Contact materials at elevated temperatures. High Temperature Electronics
|
|
|
- Aubrie Barber
- 8 years ago
- Views:
Transcription
1 Contact materials at elevated temperatures High Temperature Electronics
2 Agenda Introduction Soft Solder Alloys Sintering HotPowCon (HPC) Summary Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 2
3 Introduction Requirements: High power density High reliability High heat Conductivity Ambient condition more than 150 C Lead Free technology Live time more than 15 years Costs Assembly of a power module Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 3
4 Soft Solder Alloys Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 4
5 SPEZIALLEGIERUNGEN FÜR WEICHLOTE Speziallegierungen für Weichlote: Innolot J. Trodler Heraeus Materials Technology CMD-AM Seite 5
6 SPEZIALLEGIERUNGEN FÜR WEICHLOTE Speziallegierungen für Weichlote: Innolot Source: Abschlusspräsentation BMBF-Projekt LIVE; Akzeptanzkriterien thermisch hochbelasteter, miniaturisierter Lötverbindungen; J. Albrecht Siemens AG, CT MM6; Berlin J. Trodler Heraeus Materials Technology CMD-AM Seite 6
7 Special Soft Solder Alloy: HT1 b) Cross section after powder production (source: Müller, NMB ) Mapping of the powder; figure b) Ag (=Ag3Sn) (source Müller, NMB, ) Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 7
8 Special Soft Solder Alloy: HT1 a) b) a) SAC + In (without modifier) and b) SAC+In+KM (source Müller, NMB, ) Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 8
9 Special Soft Solder Alloy: HT1 Cross Section with 3,75% Ag, Ag3Sn Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 9
10 Special Soft Solder Alloy: HT1 Melting Range (Liquidus and Solidus) Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 10
11 Special Soft Solder Alloy: HT1 Technology Qualification TCT 30 /10 N=500 SnAg3.5 HT1 Innolot Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 11
12 Special Soft Solder Alloy: HT1 Product Qualification TCT 30 /10 N=1500/2000/3000/4000 CS N=1500 HT1 CS N=1500 SnAg3.5 CS N=4000 HT1 Source: Dudek, Fraunhofer ENAS CS N=2000 SnAg3.5 CS N=3000 SnAg3.5 Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 12
13 Sintering Table with the most important properties Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 13
14 Sintering: Processing magic 016 Items Paste Application Paste Drying Die Placement Sintering Process Stencil printing Drying of printed sinter paste Placement of die Sintering Step Equipment convetional printing equipment Conventional Box oven Die placemer with heated substrate holder Sinter press Parameter Stainless steel or PU squeegees Print Speed mm/s Drying time 5-15 min drying temperature C Drying in air Die Placement temperature C Die Placement force min 0.03 MPa Sinter Pressure MPa Sinter Temperature 230 C-280 C Sinter time 1-2 Minutes in air Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 14
15 Sintering: Processing magic 016 with DIE size 100mm² Items Paste Application Die Placement Sintering Process Printing/Dispensing Placement of Die Sintering Step Equipment Standard equipment Standard Die placer Box Oven Standard Parameter Peak Sinter Temperature 230 C- 280 C Sinter time 240 Minutes Parameter Standard die Placement Parameter Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 15
16 Sintering Thermography Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 16
17 Diffusion Soldering HPC HotPowCon Laufzeit FKZ 13N11510 Coordination: Robert Bosch GmbH Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 17
18 Diffusion Soldering HPC Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 18
19 Diffusion Soldering HPC Investigation of thermo/mechanical reliability by experiment and simulation, source: Fraunhofer ENAS Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 19
20 Diffusion Soldering HPC Combination of thermal solidification and isothermal solidification could be the basis for a new quality of interconnection Phase diagram of a two element system Creating of intermetallic with Cu in a SnCu system. (Source: Fraunhofer IZM) Structure design through high melting intermetallic by using soft solder alloys based on solder paste soft solder alloy will be used based on Sn with a high metal concentration and additives Isothermal solidification at low/standard solder temperatures operation temperature higher than liquidus temperature after soldering Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany /
21 Diffusion Soldering HPC IGBT on DCB with SnCu solder paste (type 6) produced with a 20µm stencil IGBT on DCB with SnCu solder paste (type 6) and Cu powder produced with a 20µm stencil Combination of thermal solidification and isothermal solidification could be the basis for a new quality of interconnection Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 21
22 Diffusion Soldering HPC Materials WP1 Workpackage and Milestones M1 describes a combination of materials as well as the realization of that combination based on a lab application M2 has fixed the processes including a qualification of test equipment. Test & Simulation Design Process WP2 WP3 Application WP4 Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 22
23 Diffusion Soldering HPC Results DMA Changing of length [ratio] 0,25 0,2 0,15 0,1 0,05 0-0, Temperatur [ C] Changing of length [ratio] 0,25 0,2 0,15 0,1 0, ,05 Temperatur [ C] DMA with Cu particles Q1and SnCu reference, after soldering. There is no difference between Ref. and Paste with Copper in this Q1 quality. DMA with Cu particles Q2and SnCu reference, after soldering the temperature to melt again is more than 400 C. Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 23
24 Summary FEM: By the local damage-parameter D (read area 0,96 < D < 1 = delaminated) it shows a delamination at the corner of the Die. Means the delamination starts at app. -35 C. Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany / Seite 24
25 Summary Soft Solder Alloys up to 175 C depends on the assembly concept Sintering already use for industry applications, different project for optimization (minimization) process temperature and pressure Government founded project: HotPowCon (HPC) as alternative for higher operation temperature > 300 C in project progress Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany /
26 Summary ~ 1000 C Sintering (process temperature 220 C) ~ 400 C HPC (process temperature 227 C + 20K) ~ 300 C High Lead solder (process temperature + 20K) ~ 220 C Lead Free solder (process temperature + 20K) Jörg Trodler/ Heraeus Materials Technology GmbH&Co.KG, Hanau, Germany /
Fraunhofer IZM Berlin
Fraunhofer IZM Berlin Advanced Packaging for High Power VCSEL Arrays Rafael Jordan, Lena Goullon, Constanze Weber, Hermann Oppermann Dr. Rafael Jordan, SIIT Fraunhofer IZM Berlin Advanced Packaging for
Thermodynamic database of the phase diagrams in copper base alloy systems
Journal of Physics and Chemistry of Solids 66 (2005) 256 260 www.elsevier.com/locate/jpcs Thermodynamic database of the phase diagrams in copper base alloy systems C.P. Wang a, X.J. Liu b, M. Jiang b,
Industrial Experience in the Soldering Process without Lead
Lead Free Assembling Industrial Experience in the Soldering Process without Lead Elimination of Lead in the Electronic Production Process Barcelona 27.6.2006 W. C. Heraeus GmbH, Contact Material Division
Difference Between Various Sn/Ag/Cu Solder Compositions. Almit Ltd. Tadashi Sawamura Takeo Igarashi
Difference Between Various Sn/Ag/Cu Solder Compositions Almit Ltd. Tadashi Sawamura Takeo Igarashi 29/6/2005 Table Of Contents 1. Overview 2. Mechanical Properties 3. Reliability Results 4. Conclusion
Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.
Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages Additional Information DS1 2012-03 Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon
Lead Free Reliability Testing
Lead Free Reliability Testing Reliability Implications of Lead-Free Reliability, of what? Solder Joints Laminate Solder Joint Reliability Components SAC vs. SAC main alternative alloy Comparison is desired,
Faszination Licht. Entwicklungstrends im LED Packaging. Dr. Rafael Jordan Business Development Team. Dr. Rafael Jordan, Business Development Team
Faszination Licht Entwicklungstrends im LED Packaging Dr. Rafael Jordan Business Development Team Agenda Introduction Hermetic Packaging Large Panel Packaging Failure Analysis Agenda Introduction Hermetic
LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1
LEAD FREE HALOGENFREE Würth Elektronik PCB Design Conference 2007 Lothar Weitzel 2007 Seite 1 Content Solder surfaces/overview Lead free soldering process requirements/material parameters Different base
Customer Service Note Lead Frame Package User Guidelines
Customer Service Note Lead Frame Package User Guidelines CSN30: Lead Frame Package User Guidelines Introduction Introduction When size constraints allow, the larger-pitched lead-frame-based package design
How To Calculate Thermal Resistance On A Pb (Plastipo)
VISHAY BEYSCHLAG Resistive Products 1. INTRODUCTION Thermal management is becoming more important as the density of electronic components in modern printed circuit boards (PCBs), as well as the applied
Der Einfluss thermophysikalischer Daten auf die numerische Simulation von Gießprozessen
Der Einfluss thermophysikalischer Daten auf die numerische Simulation von Gießprozessen Tagung des Arbeitskreises Thermophysik, 4. 5.3.2010 Karlsruhe, Deutschland E. Kaschnitz Österreichisches Gießerei-Institut
INFLUENCE OF THERMOMECHANICAL TREATMENT ON THE STEEL C45 FATIGUE PROPERTIES
CO-MAT-TECH 2005 TRNAVA, 20-21 October 2005 INFLUENCE OF THERMOMECHANICAL TREATMENT ON THE STEEL C45 FATIGUE PROPERTIES Jiří MALINA 1+2, Hana STANKOVÁ 1+2, Jaroslav DRNEK 3, Zbyšek NOVÝ 3, Bohuslav MAŠEK
Investigation of Components Attachment onto Low Temperature Flex Circuit
Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase
Characterization and Kinetics of the Interfacial Reactions in Solder Joints of Tin-Based Solder Alloys on Copper Substrates
Characterization and Kinetics of the Interfacial Reactions in Solder Joints of Tin-Based Solder Alloys on Copper Substrates J. C. Madeni*, S. Liu* and T. A. Siewert** *Center for Welding, Joining and Coatings
17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie
17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is
Introduction to the Plastic Ball Grid Array (PBGA)
Introduction to the Plastic Ball Grid Array (PBGA) Q1, 2008 Terry Burnette Dec. 15, 2005 Presentation Outline PBGA Introduction and Package Description PC Board Design for PBGA PBGA Assembly PBGA Solder
Laser sintering of greens compacts of MoSi 2
Laser sintering of greens compacts of MoSi 2 G. de Vasconcelos 1, R. Cesar Maia 2, C.A.A.Cairo 3, R. Riva 2, N.A.S.Rodrigues 2, F.C.L.Mello 3 Instituto de Estudos Avançados 1, Instituto Tecnológico de
Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages
APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern
Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics
Overview of Risk Assessment, Mitigation, and Management Research for Pb-free Electronics Formed 1987 Electronic Products and Systems Center College Park, MD 20742 (301) 405-5323 http://www.calce.umd.edu
Basic Properties and Application Examples of PGS Graphite Sheet
Basic Properties and Application Examples of 1. Basic properties of Graphite sheet 2. Functions of Graphite sheet 3. Application Examples Presentation [Sales Liaison] Panasonic Electronic Devices Co.,
DSP 618D (Sn/Ag/Cu) LEAD FREE NO CLEAN DISPENSING SOLDER PASTE
SN96.5/AG3.5. 888 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN96.5/AG3.5. 888 Rev DSP 618D (Sn/Ag/Cu) LEAD FREE NO CLEAN DISPENSING SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison,
Fraunhofer IZM Berlin
Fraunhofer IZM Berlin Entwicklungstrends im LED Packaging Dr. Rafael Jordan SIIT Agenda Chip on Board Gluing Soldering Sintering Transient Liquid Phase Bonding/Soldering Junction Temperature Measurements
Metal Injection Molded Parts
Metal Injection Molded Parts Metal Injection Molding (MIM) is a powder metallurgy process. he difference between MIM and conventional powder metallurgy is that in MIM, metal powder along with binders is
Bob Willis leadfreesoldering.com
Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed
Trend of Solder Alloys Development
Trend of Solder Alloys Development Dr. Ning-Cheng Lee Indium Corporation 1 Solder Is The Choice of Most Electronic Bonding For Years To Come (Indium) (Aprova) (Toleno) Property Soldering Wire Bonding Conductive
Microwave absorbing tiles:
On the basis of the results obtained from the first project activities, the grinding conditions on a larger scale were determined. As regards the sintering, an adjustment has been made to the roller furnaces
REACTIONS IN THE SN CORNER OF THE CU-SN-ZN ALLOY SYSTEM
REACTIONS IN THE SN CORNER OF THE CU-SN-ZN ALLOY SYSTEM D.D. Perovic, L Snugovsky and J.W. Rutter Department of Materials Science and Engineering University of Toronto Toronto, ON, Canada doug.perovic@utoronto.ca
Assembly of LPCC Packages AN-0001
Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)
Enhanced version of 316/316L austenitic stainless steel. Better material performance at a lower cost. Juha Kela 16.6.2014. Juha Kela / 316plus
Enhanced version of 316/316L austenitic stainless steel. Better material performance at a lower cost. Juha Kela 16.6.2014 8 July 2014 1 Lower cost 8 July 2014 2 Lower cost 316 plus is available at lower,
Taking the Pain Out of Pb-free Reflow
Taking the Pain Out of Pb-free Reflow Paul N. Houston & Brian J. Lewis Siemens Dematic Electronics Assembly Systems (770) 797-3362 Presented at APEX 2003, Anaheim CA Daniel F. Baldwin Engent, Inc. Norcross,
Journal bearings/sliding bearings
Journal bearings/sliding bearings Operating conditions: Advantages: - Vibration damping, impact damping, noise damping - not sensitive for vibrations, low operating noise level - dust tight (if lubricated
PRODUCT PROFILE. ELECTROLOY in partnership with FCT Asia Pte Limited. in manufacturing. Nihon Superior Lead Free Solder Bar.
PRODUCT PROFILE ELECTROLOY in partnership with FCT Asia Pte Limited in manufacturing Nihon Superior Lead Free Solder Bar SN100C Product Name Product Code LEAD FREE BAR LEAD FREE BAR ( TOP UP ALLOY ) SN100C
Comparative Wetting Ability of Lead-Free Alloys
Comparative Wetting Ability of Lead-Free Alloys Understanding the wetting kinetics of lead-free alloys becomes crucial in selecting a suitable lead-free composition for assembling PCBs. KaiHwa Chew, Vincent
Maßgeschneiderte Stähle und Technologien für überlegene Produkte
Wir bringen unsere Kunden _einen Schritt weiter durch Technologie, Innovation und Nachhaltigkeit. Maßgeschneiderte Stähle und Technologien für überlegene Produkte Custom steel grades and technologies for
Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering
Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Dipl.-Ing. Helmut Leicht; Andreas Thumm IBL-Löttechnik GmbH www.ibl-loettechnik.de, Germany ABSTRACT In the beginning
Good Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
DSP 800LF (Sn100E) LEAD FREE NO CLEAN SOLDER PASTE
SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev DSP 800LF (Sn100E) LEAD FREE NO CLEAN SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 60101! 630-628-8083!
Thermal Simulation of a Power Electronics Cold Plate with a Parametric Design Study
EVS28 KINTEX, Korea, May 3-6, 2015 Thermal Simulation of a Power Electronics Cold Plate with a Parametric Design Study Boris Marovic Mentor Graphics (Deutschland) GmbH, Germany, boris_marovic@mentor.com
How to manage wave solder alloy contaminations. Gerjan Diepstraten & Harry Trip Cobar Europe BV Balver Zinn
How to manage wave solder alloy contaminations Gerjan Diepstraten & Harry Trip Cobar Europe BV Balver Zinn Content SnPb solder and impurities Lead-free solder change Pb contaminations in lead-free Measure
THE IMPACT OF YIELD STRENGTH OF THE INTERCONNECTOR ON THE INTERNAL STRESS OF THE SOLAR CELL WITHIN A MODULE
5th World Conference on Photovoltaic Energy Conversion, 6-1 September 21, Valencia, Spain THE IMPACT OF YIELD STRENGTH OF THE INTERCONNECTOR ON THE INTERNAL STRESS OF THE SOLAR CELL WITHIN A MODULE Y.
Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints
Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints Y. Zheng, C. Hillman, P. McCluskey CALCE Electronic Products and Systems Center A. James Clark School of Engineering
Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies
Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Table of Contents Page Method...2 Thermal characteristics of SMDs...2 Adhesives...4 Solder pastes...4 Reflow profiles...4 Rework...6
Thermische Speicherung von Solarenergie
Thermische Speicherung von Solarenergie Dr. Thomas Bauer Institut für Technische Thermodynamik Stuttgart, Köln 15. Kölner Sonnenkolloquium, 12.6.2012 www.dlr.de/tt Slide 2 > 15. Kölner Sonnenkolloquium
Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA. CTB Hybrids WG ESTEC-22nd May 2007
Evaluation of Soft Soldering on Aluminium Nitride (AlN) ESTEC Contract No. 19220/05/NL/PA CTB Hybrids WG ESTEC-22nd May 2007 Evaluation of Soft Soldering on AlN Schedule Project presentation Feasibility
DSP 792 (Sn96.5/Ag3.5) LEAD FREE WATER SOLUBLE SOLDER PASTE
SN96.5/AG3.5. 792 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN96.5/AG3.5. 792 Rev DSP 792 (Sn96.5/Ag3.5) LEAD FREE WATER SOLUBLE SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison,
BAM-P125 Material: Flat Membrane
Federal Institute for Materials Research and Testing CERTIFIED REFERENCE MATERIAL FOR MERCURY INTRUSION BAM-P125 Material: Flat Membrane Certified properties 250 Mercury intrusion curve between 0.12 MPa
Motivation: Environmental and health endangerment of lead
1 25 March, 2015 Agenda Motivation: Environmental and health endangerment of lead Situation: Lead & the use in Electronics Status on legislation DA5 Structure and Project: Cooperations and partners Requirements,
Lead-Free Rework Optimization Project
Lead-Free Rework Optimization Project Project Co-Chairs: Jasbir Bath, Flextronics International Craig Hamilton, Celestica IPC APEX 2008 Background Reliability tests in the previous inemi lead-free assembly
LOGO. Modeling and Simulation of Microstructural Changes in Composite Sn-Ag-Cu Solder Alloys with Cu Nanoparticles
Modeling and Simulation of Microstructural Changes in Composite Sn-Ag-Cu Solder Alloys with Cu Nanoparticles Yuanyuan Guan, A.Durga, Nele Moelans Dept. Metallurgy and Materials Engineering, K.U. Leuven,
Advanced Technologies and Equipment for 3D-Packaging
Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling
Development of Metal Injection Molding Process for Aircraft Engine Part Production
Development of Metal Injection Molding Process for Aircraft Engine Part Production IKEDA Shuji : Manager, Engine Technology Department, Research & Engineering Division, Aero-Engine & Space Operations SATOH
DSP 215D (Sn/Ag/Cu) LEAD FREE RMA DISPENSING SOLDER PASTE
SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev DSP 215D (Sn/Ag/Cu) LEAD FREE RMA DISPENSING SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 60101!
Small Form- Factor Pluggable (SFP) DWDM
Small Form- Factor Pluggable (SFP) DWDM Application Specification (Dense Wavelength Division Multiplexer) 114-13178 Connector and Cage Assembly 02 MAY 11 Rev F NOTE i All numerical values are in metric
DSP 691A (Sn/Ag/Cu) LEAD FREE NO CLEAN SOLDER PASTE
SN/AG/CU. 862 Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS SN/AG/CU. 862 Rev DSP 691A (Sn/Ag/Cu) LEAD FREE NO CLEAN SOLDER PASTE CORPORATE HEADQUARTERS USA: 315 Fairbank St. Addison, IL 60101! 630-628-8083!
Webinar: HDI 2 Perfection in HDI Optimal use of the HDI technology Würth Elektronik Circuit Board Technology
Webinar: HDI 2 Perfection in HDI Optimal use of the HDI technology Würth Elektronik Circuit Board Technology www.we-online.de Seite 1 04.09.2013 Agenda Overview Webinar HDI 1 Route out a BGA Costs Roadmap
The atomic packing factor is defined as the ratio of sphere volume to the total unit cell volume, or APF = V S V C. = 2(sphere volume) = 2 = V C = 4R
3.5 Show that the atomic packing factor for BCC is 0.68. The atomic packing factor is defined as the ratio of sphere volume to the total unit cell volume, or APF = V S V C Since there are two spheres associated
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council AP EX and Designers Summit 05 Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
NetShape - MIM. Metal Injection Molding Design Guide. NetShape Technologies - MIM Phone: 440-248-5456 31005 Solon Road FAX: 440-248-5807
Metal Injection Molding Design Guide NetShape Technologies - MIM Phone: 440-248-5456 31005 Solon Road FAX: 440-248-5807 Solon, OH 44139 solutions@netshapetech.com 1 Frequently Asked Questions Page What
RoHS-Compliant Through-Hole VI Chip Soldering Recommendations
APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead
Technological advancements in Lead-free Wafer Bumping using Stencil Printing Technology
Technological advancements in Lead-free Wafer Bumping using Stencil Printing Technology D. Manessis, R. Patzelt, A. Ostmann *, R. Aschenbrenner *, H. Reichl * Technical University of Berlin, Microperipheric
DSP 798LF (Sn/Ag/Cu) LEAD FREE WATER SOLUBLE SOLDER PASTE
LF217. 798LF Rev.A TECHNICAL DATA SHEET TECHNICAL SPECIFICATIONS Sn/Ag/Cu, 798LF, Rev. H, 10/15 LF217. 798LF Rev DSP 798LF (Sn/Ag/Cu) LEAD FREE WATER SOLUBLE SOLDER PASTE CORPORATE HEADQUARTERS USA: 315
14-11-2014. Done in a Flash! Photonic sintering for printed electronics. Guy Bex, TNO/Holst Centre
Done in a Flash! Photonic sintering for printed electronics Guy Bex, TNO/Holst Centre 1 Introduction Presentation overview Sintering principle Photonic flash sintering Way of working Curing Summary and
Printed Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production
Automotive Application Questionnaire for Electronic Control Units and Sensors. Electronic Components and Systems
Automotive Application Questionnaire for Electronic Control Units and Sensors Electronic Components and Systems Automotive Application Questionnaire for Electronic Control Units and Sensors Published by:
PCB Quality Inspection. Student Manual
PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the
Effects of Alloying in Near-Eutectic Tin Silver Copper Solder Joints
Materials Transactions, Vol. 43, No. 8 (2002) pp. 1827 to 1832 Special Issue on Lead-Free Electronics Packaging c 2002 The Japan Institute of Metals Effects of Alloying in Near-Eutectic Tin Silver Copper
INTERNATIONAL STANDARD
INTERNATIONAL STANDARD IEC 61190-1-3 Second edition 2007-04 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders
Electronic Board Assembly
Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -
Fraunhofer IZM-ASSID Targets
FRAUNHOFER INSTITUTE FoR Reliability and MiCroinTegration IZM Fraunhofer IZM ASSID All Silicon System Integration Dresden All Silicon System Integration Dresden Fraunhofer IZM-ASSID Fraunhofer IZM The
MICROALLOYED Sn-Cu Pb-FREE SOLDER FOR HIGH TEMPERATURE APPLICATIONS
MICROALLOYED Sn-Cu Pb-FREE SOLDER FOR HIGH TEMPERATURE APPLICATIONS Keith Howell 1, Keith Sweatman 1, Motonori Miyaoka 1, Takatoshi Nishimura 1, Xuan Quy Tran 2, Stuart McDonald 2, and Kazuhiro Nogita
In-mold Labeling Micro Powder Injection Molding: Large Scale Production of Micro Structured Two-component Parts
In-mold Labeling Micro Powder Injection Molding: Large Scale Production of Micro Structured Two-component Parts E.Honza, V.Piotter, K.Plewa Karlsruhe Institute of Technology (KIT) elvira.honza@kit.edu
DirectFET TM - A Proprietary New Source Mounted Power Package for Board Mounted Power
TM - A Proprietary New Source Mounted Power Package for Board Mounted Power by Andrew Sawle, Martin Standing, Tim Sammon & Arthur Woodworth nternational Rectifier, Oxted, Surrey. England Abstract This
Thermal diffusivity and conductivity - an introduction to theory and practice
Thermal diffusivity and conductivity - an introduction to theory and practice Utrecht, 02 October 2014 Dr. Hans-W. Marx Linseis Messgeräte GmbH Vielitzer Str. 43 D-95100 Selb / GERMANY www.linseis.com
Chapter Outline: Phase Transformations in Metals
Chapter Outline: Phase Transformations in Metals Heat Treatment (time and temperature) Microstructure Mechanical Properties Kinetics of phase transformations Multiphase Transformations Phase transformations
THE COMPARISON OF THE PERFORMANCE FOR THE ALLOY FUEL AND THE INTER-METALLIC DISPERSION FUEL BY THE MACSIS-H AND THE DIMAC
THE COMPARISON OF THE PERFORMANCE FOR THE ALLOY FUEL AND THE INTER-METALLIC DISPERSION FUEL BY THE MACSIS-H AND THE DIMAC Byoung-Oon Lee, Bong-S. Lee and Won-S. Park Korea Atomic Energy Research Institute
Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly
Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly Our thanks to Indium Corporation for allowing us to reprint the following article. By Brook Sandy and Ronald C. Lasky, PhD, PE., Indium Corporation
PROCESS OF COOLING INJECTION MOULD AND QUALITY OF INJECTION PARTS
1. LUBOŠ BĚHÁLEK, 2. JOZEF DOBRÁNSKY PROCESS OF COOLING INJECTION MOULD AND QUALITY OF INJECTION PARTS Abstract: Injection mould cooling to an important way influences both technology and economy of production
Process Parameters Optimization for Friction Stir Welding of Pure Aluminium to Brass (CuZn30) using Taguchi Technique
MATEC Web of Conferences43, 03005 ( 016) DOI: 10.1051/ matecconf/ 016 4303005 C Owned by the authors, published by EDP Sciences, 016 Process Parameters Optimization for Friction Stir Welding of Pure Aluminium
Impact of Materials Prices on Cost of PV Manufacture Part I (Crystalline Silicon)
Impact of Materials Prices on Cost of PV Manufacture Part I (Crystalline Silicon) Nigel Mason SMEET II Workshop, London 27 Feb 2013 content Brief introduction to Solar PV Technologies Part I - Crystalline
Excerpt Direct Bonded Copper
xcerpt irect Bonded Copper Presented by ouglas C. Hopkins, Ph.. 312 Bonner Hall University at Buffalo Buffalo, Y 14620-1900 607-729-9949, fax: 607-729-7129 Authors thank Curamik lectronics A member of
8755 W. Higgins Road Suite 500 Chicago, Illinois USA 60631. June 11, 2015. To whom it may concern:
8755 W. Higgins Road Suite 500 Chicago, Illinois USA 60631 June 11, 2015 To whom it may concern: This is to notify you that Littelfuse has accomplished a lead frame design enhancement for Thyristor TO218
PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices
Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily
Use of Carbon Nanoparticles for the Flexible Circuits Industry
Use of Carbon Nanoparticles for the Flexible Circuits Industry Ying (Judy) Ding, Rich Retallick MacDermid, Inc. Waterbury, Connecticut Abstract FPC (Flexible Printed Circuit) has been growing tremendously
Die Carrier Temporary Reusable Packages. Setting the Standards for Tomorrow
Die Carrier Temporary Reusable Packages Setting the Standards for Tomorrow Die Level Burn-in and Test The Need for KGD Historically, semiconductor manufacturers and endusers performed numerous tests on
Recommended Soldering Techniques for ATC 500 Series Capacitors
Recommended Soldering Techniques for ATC 500 Series Capacitors ATC# 001-884 Rev. D; 10/05 1.0. SCOPE. The following procedures have been successful in soldering ATC500 series capacitors to both soft and
Laser beam sintering of coatings and structures
Laser beam sintering of coatings and structures Anne- Maria Reinecke, Peter Regenfuß, Maren Nieher, Sascha Klötzer, Robby Ebert, Horst Exner Laserinstitut Mittelsachsen e.v. an der Hochschule Mittweida,
A Comparison of FC-0208 to a 0.3% Molybdenum Prealloyed Low-Alloy Powder with 0.8% Graphite
A Comparison of FC-0208 to a 0.3% Molybdenum Prealloyed Low-Alloy Powder with 0.8% Graphite Francis Hanejko Manager, Customer Applications Hoeganaes Corporation Cinnaminson, NJ 08077 Abstract Iron copper
SiP & Embedded Passives ADEPT-SiP Project
System-in-Package () and the ADEPT- Project David Pedder TWI Ltd, Granta Park, Great Abington, Cambridge Copyright 2006 ADEPT- & Embedded Passives ADEPT- Project Objectives Programme Partners ADEPT- Architecture
ORNL Manufacturing Demonstration Facility Technical Collaboration Final Report
ORNL Manufacturing Demonstration Facility Technical Collaboration Final Report Using Direct Metal Deposition to Fabricate Mold Plates for an Injection Mold Machine Allowing for the Evaluation of Cost Effective
Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products
Wurth Electronics Midcom Policy Statement on RoHS Compliance And Lead-Free Products General Environmental Policy Wurth Electronics Midcom is committed to the manufacture of environmentally-friendly products
Mg 2 FeH 6 -BASED NANOCOMPOSITES WITH HIGH CAPACITY OF HYDROGEN STORAGE PROCESSED BY REACTIVE MILLING
Mg 2 FeH 6 -BASED NANOCOMPOSITES WITH HIGH CAPACITY OF HYDROGEN STORAGE PROCESSED BY REACTIVE MILLING A. A. C. Asselli (1)*, C. S. Kiminami (2), A. M. Jorge Jr. (2), T.T. Ishikawa (2), and W. J. Botta
Accelerometer and Gyroscope Design Guidelines
Application Note Accelerometer and Gyroscope Design Guidelines PURPOSE AND SCOPE This document provides high-level placement and layout guidelines for InvenSense MotionTracking devices. Every sensor has
Design MATERIAIS 9000 0 1960 History of Materials Science and Engineering http://www.crc4mse.org/what/mse_history.html FORÇAS TÉCNOLÓGICAS REVOLUCIONÁRIAS Têxtil Ferroviária Automotiva Computador
Novel inkjettable copper ink utilizing processing temperatures under 100 degrees C without the need of inert atmosphere
Novel inkjettable copper ink utilizing processing temperatures under 100 degrees C without the need of inert atmosphere Printed Electronics Europe April 7-8, 2009 Dresden, Germany Dr. Zvi Yaniv Applied
Lead Free Wave Soldering
China - Korea - Singapore- Malaysia - USA - Netherlands - Germany WAVE SELECTIVE REFLOW SOLDERING SOLDERING SOLDERING Lead Free Wave Soldering Ursula Marquez October 18, 23 Wave Soldering Roadmap Parameter
CHROMIUM STEEL POWDERS FOR COMPONENTS. JEANETTE LEWENHAGEN Höganäs AB, Sweden
CHROMIUM STEEL POWDERS FOR COMPONENTS JEANETTE LEWENHAGEN Höganäs AB, Sweden KEYWORDS Pre-alloyed steel powder, chromium, PM ABSTRACT Chromium as an alloying element is of great interest due to its low
ALPHA CVP-390 - NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE, EXCELLENT PIN TEST PERFORMANCE, SAC305 AND LOW AG CAPABLE.
T E C H N I C A L B U L L E T I N ALPHA CVP-390 - NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE, EXCELLENT PIN TEST PERFORMANCE, SAC305 AND LOW AG CAPABLE. DESCRIPTION ALPHA CVP-390
Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3
Polymer Termination An alternative termination material specifically designed to absorb greater levels of mechanical stress thereby reducing capacitor failures associated with mechanical cracking Mechanical
Contents and Nomenclature
DX Coils Contents and Nomenclature Nomenclature... 1 Evaporator Coil Types EN... 2 EF... 2 ER... 2 EJ... 3 EK... 3 Evaporator Construction Connections... 4 Tubing... 4 Headers... 5 Tube Supports... 5 Coil
Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples
Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples C. W. Chang 1, Q. P. Lee 1, C. E. Ho 1 1, 2, *, and C. R. Kao 1 Department of Chemical & Materials Engineering 2 Institute of Materials