rations (by weight): 4,5% cat.11, cured 8h-8 C 50%R.H. Adhesion identification label and nonstructural with Scotchweld EC- 16B/A. Mixing rations (by weight): 7pbw A: 5pbw B. cured h-70 C 50%R.H. Adhesion non-structural Adhesion identification label and nonstructural CGS DML:10/01 ot Critical ASA/MSFC MAPTIS: CGS DML:10/03 ot Critical ESA PSS : S- 7, ASA/MSFC MAPTIS: Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
10 Doc: GROUP COMPOSITE MAUFACTURE PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
11 Doc: GROUP 3 ECAPSULATIO/MOULDIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
12 Doc: GROUP 4 PAITIG/COATIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Conformal coating CIBA, HUTSMA Technical Data Sheets Conformal coating on assembled PCBs with ARATHAE (Uralane) 5750 A/B (LV) clear. Mixing rations(by weight):18 A and 100 B (LV). Cured 7 days 5 C or 9 h 65 C 50% R.H. Conformal coating PCBs CGS DML:10/0 ot Critical ASA/MSFC MAPTIS: 009 Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
13 Doc: GROUP 5 CLEAIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Cleaning PA071 Is.1 Cleaning PCBs PCBs the electronic box CGS DML:0/01 and 0/0 ot Critical PA071 is.1 Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
14 Doc: GROUP 6 WELDIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
15 Doc: GROUP 7 CRIMPIG/STRIPPIG/WIRE WRAPPIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Crimping ECSS-Q-70-6A Crimping high reliability electrical connections Wires crimping on connector contacts CGS DML:19/01, 19/07, 19/08, 19/09, 19/10, 19/11 Critical for reliability PA08 Is.1, ECSS-Q-70-6A Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
16 Doc: GROUP 8 SOLDIG/BRAZIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Soldering GD-PL-CGS- 016, ECSS-Q-70-08A 0 SMT Soldering GD-PL-CGS- 016, ESA PSS is.1 Soldering high reliability electrical connections High-reliability soldering for surface-mount and mixedtechnology printed-circuit boards Electrical components on PCBs the electronic box Electrical components on PCBs the electronic box CGS DML: 19/01, 19/04, 19/07, 19/08, 19/09, 19/10, 19711, 0/01 and 0/0 Critical for reliability CGS DML:0/01 and 0/0 Critical for reliability GD-PL-CGS-016, ECSS-Q-70-08A GD-PL-CGS-016, ESA PSS is.1 SMT ESA approval ref.: QM/0-440/BD Tables 1 and Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
17 Doc: GROUP 9 SURFACE COVSIO TREATMETS PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Chemical conversion coating on aluminum alloy with Alone Anoc coating on aluminum alloy 03 Passivation treatment for corrosionresistant steel MIL-C-5541C class 3 MIL-A-865 class type III QQ-P-35C Surface treatment aluminum alloy to prevent corrosion Surface treatment aluminum alloy to prevent corrosion Surface Passivation treatment for corrosionresistant steel Mechanical Mechanical Mechanical DUE GI DML:01/01 to 01/06 Critical MIL-C-5541C class 3 DUE GI DML:01/01 to 01/06 Critical MIL-A-865 class type III DUE GI DML:06/01 and 06/0 Critical QQ-P-35C Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
18 Doc: GROUP 10 PLATIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 ickel plating (electro deposited) QQ--90 A Surface plating copper alloy to prevent corrosion Thermal ssipators on PCBs and/or conductor bridge on PCBs DUE GI DML:0/01and 0/0 ot critical QQ--90 A Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
19 Doc: GROUP 11 MACHIIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Mechanical machining 0 PCBs manufacturing ECSS-Q-70-10A, ECSS-Q A Construction mechanical Manufacturing double side and multilayer PCBs All mechanical PCBs electronic box DUE GI DML:01/01 to 01/06, 0/01 and 0/0, 06/01 and 06/0 PRITCA Denmark, ZICOCELE DIVISIO CSI Italy ot critical DML:0/01 and 0/0 ot critical ECSS-Q-70-10A, ECSS-Q-70-11A Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
20 Doc: GROUP 1 FORMIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
21 Doc: GROUP 13 HEAT TREATMET PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
22 Doc: GROUP 14 SPECIAL FABRICATIO PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
23 Doc: GROUP 15 MARKIG PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO OE Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
24 Doc: GROUP 16 MISCELLAEOUS PROCESSES PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Repair and mofication PCB and solder joints 0 Flight electronic equipment production and inspection control plan PA063 Is.1, ECSS-Q-70-8A GD-PL-CGS- 016 Is.1 03 Cabling ECSS-Q-70-6A, Technical cabling doc. See column Flight electronic equipment production and inspection control plan Electrical Isolation connection by mean shrinkable tubes THMOFIT RT876 PCBs Electronic box Equipment production and inspection control plan Cabling inside the box CGS DML:0/01 and 0/0 Critical for reliability PA063 Is.1, ECSS-Q-70-8A CGS All items ot critical GD-PL-CGS-016 Is.1 CGS DML:19/01, 19/07, 19/08, 19/09, 19/10, 19/11 ot critical ECSS-Q-70-6A Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
25 Doc: GROUP 17 ISPECTIO PROCEDURES PROCESS SPECIFICATIO PROCESS USE AD MAUFACTURE ASSOCIATED S I CRITICALITY OF JUSTIFICATIO FOR PRIME IDETIFICATIO ISSUE/REV. DESCRIPTIO LOCATIO R AME MATIAL LIST THE PROCESS VALIDATIO 01 Incoming inspection procedure 0 MIP and KIP inspection plan 03 Inspection on assembled PCBs 04 Ultrasonic inspection on mechanical 05 DI inspection on mechanical GD-PR-CGS- 070 Is.1 GD-PL-CGS- 003 Is.1 Incoming inspection HI-REL MIP and KIP inspection PA005 Is.1 See column PCBs Electronic box MIL-STD-154 See column Semimanufactu red mechanical materials ASTM-E-1417 See column Mechanical critical Electronic box CGS All items ot Critical GD-PR-CGS-070 Is.1 Electronic box CGS All items ot Critical GD-PL-CGS-003 Is.1 CGS DML:0/01 and 0/0 ot Critical PA005 Is.1 CGS DML:01/01 to 01/06 ot Critical MIL-STD-154 CGS DML:01/01 to 01/06 ot Critical ASTM-E-1417 Questo documento contiene informazioni proprietà CARLO GAVAZZI SPACE SpA. Tutti i ritti sono riservati.
Ediz.: Issue: Firma Signature. Data Date. Sardo G. (DT/MT/) ASI 1 x
Tipo Doc.: Doc.Type: N Doc.: Doc. N : PROCEDURE N DRD: DRD N : NA Di Of Titolo : Title : Preparato da: Prepared by: Nome & Funzione Name & Function Zambra R (DT/MT/) Firma Signature Data Date LISTA DI
EXECUTIVE SUMMARY TFD-TN-CGS-004
New Methods and Systems for Time and Frequency Distribution via Satellite Issue ESTEC Contract N. 1447/00/NL/PB Space Engineering S.p.A. TIME AND FREQUENCY Tipo Doc.: Doc.Type: N Doc.: Doc. N : TECHNICAL
Ediz.: Issue: draft GLASNOWMAP INFORMATION SERVICE - USER REQUIREMENTS DOCUMENT. Firma Signature. Data Date
Tipo Doc.: Doc.Type: N Doc.: Doc. N : Titolo : Title : N DRD: DRD N : 22-02-2002 NA - 1 Di Of 15 Nome & Funzione Name & Function Firma Signature Data Date LISTA DI DISTRIBUZIONE DISTRIBUTION LIST N A I
Ediz.: Issue: Firma Signature. Data Date 07/11/2014 07/11/2014 07/11/2014
Tipo Doc.: Doc.Type: N Doc.: Doc. N : TECHNICAL NOTE N DRD: DRD N : NA 1 Di Of Titolo: Title : Preparato da: Prepared by: Nome &Funzione Name & Function MWI Team Firma Signature Data Date LISTA DI DISTRIBUZIONE
NON CLASSIFICATO (Unclassified)
FUNCTION/DEPARTMENT : BU Sistemi Comunicazione Professionali CAGE CODE: TIPO DOCUMENTO: DOCUMENT TYPE COMPOSTO DI PAGINE: COMPOSED OF PAGES 8 TITOLO: TITLE A N D W A R R A N T Y CODICE: CODE Ediz.: ISSUE
San Francisco Circuits, Inc.
Your Doorway to Innovation San Francisco Circuits, Inc. Bridging Concepts with Reality Flex PCB Introduction to Flex Circuits What is Flex Circuits? From Wikipedia - a technology for assembling electronic
Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies
Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road
Good Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
How to Build a Printed Circuit Board. Advanced Circuits Inc 2004
How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production
Introduction to Manufacturing Process
Introduction to Manufacturing Process What is Manufacturing? The English word manufacture is several centuries old. The term manufacture comes from two Latin words, manus (hand) and factus (make). As per
www.axon-cable.com Power distribution systems
www.axon-cable.com Power distribution systems Power distribution systems As vital components for electrical power distribution in telecommunication satellites and landbased weapon systems, the bus and
Precision Leaded Resistors
FEATURES Approved according to CECC 40101-806 Advanced thin film technology Low TC: ± 15 to Precision tolerance of value: ± 0.1 % and ± 0.25 % Superior overall : class 0.05 Wide precision range: 10 Ω to
Electronic Board Assembly
Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -
- FHIC12 Flue gas denitrification (DeNOx)
DIVISIONE INGEGNERIA E INNOVAZIONE AREA DI BUSINESS SVILUPPO E REALIZZAZIONE IMPIANTI / 1 TITOLO Title Basic requirements: - FHIC12 Flue gas denitrification (DeNOx) Ince Sicurezza Security Index Uso Aziendale
Acceptability of Printed Circuit Board Assemblies
Section No.: 12I.2.3, Sheet 1 of 9 Rev Level: 16 Additional Distribution: PCB Assembly Subcontractors 1.0 Purpose 2.0 Scope Acceptability of Printed Circuit Board Assemblies 1.1 The purpose of this standard
Basic requirements 999GG01834
Basic requirements / DIVISIONE INGEGNERIA E INNOVAZIONE AREA DI BUSINESS SVILUPPO E REALIZZAZIONE IMPIANTI 1 Ince Sicurezza Security Index TITOLO Title Basic requirements for the Suppliers qualification
Processing Hardware and Consumables in GreenData Manager Software
GreenSoft Technology, Inc. 155 S. El Molino, Suite 100 Pasadena, CA 91101 Ph: 323.254.5961 www.greensofttech.com White Paper Processing Hardware and Consumables in GreenData Manager Software Summary One
The Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540
The Alphabet soup of IPC Specifications 340 Raleigh Street Holly Springs, NC 27540 http://www.circuittechnology.com (919) 552 3434 About the IPC IPC-the electronics industry standard Founded in 1957 as
Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production
EMI Shielding Tapes Product Selection Guide. Trusted. Performance. from the. Tape Experts
EMI Shielding Tapes Product Selection Guide Trusted Performance from the Tape Experts 3M EMI Shielding Tapes A wide variety of tapes for EMI shielding and grounding Copper, aluminum, and tin-plated copper
Sargent Controls & Aerospace 5675 West Burlingame Rd. Tucson AZ 85743 PHONE: (520) 744-1000 FAX: (520) 744-8054
Sargent Controls & Aerospace 5675 West Burlingame Rd. Tucson AZ 85743 PHONE: (520) 744-1000 FAX: (520) 744-8054 SUPPLIER EVALUATION CHECKLIST Date: Vendor: Address: City, State, Zip: Web Site: Prepared
E X O M A R S. Phase B1 Product Assurance & Safety Requirements EXM-MS-RS-ESA-00002. ESTEC Noordwijk The Netherlands. Prepared by: ExoMars PA Team
Page: 1/42 Appendix 3 to /05/NL/GM E X O M A R S Phase B1 Product Assurance & Safety Requirements EXM-MS-RS-ESA-00002 Prepared by: ExoMars PA Team ESTEC Noordwijk The Netherlands Page: 2/42 DOCUMENT CHANGE
Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
DIVISION: 22 00 00 PLUMBING SECTION: 22 11 16 DOMESTIC WATER PIPING REPORT HOLDER: CURAFLO IP LLC 4035 E. OASIS STREET MESA, AZ 85215
0 ICC ES Report ICC ES (800) 423 6587 (562) 699 0543 www.icc es.org 000 Most Widely Accepted and Trusted PMG 1057 Valid: 02/15 to 02/16 DIVISION: 22 00 00 PLUMBING SECTION: 22 11 16 DOMESTIC WATER PIPING
IPC Certification Centre
A DVANCED REWORK TECHNOLOGY LTD IPC Certification Centre IPC-A-610D Training and Certification Programme (Revision D Training) Certified Trainer Application Specialist IPC J-STD-001D Training and Certification
TEXNIKH 1501-05-07-02-00:2009 HELLENIC TECHNICAL SPECIFICATION. ежглеяис тгс йубеямгсеыс (теувос еутеяо) 33063 2009-12-23 ICS: 93.080.
ежглеяис тгс йубеямгсеыс (теувос еутеяо) 33063 2009-12-23 ICS 9308040 1501-05-07-02-002009 TEXNIKH HELLENIC TECHNICAL SPECIFICATION Road lighting columns and fixtures 10 313 111 45 33064 ежглеяис тгс йубеямгсеыс
Make up Epoxy adhesive
Epoflex Base Materials series of MSC Polymer AG offers flexible base materials from simple single side flexible boards, flex-rigid applications up to highly complex multilayer boards. The dielectric is
T A B L E T 1 T E S T S A N D I N S P E C T I O N C A B L E P C U T A N D P C U T - A
T A B L E T 1 1 of 7 Tests & Inspection Cable PCUT & PCUT-A (Table T1) T E S T S A N D I N S P E C T I O N C A B L E P C U T A N D P C U T - A No. Test Scale MOC Requirements G 20:10:001:01 Defined Test
Assembly and Cleaning. Prototype FDC Wire Boards
Assembly and Cleaning Prototype FDC Wire Boards Fernando J. Barbosa, Kim S. Shinault, Michelle Brisiel 23 January 2009 1. Introduction Particle detectors employ printed circuit boards (PCB) to assemble
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using
7.1 Safety Precautions-Aircraft and Workshop 3 3 3. 7.2 Workshop Practices 3 3 3
Note: This module does not apply to category B3. Relevant subject matters for category B3 are defined in module 7B. 7.1 Safety Precautions-Aircraft and Workshop 3 3 3 Aspects of safe working practices
L-3 Communications Corporation AMI Purchase Order Supplement No. 3 Quality Assurance
Q10 QUALITY SYSTEM REQUIREMENTS Q10A Q10B ISO 9001:2008 Seller s quality system shall be in compliance with the requirements of ISO 9001, Model for in Design, Development, Production, Installation and
359/518. SMT: Electonic Interface for Supplier. DIGIT/R2/PO/2010/007 Desktop2009 - Tendermg specifications
359/518 Annex 7: SMT: Electonic Interface for Supplier DIGIT/R2/PO/2010/007 Desktop2009 - Tendermg specifications 360/518 SMT Integration Point (Exchange) EIS PROCESS REFERECE 361/518 3.4.Oa SMT_ITPOIT_EXCH
GLAS Integration Procedure of Flight Laser into Position #1 GLAS-544-PROC-008
GLAS Integration Procedure of Flight Laser into Position #1 GLAS-544-PROC-008 December 7, 2000 Note: The Laser is ESD sensitive. ESD precautions shall be followed per NASA-STD-8739.7 Note: This procedure
NORTH ORANGE COUNTY COMMUNITY COLLEGE DISTRICT SECTION 27 05 26 GROUNDING AND BONDING FOR COMMUNICATION SYSTEMS
SECTION GROUNDING AND BONDING FOR COMMUNICATION SYSTEMS RELATED SECTIONS: Section 27 00 00 General Requirements Section 27 02 00 Communication General Requirements Section 27 05 28 Pathways for Communications
Material and Components Used for UL/C-UL/ULC Mark Follow-Up Services
MARK INTEGRITY PROGRAM UL Traceability Requirements Material and Components Used for UL/C-UL/ULC Mark Follow-Up Services UL defines minimum requirements for material and components used in UL certified
White paper. SACE Tmax XT Circuit-Breaker Terminals and Connection
White paper SACE Tmax XT Circuit-Breaker Terminals and Connection Circuit-Breaker Terminals and Connections Index Introduction... 2 1. Components used for wiring... 3 1.1. Electrical...3 1.2. Flexibility
Lead & Magnet Wire Connection Methods Using the Tin Fusing Method Joyal A Division of AWE, Inc.
Lead & Magnet Wire Connection Methods Using the Tin Fusing Method Joyal A Division of AWE, Inc. Abstract The technology for connecting lead and magnet wires for electric motors and electro mechanical devices
Specifications for Programs: 737, 747, 757, 767, 777, 787
= Performed by GKN BAC 5000 AN General Sealing 6-262, 6-265, 6-267, 6-270 PSD for 787 Only: 6-242, 6-269, 6-271 PSD for 777 Only: 6-261,6-264, 6-266, 6-269, 6-271 BAC 5004 L Installation of Permanent Fasteners
Siemens Chemnitz Siemens AG 2010. Alle Rechte vorbehalten.
Siemens Chemnitz Seite 1 ACOD Leipzig, 18th Feb 2010 Organization: R&D and Production Research & Development CNCs NC components Motion control PLC-Components Distributed I/Os Peripheral modules Power Electronics
Flex Circuit Design and Manufacture.
Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit
Guiding Principles for the contents of Particular Materials Appraisals (Version approved at the WGP on 21 November 2006)
PE- 03-28 - rev 5 21 November 2006 Page 1 of 5 Guiding Principles for the contents of Particular Materials Appraisals (Version approved at the WGP on 21 November 2006) Introduction A Particular Material
Flexible Circuit Simple Design Guide
Flexible Circuit Simple Design Guide INDEX Flexible Circuit Board Types and Definitions Design Guides and Rules Process Flow Raw Material Single Side Flexible PCB Single Side Flexible PCB (Cover layer
Flexible Circuits and Interconnect Solutions More than a manufacturer
Flexible Circuits and Interconnect Solutions More than a manufacturer HISTORY Currently 150 employees Focussed on Flex Technologies & Assembly Largest flex circuit manufacturer in the UK 3 rd /4 th largest
PRESENTACIÓN DE LA COMPAÑIA. Company presentation 2014
PRESENTACIÓN DE LA COMPAÑIA Company presentation 2014 ABOUT US SCP: Distribution know-how in connectors, cables, accessories, heat shrink and tools SINTERSA: Unique know-how in design, manufacture, test
PRODUCT SHEET 1 MIDLAND LEAD MANUFACTURERS LTD S CAST LEAD SHEET
CI/SfB (49) Mh8 Midland Lead Manufacturers Ltd Kiln Way Woodville Swadlincote Derbyshire DE11 8ED Tel: 01283 224555 Fax: 01283 550284 e-mail: sales@midlandlead.co.uk website: www.midlandlead.co.uk Agrément
Embedding components within PCB substrates
Embedding components within PCB substrates Max Clemons, Altium - March 19, 2014 Continued pressure for electronic devices that provide greater functionality in ever-smaller formfactors is not only providing
Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental
IPC-SM-840C. Qualification and Performance of Permanent Solder Mask IPC-SM-840C. The Institute for. Interconnecting. and Packaging Electronic Circuits
The Institute for Interconnecting and Packaging Electronic Circuits Qualification and Performance of Permanent Solder Mask January 1996 A standard developed by the Institute for Interconnecting and Packaging
SECTION 23 00 01 HEATING, VENTILATION AND AIR CONDITIONING EQUIPMENT
SECTION 23 00 01 HEATING, VENTILATION AND AIR CONDITIONING EQUIPMENT PART 1 - GENERAL 1.1 DESCRIPTION A. The Work specified in this Section consists of designing, furnishing and installing factory-assembled
FLEXIBLE CIRCUITS MANUFACTURING
IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available
in Tunisia... invest in Tunisia
Aerospace I n d u s t r y in Tunisia... invest in Tunisia invest in Tunisia A booming industry 9,000 jobs 65 companies Aerospace industry in Tunisia is experiencing a real boom over the last decade illustrated
WELCOME TO VIASION. www.viasion.com
WELCOME TO VIASION www.viasion.com BRIEF INTRODUCTION Viasion Technology Co., Ltd is a professional Printed Circuit Board (PCB) manufacturer in China. With around 1500 employees totally in 2 different
How To Test A Power Distribution Unit
PDUAC3U SERIES AC POWER DISTRIBUTIO UITS www.unipowerco.com Manual o. PDUAC3U-1 pduac3u-man-rev1-1015.indd 2015 UIPOWER LLC All Rights Reserved ORTH AMERICA 3900 Coral Ridge Drive, Coral Springs, Florida
About Company. ESABD code: 58067
About Company ESABD code: 58067 G.L.Electronic was established in 2003, In 2008 was registered as G.L.Electronic Ltd. Manufacturing Hi-rel electronics in the field of Ground and Space technologies Space
www.pdffactory.com The T-lam System
The T-lam System T-lam..Where It All Begins.. T-preg The Heart of the T-lam System Three Main Functions Conducts Heat Insulate Electrically Adhesive Bonding Layer The T-lam System T-Preg Thermally Conductive
Scotch-Weld TM. Epoxy Adhesive 1838 B/A Green 1838 B/A Tan 1838-L B/A Translucent. Technical Data February, 2016. Product Description
3 Scotch-Weld TM 1838 1838 1838-L Technical Data February, 2016 Description 3M TM Scotch-Weld TM s 1838 and are controlled flow products; Scotch-Weld 1838-L is flowable. These epoxy adhesives are two-part,
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing. PCB Background Information (courtesy of Wikipedia)
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing Introduction As you saw on the video (http://www.youtube.com/watch?v=9x3lh1zfggm), photolithography is a way to nanomanufacture
Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Specification for Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards Developed by the Plating Processes Subcommittee (4-14) of the Fabrication Processes
COPPER FLEX PRODUCTS
COPPER FLEX PRODUCTS WHY FLEX? Molex ible Printed Circuit Technology is the answer to your most challenging interconnect applications. We are your total solution for ible Printed Circuitry because we design
TRAINING SERVICES. Training Courses Curriculum Development Highly Skilled Staff. Training Courses Curriculum Development Highly Skilled
TRAINING SERVICES Training Courses Curriculum Development Highly Skilled Staff Training Courses Curriculum Development Highly Skilled Staff 256-705-5528 www.stielectronicsinc.com Training Courses Hands-on
Logistics. EMS manufacturing solutions can be supplied in any format to suit a customer s requirements, including;
Vision EMS (Electronic Manufacturing Solutions Ltd,) offers a complete range of manufacturing solutions for the CEM electronics marketplace. EMS is focused on the provision of fast, cost effective solutions
Workmanship Standards Personnel Training and Certification Explained. Jeannette Plante. NASA Workmanship Standards Program Manager
Workmanship Standards Personnel Training and Certification Explained Jeannette Plante NASA Workmanship Standards Program Manager Personnel training and certification is the most recurrent compliance audit
NAPCA BULLETIN 18-99 APPLICATION PROCEDURES FOR CONCRETE WEIGHT COATING APPLIED BY THE COMPRESSION METHOD TO STEEL PIPE
NAPCA BULLETIN 18-99 APPLICATION PROCEDURES FOR CONCRETE WEIGHT COATING APPLIED BY THE COMPRESSION METHOD TO STEEL PIPE GENERAL a. These specifications may be used in whole or in part by any party without
SECTION 05 42 16 COLD-FORMED METAL DECK FRAMING Elevations Steel Deck Framing by Trex
(Specifier Note: The purpose of this guide specification is to assist the specifier in correctly specifying cold-formed metal deck framing products and execution. The specifier needs to edit the guide
INTRODUCTION: PURPOSE:
UMBRA CUSCINETTI, INC. 2916 100 th Street SW Everett, WA 98204-1340 USA 425-743-2577 FAX: 425-347-0682 Printed versions may not be the latest. Suppliers shall utilize the latest version which can be found
3 Scotch-Weld TM. Structural Adhesive Films AF 6 AF 10 AF 13. Technical Data July, 2001
3 Scotch-Weld TM Technical Data July, 2001 Introduction 3M Scotch-Weld AF 6, AF 10, AF 13 are unsupported, thermosetting adhesives in film form developed for the structural bonding of metals. These products
For board-to-fpc. Narrow Pitch Connectors (0.35mm pitch)
For board-to-fpc Narrow Pitch Connectors (0.35mm pitch) S35 Series New FEATURES 1. 1.7 mm wide slim two-piece type connector Mated height 0.6 mm Smaller compared to A4F series Width: Approx. 44% down
INSPECTION IN-PROCESS AND FINAL QUALITY ASSURANCE
INSPECTION IN-PROCESS AND FINAL QUALITY ASSURANCE 1.0 SCOPE: The purpose of this procedure is to document mandatory to ensure compliance to Project Requirements. inspection points and 2.0 REFERENCE DOCUMENTS:
How To Test A Base Axe
Scotch-Weld DP760 Product Data Sheet Updated : February 2009 Supersedes: June 2001 Product Description DP760 epoxy adhesive is a non-sag, two-part room temperature curing adhesive designed for use when
AMPSEAL* Automotive Plug Connector and Header Assembly
AMPSEAL* Automotive Plug Connector and Header Assembly Application Specification 24 SEP 97 Rev E All dimensions are given in millimeters unless otherwise specified. All dimensional tolerances are +0.2
SPECIAL INSPECTION AND TESTING AGREEMENT INTERNATIONAL BUILDING CODE
Community Development Permit Services SPECIAL INSPECTION AND TESTING AGREEMENT INTERNATIONAL BUILDING CODE PROJECT NAME PROJECT ADDRESS PERMIT NUMBER CITY RECEIVED STAMP AND INITIALS Instructions: BEFORE
A COMPARISON OF ALUMINUM VS. COPPER AS USED IN ELECTRICAL EQUIPMENT
Larry Pryor, P.E. Sr. Specification Engineer, GE Consumer & Industrial Rick Schlobohm, P.E. Sr. Specification Engineer, GE Consumer & Industrial Bill Brownell, P.E Specification Engineer, GE Consumer &
Chapter 14. Printed Circuit Board
Chapter 14 Printed Circuit Board A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper
How to Avoid Conductive Anodic Filaments (CAF)
How to Avoid Conductive Anodic Filaments (CAF) Ling Zou & Chris Hunt 22 January 20 1 Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit
UGVCL/SP/591/11KV HT AB CABLE
TECHNICAL SPECIFICATION FOR 11KV AERIAL BUNCHED CABLES FOR OVERHEAD LINES (CROSSED LINKED POLYTHENE DRY GAS CURED) 1. SCOPE This specification covers requirements of XLPE insulated, 11 KV Aerial Bunched
PCB Quality Inspection. Student Manual
PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the
Zero peel strength of acrylic pressure sensitive adhesive is at about 45 C (-50 F).
PRODUCT BULLETIN Aluminum Polyimide Acrylic (3M 966) PSA First Surface Aluminum Coated Polyimide Tape with Acrylic 3M 966 Adhesive TAPES Sheldahl Brand Materials first surface aluminized polyimide tape
Directory chapter 04
M Directory chapter 04 D-Sub Mixed subminiature D connectors New Page D-Sub mixed connector system general information................... 04.02 Contact arrangements............................................
CLASSIFICATION SYSTEM BY FIELD AND SUB-FIELD OF EXPERTISE SUPPLIERS REGISTRY OF GOODS AND SERVICES ENAP GROUP OF COMPANIES I. Suppliers are classified in three groups: Classification Equipments, materials
INDIAN STANDARDS (BIS) ON WELDING
** IS 82:957 Glossary of terms relating to welding and cutting of Sep 2008 metals 2 IS 83:986 Scheme of symbols for welding (revised) Sep 2008 3 IS 84:2004 Covered electrodes for manual metal arc welding
Cables. Accessories. For Force, Torque and Strain Sensors
Accessories Cables For Force, Torque and Strain Sensors Charge mode, high impedance piezoelectric measurement demands highly insulated coaxial cables and connectors to ensure an insulation resistance greater
Embedded Parts Introduction - Anchors
In the plant construction or process plants such as chemical, petrochemical, gas or power plants various disciplines are brought into contact and built on each other. Civil, mechanical, electro technical
Guidelines for the management of chemical substances in products
Guidelines for the management of chemical substances in products Version 3.0 Issued on 20th February 2013 Introduction The Guidelines for the Management of Chemical Substances in Products specify common
07 21 19 Guide Specification STAYFLEX CORROSION CONTROL AND THERMAL INSULATION SYSTEM
07 21 19 STAYFLEX CORROSION CONTROL AND THERMAL INSULATION SYSTEM 7819 Broadview Road Cleveland, OH 44131 800-522-4522 February, 2011 SPEC NOTE: This guide specification is intended for use when specifying
The National Armored Cable Manufacturers Association Presents. Installation Standard for Types AC and MC Cables
The National Armored Cable Manufacturers Association Presents Installation Standard for Types AC and MC Cables An ANSI Standard Original document jointly produced by NECA and NACMA as Standard for Installing
www.centralcoating.com Largest Applicator The the Northeast TEL: 508-835-6225 of Coatings in
TEL: 508-835-6225 www.centralcoating.com in The Largest Applicator of Coatings in the Northeast cosmetic PAINTING With over 30 years of experience Central Coating has a solid history of providing our customers
CERTIFICATE NAME OF PRODUCT MANUFACTURER PRODUCT DESCRIPTION CERTIFICATION PROCEDURE. No VTT C-6044-10 Date of issue 11.10.2010, Updated July 1, 2011
CERTIFICATE NAME OF PRODUCT No VTT C-6044-10 Date of issue 11.10.2010, Updated July 1, 2011 H-CONTROL REFLEX+ reflective insulating vapour control layer for roof and wall applications MANUFACTURER ACTIS
Electrical tests on PCB insulation materials and investigation of influence of solder fillets geometry on partial discharge
, Firenze, Italy Electrical tests on PCB insulation materials and investigation of influence of solder fillets geometry on partial discharge A. Bulletti, L. Capineri B. Dunn ESTEC Material and Process
17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie
17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is
SECTION 16461 DRY-TYPE TRANSFORMERS
SECTION 16461 PART 1 - GENERAL 1.1 SECTION INCLUDES A. Furnishing and installation of and testing of cast resin dry type MV/LV distribution transformer in accordance with specifications and drawings. Any
About Sintered Products. Products for: - Resistance Welding Electrodes - Electrical Contact Materials. Product Definition & Uses.
AMPCO Sintered Alloys Products for: - Resistance Welding Electrodes - Electrical Contact Materials Product Definition & Uses The high electrical and thermal conductivity of copper is combined with arc-resistant
Printed Circuit Boards
Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the
Electronics Manufacturing Services, Since 1986
Page 1 of 5 Electronics Manufacturing Services, Since 1986 Professionalized Products and Services, Inc. (PPSI) is a contract manufacturer, located in the Houston area, specializing in PCB assembly and
PIPING SYSTEM - ABRASIVE SLURRIES Engineering Standard Specification. 96 B. Riutta
PIPING SYSTEM - ABRASIVE SLURRIES Engineering Standard Specification Number: 3503-11.2.610 Rev. 2 Rubber Lined Steel Pipe and Fittings Mechanically Coupled Plain End Type System Issued Revised Approved
City of San Diego, CWP Guidelines
PART 1 -- GENERAL SECTION 08520-1.1 WORK OF THIS SECTION City of San Diego, CWP Guidelines A. The WORK of this Section includes providing aluminum windows with frames, bracing, glazing attachments, screens,
00.037.701 Rigid Printed Circuit Board Requirements
00.037.701 Rigid Printed Circuit Board Requirements Issued by: Engineering Effective Date: 10/8/2015 Rev. D Pg. 1 of 9 Approved: 10/8/2015 8:10 AM - Christy King, Quality Engineer 2.0 OBJECTIVE & SCOPE:
2.1.1. Distributors In addition to the requirements noted herein, Distributors shall have a Quality System
1. Purpose This document defines requirements for suppliers providing aerospace and defense materials, products and services to Electromech Technologies. Supplier acceptance of a purchase order from Electromech