European bespoke wafer processing & development solutions for : Grinding, CMP, Edge Treatment, Wafer Bonding, Dicing and Cleaning

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "European bespoke wafer processing & development solutions for : Grinding, CMP, Edge Treatment, Wafer Bonding, Dicing and Cleaning"

Transcription

1 European bespoke wafer processing & development solutions for : Grinding, CMP, Edge Treatment, Wafer Bonding, Dicing and Cleaning Georges Peyre : Sales & Marketing Director SEMICON Europa Grenoble

2 Rockwood Wafer Services Milestones Created in : Major Investment : $7m Capacity & Capability 0,12µ and 0,09µ defects for 200mm Wafer Reclaim : Strategic Diversification Program (Wafer thinning services and sapphire) 2009 : Investment in an ERP system : Investment in a new thinning line. IS0 9001, ISO 14001, OHSAS 18001: Integrated Management System R&D projects (SCS : OPTIM, COMET & Catrene : Master3D)

3 Rockwood Wafer Services Activities Historical Business Volume : Wafer reclaim: recovery of Test & Product wafers, to be re-used as test wafers. Wafer supply: reclaim or virgin Strip & Clean: layer removal only to supplement or replace internal reclaim. Process mapping: an audit exercise which aim to find rules to reduce cost and optimise wafer usage. Diversified in Wafer Services : Wafer Processing: offering the following types of services Grinding/Thinning (including TAIKO) Dicing (including DBG) Wafer Resizing Edge Shaping / Trimming CMP/Cleaning (wafer surface preparation before Bonding) Wafer Bonding Sapphire substrate reclaim: recovery of substrates to an EPI ready state. Sapphire surface preparation: proprietary cleaning process to de-metalize sapphire substrates for high specification applications.

4 X-Ray detector X X-Ray source X-ray detector Sample to be characterized Back side illumination CMOS wafer Photodiode wafer 4

5 Rockwood Process Flow INSPECTION Thickness meas. Final clean room ADC Si substrate (> 7xx µm) TAPING CMP / Cleanroom 100 ADC Si substrate (> 7xx µm) To protect CMOS side & make the handling safer THINNING ( 2xx µm) CMP / Cleanroom steps: rough + fine wheel ADC Si substrate (~ 2xx µm) The wafer is highly warped and the surface damaged POLISHING ( 2xx µm) + clean 2 steps: bulk + final polish ADC Si substrate (~ 2xx µm) DE TAPING CMP / Cleanroom 100 ADC Si substrate (~ 2xx µm) FINAL CLEAN & Thickness meas Final clean room ADC Si substrate (~ 2xx µm) 5

6 Bonding Process Step. After Surfaces activation Contact is made a bonding wave propagate, generated by a light mechanical pressure Bonding wave front

7 Edge Trimming Removing or, shaping the edge of a wafer is becoming mandatory for some specific applications. For example, a wafer is thinned as part of the process flow and still facing further processing steps. A typical application is when using a carrier wafer to enable backside processing of thin wafers. The edge of the thin wafer gets sharp and very fragile, making any further process steps very difficult to manage. 7

8

9 CERN ALICE LHC Rockwood working with the CERN helping in the development of the ALICE detector experiments on the LHC.

10 Typical wafer processing line Services Bonded Pair Thinning:- Achieve Targeted thickness of one bonded pair substrate, to include Silicon, III/V and or Glass bonded substrates on silicon. Bonding Surface preparation:- Achieve targeted thickness and Surface Microroughness with targeted LPD's Specification. CMP:- Achieve targeted removal or microroughness on Strained SiGe EPI or Silicon. Thin + Double side Polishing:- To thin wafers and achieve low Ra, LPD s and Metallics on both side of the wafer, prepared for subsequent fabrication. SOI thinning:- To thin Handle or Product wafer to specified thickness, Ra, LPD spec and surface metal levels. Pre Packagaging Grinding:- Achieve targeted thickness and surface Ra post wafer fabrication ready for encapsulation and packaging. Wafer carriers:- Ultra Flat Wafers and very low Average wafer to wafer thickness variation wafers Wafer re-sizing:- Able to cut and edge chamfer larger wafers to any standard diameter. Wafer Bonding :- Up to 200mm Silicon, Quartz and other substrates. 10

11 Rockwood: Quality Systems SINCE 2009 : Consolidated in one integrated system: Quality System : ISO 9001:2008 Environment : ISO Safety & Health : OHSAS

12 MASTER_3D MAnufacturing Solutions Targeting competitive European production in 3D

13 SCS Cluster Co-Exhibitor booth number

Figure 1 Wafer with Notch

Figure 1 Wafer with Notch Glass Wafer 2 SCHOTT is an international technology group with more than 125 years of experience in the areas of specialty glasses, materials and advanced technologies. With our high-quality products and

More information

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien

Dual Integration - Verschmelzung von Wafer und Panel Level Technologien ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to

More information

Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016

Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016 Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms Christophe Maleville Substrate readiness 3 lenses view SOI Consortium C1 - Restricted Conference Tokyo 2016

More information

Chapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1

Chapter 1 Introduction to The Semiconductor Industry 2005 VLSI TECH. 1 Chapter 1 Introduction to The Semiconductor Industry 1 The Semiconductor Industry INFRASTRUCTURE Industry Standards (SIA, SEMI, NIST, etc.) Production Tools Utilities Materials & Chemicals Metrology Tools

More information

An Overview of Optical Components

An Overview of Optical Components An Overview of Optical Components For over 40 years, Boston Piezo-Optics specialists have been selecting appropriate quality and cuts of crystal quartz and sapphire for a wide variety of applications.

More information

Lapping and Polishing Basics

Lapping and Polishing Basics Lapping and Polishing Basics Applications Laboratory Report 54 Lapping and Polishing 1.0: Introduction Lapping and polishing is a process by which material is precisely removed from a workpiece (or specimen)

More information

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT)

Fraunhofer ISIT, Itzehoe 14. Juni 2005. Fraunhofer Institut Siliziumtechnologie (ISIT) Research and Development centre for Microelectronics and Microsystems Applied Research, Development and Production for Industry ISIT applies an ISO 9001:2000 certified quality management system. Certificate

More information

Crystal Structure and Growth

Crystal Structure and Growth Crystal Structure and Growth Source: USNA EE 452 Course on IC Technology EE-452 13-1 Atomic Order of a Crystal Structure EE-452 13-2 Amorphous Atomic Structure EE-452 13-3 Unit Cell in 3-D Structure Unit

More information

Welcome & Introduction

Welcome & Introduction Welcome & Introduction Accelerating the next technology revolution Sitaram Arkalgud, PhD Director Interconnect Temporary Bond Workshop SEMICON West July 11, 2011 San Francisco CA Copyright 2008 SEMATECH,

More information

MEMS Processes from CMP

MEMS Processes from CMP MEMS Processes from CMP MUMPS from MEMSCAP Bulk Micromachining 1 / 19 MEMSCAP MUMPS processes PolyMUMPS SOIMUMPS MetalMUMPS 2 / 19 MEMSCAP Standard Processes PolyMUMPs 8 lithography levels, 7 physical

More information

Winbond W2E512/W27E257 EEPROM

Winbond W2E512/W27E257 EEPROM Construction Analysis Winbond W2E512/W27E257 EEPROM Report Number: SCA 9703-533 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:

More information

Silicon-On-Glass MEMS. Design. Handbook

Silicon-On-Glass MEMS. Design. Handbook Silicon-On-Glass MEMS Design Handbook A Process Module for a Multi-User Service Program A Michigan Nanofabrication Facility process at the University of Michigan March 2007 TABLE OF CONTENTS Chapter 1...

More information

Ultra Thin Body and Buried oxide substrate supply chain

Ultra Thin Body and Buried oxide substrate supply chain 1 Ultra Thin Body and Buried oxide substrate supply chain 2013 / 6 / 15 FD-SOI Workshop at Kyoto, Japan 2 Outline 1. Introduction of Shin Etsu 2. SOI Wafer Line Up 3. Quality Data of FD SOI Wafer 4. Capability

More information

Contamination. Cleanroom. Cleanroom for micro and nano fabrication. Particle Contamination and Yield in Semiconductors.

Contamination. Cleanroom. Cleanroom for micro and nano fabrication. Particle Contamination and Yield in Semiconductors. Fe Particles Metallic contaminants Organic contaminants Surface roughness Au Particles SiO 2 or other thin films Contamination Na Cu Photoresist Interconnect Metal N, P Damages: Oxide breakdown, metal

More information

Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions

Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions Innovative Wafer and Interconnect Technologies - Enabling High Volume Low Cost RFID Solutions Innovative Wafer & Interconnect Technologies Outline Low cost RFID Tags & Labels Standard applications and

More information

Altatech. Junior Scientist and Industry Annual Meeting Enabling solutions for the nanoworld. March 4 th Yanqing LIU

Altatech. Junior Scientist and Industry Annual Meeting Enabling solutions for the nanoworld. March 4 th Yanqing LIU Enabling solutions for the nanoworld www.altatech-sc.com Junior Scientist and Industry Annual Meeting 2016 March 4 th 2016 Yanqing LIU Altatech 611 rue Aristide Bergès, Z.A. de Pré Millet 38330 MONTBONNOT

More information

Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes

Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes Applications Laboratory Report 86 Evaluating Surface Roughness of Si Following Selected Processes Purpose polishing of samples is a common application and required for a variety of manufacturing and research

More information

Plug-n-play. electrical contact system eases medical device design INSIDE: September Page 21

Plug-n-play. electrical contact system eases medical device design INSIDE: September Page 21 September 2010 www.designworldonline.com INSIDE: >> SOLAR POWER: Advanced Motion Control Adds Efficiency to Solar Manufacturing Processes PAGE 42 >> MOTION CONTROL: Encoders for the Nanotech World PAGE

More information

Wafer Placement Repeatibility and Robot Speed Improvements for Bonded Wafer Pairs Used in 3D Integration

Wafer Placement Repeatibility and Robot Speed Improvements for Bonded Wafer Pairs Used in 3D Integration Wafer Placement Repeatibility and Robot Speed Improvements for Bonded Wafer Pairs Used in 3D Integration Andrew C. Rudack 3D Interconnect Metrology and Standards SEMATECH Albany, NY andy.rudack@sematech.org

More information

Stéphane Renard Founder of Tronics

Stéphane Renard Founder of Tronics From Full Custom to Generic Platforms : Solutions for Application Specific MEMS Components Grenoble Day - Meijo University, Nagoya, Japan March 11th 2010 Stéphane Renard Founder of Tronics AGENDA From

More information

Module production and testing for the CMS pixel Phase 1 upgrade

Module production and testing for the CMS pixel Phase 1 upgrade Module production and testing for the CMS pixel Phase 1 upgrade GK Plenary Workshop, 28th 30th September 2015, Freudenstadt (IEKP) INSTITUT FÜR EXPERIMENTELLE KERNPHYSIK (IEKP), DEPARTMENT DEPARTMENT OF

More information

Dry Film Photoresist & Material Solutions for 3D/TSV

Dry Film Photoresist & Material Solutions for 3D/TSV Dry Film Photoresist & Material Solutions for 3D/TSV Agenda Digital Consumer Market Trends Components and Devices 3D Integration Approaches Examples of TSV Applications Image Sensor and Memory Via Last

More information

How to work in the NL-cleanroom (1)

How to work in the NL-cleanroom (1) How to work in the NL-cleanroom (1) Multi-application lab: Training, support and tools By Christiaan Bruinink, Meint de Boer and Bert van den Akker Contents Multi-application cleanroom Objectives Path

More information

Zero Width Glass Cutting with CO 2 Laser

Zero Width Glass Cutting with CO 2 Laser Zero Width Glass Cutting with CO 2 Laser Mohammed Naeem GSI Group, Laser Division Cosford Lane, Swift Valley Rugby mnaeem@gsig.com Introduction Laser cutting of glass in not a novel technique, excellent

More information

Deposition of hermetic glass thin films for Opto and MEMS

Deposition of hermetic glass thin films for Opto and MEMS Deposition of hermetic glass thin films for Opto and MEMS Dr. Ulli Hansen 1 Company Profile Founded in 2006 Headquarters and Production in Dresden, Germany Production and R&D Location in Berlin, Germany

More information

Flex Circuits for the ATLAS Pixel Detector

Flex Circuits for the ATLAS Pixel Detector Flex Circuits for the ATLAS Pixel Detector P. Skubic University of Oklahoma Outline ATLAS pixel detector ATLAS prototype Flex hybrid designs Performance simulations Performance measurements Wire bonding

More information

Temporary Bond Material and Process: Survey Drivers and Reference Flow

Temporary Bond Material and Process: Survey Drivers and Reference Flow Accelerating the next technology revolution Temporary Bond Material and Process: Survey Drivers and Reference Flow SEMICON WEST Temporary Bonding Workshop July 11th, 2011 Sitaram Arkalgud / MJ Yim Copyright

More information

USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS

USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS USING MERCURY PROBES TO CHARACTERIZE USJ LAYERS James T.C. Chen and Wei Liu Four Dimensions, Inc. Hayward, CA 94545 It is well established that uniformity and dosage of drain-source ion implantation on

More information

Types of Epitaxy. Homoepitaxy. Heteroepitaxy

Types of Epitaxy. Homoepitaxy. Heteroepitaxy Epitaxy Epitaxial Growth Epitaxy means the growth of a single crystal film on top of a crystalline substrate. For most thin film applications (hard and soft coatings, optical coatings, protective coatings)

More information

Silicon, the test mass substrate of tomorrow? Jerome Degallaix The Next Detectors for Gravitational Wave Astronomy Beijing - 2015

Silicon, the test mass substrate of tomorrow? Jerome Degallaix The Next Detectors for Gravitational Wave Astronomy Beijing - 2015 Silicon, the test mass substrate of tomorrow? Jerome Degallaix The Next Detectors for Gravitational Wave Astronomy Beijing - 2015 Program of the talk... What we have now What we know about silicon What

More information

DMLS / SLM Metal 3D Printing.

DMLS / SLM Metal 3D Printing. DMLS / SLM Metal 3D Printing. An introductory design guide for our 3d printing in metal service. v2.2-8th July 2015 Pricing considerations. Part Volume. One of the biggest factors in the price for DMLS

More information

OmniBSI TM Technology Backgrounder. Embargoed News: June 22, 2009. OmniVision Technologies, Inc.

OmniBSI TM Technology Backgrounder. Embargoed News: June 22, 2009. OmniVision Technologies, Inc. OmniBSI TM Technology Backgrounder Embargoed News: June 22, 2009 OmniVision Technologies, Inc. At the heart of any digital camera lies the image sensor. The image sensor is an integrated circuit, like

More information

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz

More information

Specifying Plasma Deposited Hard Coated Optical Thin Film Filters. Alluxa Engineering Staff

Specifying Plasma Deposited Hard Coated Optical Thin Film Filters. Alluxa Engineering Staff Specifying Plasma Deposited Hard Coated Optical Thin Film Filters. Alluxa Engineering Staff December 2012 Specifying Advanced Plasma Deposited Hard Coated Optical Bandpass and Dichroic Filters. Introduction

More information

Silicon Avalanche Pixel Structures (APiX) For Coordinate Measurements

Silicon Avalanche Pixel Structures (APiX) For Coordinate Measurements Silicon Avalanche Pixel Structures (APiX) For Coordinate Measurements V.Saveliev Institute of Applied Mathematics, Russian Academy of Science on behalf of APiX Project M.G. Bagliesi (a), G. Bigongiari

More information

Glass Interposer Substrates: Fabrication, Characterization and Modeling

Glass Interposer Substrates: Fabrication, Characterization and Modeling Glass Interposer Substrates: Fabrication, Characterization and Modeling Aric B. Shorey, PhD Manager of Commercial Technology Semiconductor Glass Wafers/Corning, Incorporated 5 September 2013 Outline Glass

More information

DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015

DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 LINX BACKGROUND Linx Consulting 1. We help our clients to succeed

More information

Technology Developments Towars Silicon Photonics Integration

Technology Developments Towars Silicon Photonics Integration Technology Developments Towars Silicon Photonics Integration Marco Romagnoli Advanced Technologies for Integrated Photonics, CNIT Venezia - November 23 th, 2012 Medium short reach interconnection Example:

More information

Silicon Wafer Solar Cells

Silicon Wafer Solar Cells Silicon Wafer Solar Cells Armin Aberle Solar Energy Research Institute of Singapore (SERIS) National University of Singapore (NUS) April 2009 1 1. PV Some background Photovoltaics (PV): Direct conversion

More information

Silicon Sensors for CMS Tracker at High-Luminosity Environment - Challenges in particle detection -

Silicon Sensors for CMS Tracker at High-Luminosity Environment - Challenges in particle detection - timo.peltola@helsinki.fi Finnish Society for Natural Philosophy, Helsinki, 17 February 2015 Silicon Sensors for CMS Tracker at High-Luminosity Environment - Challenges in particle detection - Timo Peltola

More information

DOE Solar Energy Technologies Program Peer Review. Denver, Colorado April 17-19, 2007

DOE Solar Energy Technologies Program Peer Review. Denver, Colorado April 17-19, 2007 DOE Solar Energy Technologies Program Peer Review Evaluation of Nanocrystalline Silicon Thin Film by Near-Field Scanning Optical Microscopy AAT-2-31605-05 Magnus Wagener and George Rozgonyi North Carolina

More information

Results Overview Wafer Edge Film Removal using Laser

Results Overview Wafer Edge Film Removal using Laser Results Overview Wafer Edge Film Removal using Laser LEC- 300: Laser Edge Cleaning Process Apex Beam Top Beam Exhaust Flow Top Beam Scanning Top & Top Bevel Apex Beam Scanning Top Bevel, Apex, & Bo+om

More information

Sapphire Business Overview & GT Material Characterization Study: Impact of Sapphire Material on LED Wafering

Sapphire Business Overview & GT Material Characterization Study: Impact of Sapphire Material on LED Wafering Sapphire Business Overview & GT Material Characterization Study: Impact of Sapphire Material on LED Wafering Forward Looking Statement This presentation contains information about management s future expectations,

More information

Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look

Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look Gérard MATHERON MIDIS MINATEC 24 avril 2009 1 Advanced Wafer Manufacturing Challenges Advanced Wafer Manufacturing Challenges

More information

PCN Structure FY 13/14

PCN Structure FY 13/14 PCN Structure FY 13/14 A PCN FY 13/14 PCN text FY 13/14 QMS FY 12/14 Front End Materials A0101 Process Wafers CZ 150 mm CQT A0102 Process Wafers CZ 200 mm CQT A0103 Process Wafers FZ 150 mm CQT A0104 Process

More information

Durable, Front Surface Hard Optical Coatings for Replacing Laminated Soft Coatings. Alluxa Engineering Staff

Durable, Front Surface Hard Optical Coatings for Replacing Laminated Soft Coatings. Alluxa Engineering Staff Durable, Front Surface Hard Optical Coatings for Replacing Laminated Soft Coatings Alluxa Engineering Staff May 3, 2012 Alluxa s proprietary high speed plasma deposition technology for the first time delivers

More information

MARTENSITIC STAINLESS STEEL RWL-34

MARTENSITIC STAINLESS STEEL RWL-34 MARTENSITIC STAINLESS STEEL RWL-34 RWL 34 is a Rapid Solidified Powder (RSP) Martensitic Stainless Steel, which is variation of the 420 martensitic stainless steel family with minimum 13 percent chromium

More information

Flex Circuit Design and Manufacture.

Flex Circuit Design and Manufacture. Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit

More information

To meet the requirements of demanding new

To meet the requirements of demanding new Optimising LED manufacturing LED manufacturers seek new methods to reduce manufacturing costs and improve productivity in an increasingly demanding market. Tom Pierson, Ranju Arya, Columbine Robinson of

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

NANO INDENTERS FROM MICRO STAR TECHNOLOGIES

NANO INDENTERS FROM MICRO STAR TECHNOLOGIES NANO INDENTERS FROM MICRO STAR TECHNOLOGIES Micro Star makes a variety of nano indenters following defined standards or custom requested geometries and dimensions. Micro Star calibration laboratory complies

More information

Sputtered AlN Thin Films on Si and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties

Sputtered AlN Thin Films on Si and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties Sputtered AlN Thin Films on and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties S. Mishin, D. R. Marx and B. Sylvia, Advanced Modular Sputtering,

More information

Wafer Thickness TTV Bow and Warp for Thin Wafer Application For SEMATECH Workshop on 3D Interconnect Metrology July 11, 2012.

Wafer Thickness TTV Bow and Warp for Thin Wafer Application For SEMATECH Workshop on 3D Interconnect Metrology July 11, 2012. Wafer Thickness TTV Bow and Warp for Thin Wafer Application For SEMATECH Workshop on 3D Interconnect Metrology July 11, 2012 by Thomas Bristow 1 MPT1000 Wafer Measurement System Comprehensive Non-contact

More information

Composants actifs ultra rapides pour les composants et interconnexions optiques intégrées

Composants actifs ultra rapides pour les composants et interconnexions optiques intégrées Composants actifs ultra rapides pour les composants et interconnexions optiques intégrées Jean-Marc Fedeli CEA,LETI, MinatecCampus, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France Contact: jean-marc.fedeli@cea.fr

More information

Advanced VLSI Design CMOS Processing Technology

Advanced VLSI Design CMOS Processing Technology Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies

More information

Four-Point Probe Operation

Four-Point Probe Operation Four-Point Probe Operation Kevin Bautista Thin Film Deposition April 30, 2004 THE UNIVERSITY OF TEXAS AT DALLAS ERIK JONSSON SCHOOL OF ENGINEERING DOCUMENT NUMBER: SP2004-TF-005 EDITION: 1.0 PAGE: 1 of

More information

Process Development of High-k Metal Gate Aluminum CMP at 28nm Technology Node

Process Development of High-k Metal Gate Aluminum CMP at 28nm Technology Node Process Development of High-k Metal Gate Aluminum CMP at 28nm Technology Node UMC/ ATD_AM / CMP Department Y. H. Hsieh, H. K. Hsu, R. P. Huang, C. H. Chen, T. C. Tsai, Welch Lin, C. L. Yang and J. Y. Wu

More information

The Study of the Bonding Energy on Silicon-to-Glass Wafer Bonding. T.-K. Chuang, A. Usenko, and J. S. Cites

The Study of the Bonding Energy on Silicon-to-Glass Wafer Bonding. T.-K. Chuang, A. Usenko, and J. S. Cites 10.1149/1.3483541 The Electrochemical Society The Study of the Bonding Energy on Silicon-to-Glass Wafer Bonding T.-K. Chuang, A. Usenko, and J. S. Cites Science & Technology, Corning Incorporated, Corning,

More information

Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process

Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process Lynne Michaelson, Krystal Munoz, Jonathan C. Wang, Y.A. Xi*, Tom Tyson, Anthony Gallegos Technic Inc.,

More information

Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator

Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator Kenji MAWATARI, Koich SAMESHIMA, Mitsuyoshi MIYAI, Shinya MATSUDA Abstract We developed a new inkjet head by applying MEMS

More information

Performance of Silicon N-in-P Pixel Detectors Irradiated up to 5 1015 neq /cm2 for Future ATLAS Upgrades

Performance of Silicon N-in-P Pixel Detectors Irradiated up to 5 1015 neq /cm2 for Future ATLAS Upgrades Performance of Silicon N-in-P Pixel Detectors Irradiated up to 5 1 neq /cm for Future ATLAS Upgrades Philipp Weigell1 Ch. A. La Rosa3, A. Macchiolo1, R. Nisius1, H. Pernegger3, R.H. Richter Gallrapp3,

More information

Bending, Forming and Flexing Printed Circuits

Bending, Forming and Flexing Printed Circuits Bending, Forming and Flexing Printed Circuits John Coonrod Rogers Corporation Introduction: In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed

More information

Optical Quality Control for Industry: Applicable in Laboratory up to Inline-Inspection. Dr. Josef Frohn NanoFocus AG Oberhausen, Ettlingen

Optical Quality Control for Industry: Applicable in Laboratory up to Inline-Inspection. Dr. Josef Frohn NanoFocus AG Oberhausen, Ettlingen Optical Quality Control for Industry: Applicable in Laboratory up to Inline-Inspection Dr. Josef Frohn NanoFocus AG Oberhausen, Ettlingen 1 NanoFocus AG founded in 1994 optical surface inspection: development

More information

ECP Embedded Component Packaging Technology

ECP Embedded Component Packaging Technology ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous

More information

10Spec TM 10 Degree Specular Reflectance Accessory

10Spec TM 10 Degree Specular Reflectance Accessory Installation and User Guide 10Spec TM 10 Degree Specular Reflectance Accessory The information in this publication is provided for reference only. All information contained in this publication is believed

More information

Fraunhofer IZM-ASSID Targets

Fraunhofer IZM-ASSID Targets FRAUNHOFER INSTITUTE FoR Reliability and MiCroinTegration IZM Fraunhofer IZM ASSID All Silicon System Integration Dresden All Silicon System Integration Dresden Fraunhofer IZM-ASSID Fraunhofer IZM The

More information

Single Sided Wet Etching for Texturing, Thinning, and Packaging Applications

Single Sided Wet Etching for Texturing, Thinning, and Packaging Applications Single Sided Wet Etching for Texturing, Thinning, and Packaging Applications Ricardo I. Fuentes, Ph.D. Materials and Technologies Corp., (MATECH) Wappingers Falls, NY 12590 To Be Presented at IWLPC Conference,

More information

Residential Glass Heat-Treatment. Guidelines GENERAL OVERVIEW

Residential Glass Heat-Treatment. Guidelines GENERAL OVERVIEW Residential Glass Guidelines S e c t i o n 1 GENERAL OVERVIEW 1.1 Because of the improved solar performance characteristics of Guardian s Residential Low-E coatings, furnace operations (including setup

More information

Masters for micro- and nanostructure replication by

Masters for micro- and nanostructure replication by Masters for micro- and nanostructure replication by Diplomvej 381 DK-2800 Kongens Lyngby Denmark www.nilt.com CVR: DK 29310203 Contact: Phone: +45 3111 1797 Email: contact@nilt.com Background More than

More information

Soitec. Eric Guiot, Manager R&D Soitec. 7 mars 2011 JSIam 2011

Soitec. Eric Guiot, Manager R&D Soitec. 7 mars 2011 JSIam 2011 Soitec Eric Guiot, Manager R&D Soitec 1 Agenda Soitec: company presentation Applications and market PhDs at Soitec 2 Mission Statement Supply innovative materials and technologies for the electronics and

More information

Material data sheet. EOS Aluminium AlSi10Mg. Description

Material data sheet. EOS Aluminium AlSi10Mg. Description EOS Aluminium AlSi10Mg EOS Aluminium AlSi10Mg is an aluminium alloy in fine powder form which has been specially optimised for processing on EOSINT M systems This document provides information and data

More information

Photonic components for signal routing in optical networks on chip

Photonic components for signal routing in optical networks on chip 15 th International Conference on Transparent Optical Networks Cartagena, Spain, June 23-27, 213 Photonic components for signal routing in optical networks on chip Vincenzo Petruzzelli, Giovanna Calò Dipartimento

More information

Grade C Si Mn Cr Mo V RWL34 1,05 0,50 0, ,2

Grade C Si Mn Cr Mo V RWL34 1,05 0,50 0, ,2 Martensitic stainless RWL 34 Damasteel s martensitic stainless RWL 34 is a Rapid Solidified Powder (RSP) based steel which is a variation of the 420 martensitic stainless steel with > 13 % Chromium. The

More information

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages

A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level

More information

Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation

Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation Mat. Res. Soc. Symp. Proc. Vol. 681E 2001 Materials Research Society Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation J. Bagdahn

More information

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com

More information

Module - 01 Lecture - 23 The Diffusion Equation

Module - 01 Lecture - 23 The Diffusion Equation Electronic Materials Devices and Fabrication Layering: Thermal Oxidation Dr. S. Parasuraman Department of Metallurgical and Materials Engineering Indian Institute of Technology, Madras Module - 01 Lecture

More information

Advanced materials & solutions for high h temperatures

Advanced materials & solutions for high h temperatures 2010 Advanced materials & solutions for high h temperatures t Mission To engineer innovative solutions for our customers High temperature Corrosion Mechanical wear 2010 From material to engineering solutions

More information

Electronics Field-effect transistors

Electronics Field-effect transistors Electronics Field-effect transistors Prof. Márta Rencz, Gergely Nagy BME DED October 7, 2013 The basics of field-effect transistors The operation of field-effect transistors is based on ability of controlling

More information

CHAPTER IV DEVICE TECHNOLOGY

CHAPTER IV DEVICE TECHNOLOGY CHAPTER IV DEVICE TECHNOLOGY In this work, we fabricated diodes and transistors, conventional and the ones having universal contact adopting identical processes. The voltage rating of these devices is

More information

Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices. Max Lu, Deputy Director, SPIL

Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices. Max Lu, Deputy Director, SPIL Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices Max Lu, Deputy Director, SPIL 2 Outline Market Trend & Industry Benchmark KEY Innovative Package Solutions Molded WLCSP Fan-Out

More information

Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications

Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications Janet E. Semmens Sonoscan, Inc. 2149 E. Pratt Boulevard Elk Grove Village, IL 60007 USA Phone: (847)

More information

Recent developments in high bandwidth optical interconnects. Brian Corbett. www.tyndall.ie

Recent developments in high bandwidth optical interconnects. Brian Corbett. www.tyndall.ie Recent developments in high bandwidth optical interconnects Brian Corbett Outline Introduction to photonics for interconnections Polymeric waveguides and the Firefly project Silicon on insulator (SOI)

More information

Silicon Drift Detector Product Brochure Update 2013

Silicon Drift Detector Product Brochure Update 2013 Silicon Drift Detector Product Brochure Update 2013 Content Classic Silicon Drift Detector High Resolution Silicon Drift Detector Multielement Silicon Detector Extra Large Detector Series July 2013 About

More information

Major LED manufacturing trends and challenges to support the general lighting application

Major LED manufacturing trends and challenges to support the general lighting application Major LED manufacturing trends and challenges to support the general lighting application Semicon Russia 2011, June 1st! Ralph Zoberbier Director Product Management Aligner Content" 1. SUSS MicroTec Introduction

More information

Biaxial tripod MEMS mirror and omnidirectional lens for a low cost wide angle laser range sensor

Biaxial tripod MEMS mirror and omnidirectional lens for a low cost wide angle laser range sensor Biaxial tripod MEMS mirror and omnidirectional lens for a low cost wide angle laser range sensor U. Hofmann, Fraunhofer ISIT Itzehoe M. Aikio, VTT Finland Abstract Low cost laser scanners for environment

More information

Product Innovations 2014/2. A Company of the SWAROVSKI Group www.tyrolit.com

Product Innovations 2014/2. A Company of the SWAROVSKI Group www.tyrolit.com Product Innovations 2014/2 A Company of the SWAROVSKI Group www.tyrolit.com Contents 2 Contents PREMIUM Cerabond System 4 PREMIUM Longlife für Steel 6 premium Deep Cut Protection 7 From a good idea to

More information

Molybdenum Etchants Study Surajit Sutar University of Notre Dame

Molybdenum Etchants Study Surajit Sutar University of Notre Dame The purpose of this Molybdenum etching study is to find a Molybdenum metallization process without involving a Lift-Off. Molybdenum, a refractory metal, when evaporated by an E-beam, causes a significant

More information

Mounting Instructions for SP4 Power Modules

Mounting Instructions for SP4 Power Modules Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the

More information

SEMI Equipment and Materials Outlook. Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California

SEMI Equipment and Materials Outlook. Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California SEMI Equipment and Materials Outlook Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California Wednesday March 18, 2015 Outline o Fab Investments and Equipment Spending

More information

INSTRUCTIONS FOR COORDINATION SECTION 06651 SOLID SURFACE FABRICATIONS

INSTRUCTIONS FOR COORDINATION SECTION 06651 SOLID SURFACE FABRICATIONS INSTRUCTIONS FOR COORDINATION SECTION 06651 SOLID SURFACE FABRICATIONS 1. Paragraph 1.02 Provide solid surface countertops at sinks locations. Provide solid surface window sills at drywall framing walls.

More information

30. Hofer Vliesstofftage 2015

30. Hofer Vliesstofftage 2015 30. Hofer Vliesstofftage 2015 Advanced polymer film inspection systems for process analysis and yield optimization full integration into the production Presented by: Dr. Michael Kohlert Mondi Gronau GmbH

More information

h e l p s y o u C O N T R O L

h e l p s y o u C O N T R O L contamination analysis for compound semiconductors ANALYTICAL SERVICES B u r i e d d e f e c t s, E v a n s A n a l y t i c a l g r o u p h e l p s y o u C O N T R O L C O N T A M I N A T I O N Contamination

More information

EXTRUDED SEALS. 50m coil Material = EPDM. Width (A) = 14.3 mm Seal depth (B) = 16 mm Base width (C) = 15.3 mm EXTRUDED SEALS

EXTRUDED SEALS. 50m coil Material = EPDM. Width (A) = 14.3 mm Seal depth (B) = 16 mm Base width (C) = 15.3 mm EXTRUDED SEALS e31 4767/001 Sponge strip Width (A) = 18 mm Seal depth (B) = 17 mm Base width (C) = 11.5 mm 6318/001 Self adhesive sponge strip Width (A) = 14.3 mm Seal depth (B) = 16 mm Base width (C) = 15.3 mm 5590/0133

More information

Scanning Surface Inspection System with Defect-review SEM and Analysis System Solutions

Scanning Surface Inspection System with Defect-review SEM and Analysis System Solutions Scanning Surface Inspection System with -review SEM and Analysis System Solutions 78 Scanning Surface Inspection System with -review SEM and Analysis System Solutions Hideo Ota Masayuki Hachiya Yoji Ichiyasu

More information

Thin Film Solar Cells based on CIS

Thin Film Solar Cells based on CIS Thin Film Solar Cells based on CIS Research for production of cheap and efficient solar modules Marika Edoff, Ångström Solar Center, Uppsala University, Sweden Email: Marika.Edoff@angstrom.uu.se 1 partners

More information

FIB-TEM sample preparation by in-situ lift-out technique

FIB-TEM sample preparation by in-situ lift-out technique FIB-TEM sample preparation by in-situ lift-out technique Harry Roberts and Bert Otterloo Philips Semiconductors, PMO department Contents Philips Semiconductors Nijmegen PMO Why do we need fast and flexible

More information

Rapid Prototyping and Development of Microfluidic and BioMEMS Devices

Rapid Prototyping and Development of Microfluidic and BioMEMS Devices Rapid Prototyping and Development of Microfluidic and BioMEMS Devices J. Sasserath and D. Fries Intelligent Micro Patterning System Solutions, LLC St. Petersburg, Florida (T) 727-522-0334 (F) 727-522-3896

More information

WELDED PIPES. str. H Z INCH GAS SCH. outer diameter x thickness (mm) INCH GAS SCH. outer diameter x thickness (mm)

WELDED PIPES. str. H Z INCH GAS SCH. outer diameter x thickness (mm) INCH GAS SCH. outer diameter x thickness (mm) WELDED PIPES str. H Z Welded pipes DIN 17457 / DIN 11850 / EN 10217-7 / DIN 2463 / ASTM A-312: AISI 304/L (DIN 1.4301/7) without adjustment standard length cca 6 m outside surface polished / inside surface

More information

Association of Rotational Molders

Association of Rotational Molders Association of Rotational Molders Test Method for Flowability (Dry Flow Rate) and Apparent Density (Bulk Density) Version 2.1 November 2011 Contents: Appendix A Funnel Specification Appendix B Measuring

More information